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Extract from the Register of European Patents

EP About this file: EP2284869

EP2284869 - THIN FILM FORMATION DEVICE AND SEMICONDUCTOR FILM MANUFACTURING METHOD [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  29.04.2016
Database last updated on 25.09.2024
Most recent event   Tooltip19.10.2018Lapse of the patent in a contracting state
New state(s): MT
published on 21.11.2018  [2018/47]
Applicant(s)For all designated states
Mitsubishi Electric Corporation
7-3, Marunouchi 2-chome
Chiyoda-ku
Tokyo 100-8310 / JP
[N/P]
Former [2011/07]For all designated states
Mitsubishi Electric Corporation
7-3, Marunouchi 2-chome Chiyoda-ku
Tokyo 100-8310 / JP
Inventor(s)01 / TSUDA, Mutsumi
c/o Mitsubishi Electric Corporation
7-3 Marunouchi 2-chome
Chiyoda-ku
Tokyo 100-8310 / JP
02 / TAKI, Masakazu
c/o Mitsubishi Electric Corporation
7-3 Marunouchi 2-chome
Chiyoda-ku
Tokyo 100-8310 / JP
 [2015/26]
Former [2011/07]01 / TSUDA, Mutsumi
c/o Mitsubishi Electric Corporation 7-3 Marunouchi 2-chome Chiyoda-ku
Tokyo 100-8310 / JP
02 / TAKI, Masakazu
c/o Mitsubishi Electric Corporation 7-3 Marunouchi 2-chome Chiyoda-ku
Tokyo 100-8310 / JP
Representative(s)Zech, Stefan Markus, et al
Meissner Bolte Patentanwälte
Rechtsanwälte Partnerschaft mbB
Postfach 86 06 24
81633 München / DE
[N/P]
Former [2011/07]Zech, Stefan Markus, et al
Meissner, Bolte & Partner GbR Postfach 86 06 24
81633 München / DE
Application number, filing date09754576.814.05.2009
[2011/07]
WO2009JP59004
Priority number, dateJP2008013728126.05.2008         Original published format: JP 2008137281
[2011/07]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2009145068
Date:03.12.2009
Language:JA
[2009/49]
Type: A1 Application with search report 
No.:EP2284869
Date:16.02.2011
Language:EN
[2011/07]
Type: B1 Patent specification 
No.:EP2284869
Date:24.06.2015
Language:EN
[2015/26]
Type: B9 Corrected patent specification 
No.:EP2284869
Date:21.10.2015
[2015/43]
Search report(s)International search report - published on:JP03.12.2009
(Supplementary) European search report - dispatched on:EP08.01.2014
ClassificationIPC:H01L21/205, C23C16/24, C23C16/455, H01L31/04, C23C16/515, H01L31/20
[2014/47]
CPC:
H01L21/0262 (EP,US); C23C16/24 (EP,US); C23C16/45523 (EP,US);
C23C16/515 (EP,US); H01L21/02532 (EP,US); H01L31/202 (EP,US);
Y02E10/50 (US); Y02P70/50 (EP,US) (-)
Former IPC [2014/05]H01L21/205, C23C16/24, C23C16/455, H01L31/04, C23C16/515
Former IPC [2011/07]H01L21/205, C23C16/24, C23C16/455, H01L31/04
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2015/26]
Former [2011/07]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:DÜNNFILMBILDUNGSEINRICHTUNG UND HALBLEITERFILMHERSTELLUNGSVERFAHREN[2011/07]
English:THIN FILM FORMATION DEVICE AND SEMICONDUCTOR FILM MANUFACTURING METHOD[2011/07]
French:DISPOSITIF DE FORMATION DE FILM MINCE ET PROCEDE DE FABRICATION DE FILM DE SEMI-CONDUCTEUR[2011/07]
Entry into regional phase24.11.2010Translation filed 
24.11.2010National basic fee paid 
24.11.2010Search fee paid 
24.11.2010Designation fee(s) paid 
24.11.2010Examination fee paid 
Examination procedure24.11.2010Examination requested  [2011/07]
28.07.2014Amendment by applicant (claims and/or description)
27.10.2014Communication of intention to grant the patent
02.01.2015Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO
10.02.2015Communication of intention to grant the patent
13.05.2015Fee for grant paid
13.05.2015Fee for publishing/printing paid
13.05.2015Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  27.10.2014
Opposition(s)29.03.2016No opposition filed within time limit [2016/22]
Fees paidRenewal fee
30.05.2011Renewal fee patent year 03
31.05.2012Renewal fee patent year 04
29.05.2013Renewal fee patent year 05
28.03.2014Renewal fee patent year 06
12.05.2015Renewal fee patent year 07
Opt-out from the exclusive  Tooltip
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Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU14.05.2009
AT24.06.2015
BE24.06.2015
CY24.06.2015
CZ24.06.2015
DK24.06.2015
EE24.06.2015
ES24.06.2015
FI24.06.2015
HR24.06.2015
IT24.06.2015
LT24.06.2015
LV24.06.2015
MC24.06.2015
MK24.06.2015
MT24.06.2015
NL24.06.2015
PL24.06.2015
RO24.06.2015
SE24.06.2015
SI24.06.2015
SK24.06.2015
TR24.06.2015
BG24.09.2015
NO24.09.2015
GR25.09.2015
IS24.10.2015
PT26.10.2015
[2018/47]
Former [2018/29]HU14.05.2009
AT24.06.2015
BE24.06.2015
CY24.06.2015
CZ24.06.2015
DK24.06.2015
EE24.06.2015
ES24.06.2015
FI24.06.2015
HR24.06.2015
IT24.06.2015
LT24.06.2015
LV24.06.2015
MC24.06.2015
MK24.06.2015
NL24.06.2015
PL24.06.2015
RO24.06.2015
SE24.06.2015
SI24.06.2015
SK24.06.2015
TR24.06.2015
BG24.09.2015
NO24.09.2015
GR25.09.2015
IS24.10.2015
PT26.10.2015
Former [2018/28]HU14.05.2009
AT24.06.2015
BE24.06.2015
CY24.06.2015
CZ24.06.2015
DK24.06.2015
EE24.06.2015
ES24.06.2015
FI24.06.2015
HR24.06.2015
IT24.06.2015
LT24.06.2015
LV24.06.2015
MC24.06.2015
MK24.06.2015
NL24.06.2015
PL24.06.2015
RO24.06.2015
SE24.06.2015
SI24.06.2015
SK24.06.2015
BG24.09.2015
NO24.09.2015
GR25.09.2015
IS24.10.2015
PT26.10.2015
Former [2017/40]AT24.06.2015
BE24.06.2015
CZ24.06.2015
DK24.06.2015
EE24.06.2015
ES24.06.2015
FI24.06.2015
HR24.06.2015
IT24.06.2015
LT24.06.2015
LV24.06.2015
NL24.06.2015
PL24.06.2015
RO24.06.2015
SE24.06.2015
SI24.06.2015
SK24.06.2015
BG24.09.2015
NO24.09.2015
GR25.09.2015
IS24.10.2015
PT26.10.2015
Former [2017/03]AT24.06.2015
BE24.06.2015
CZ24.06.2015
DK24.06.2015
EE24.06.2015
ES24.06.2015
FI24.06.2015
HR24.06.2015
IT24.06.2015
LT24.06.2015
LV24.06.2015
PL24.06.2015
RO24.06.2015
SI24.06.2015
SK24.06.2015
BG24.09.2015
NO24.09.2015
GR25.09.2015
IS24.10.2015
PT26.10.2015
Former [2016/36]AT24.06.2015
CZ24.06.2015
DK24.06.2015
EE24.06.2015
ES24.06.2015
FI24.06.2015
HR24.06.2015
IT24.06.2015
LT24.06.2015
LV24.06.2015
PL24.06.2015
RO24.06.2015
SI24.06.2015
SK24.06.2015
BG24.09.2015
NO24.09.2015
GR25.09.2015
IS24.10.2015
PT26.10.2015
Former [2016/21]AT24.06.2015
CZ24.06.2015
DK24.06.2015
EE24.06.2015
ES24.06.2015
FI24.06.2015
HR24.06.2015
IT24.06.2015
LT24.06.2015
LV24.06.2015
PL24.06.2015
RO24.06.2015
SK24.06.2015
BG24.09.2015
NO24.09.2015
GR25.09.2015
IS24.10.2015
PT26.10.2015
Former [2016/20]AT24.06.2015
CZ24.06.2015
DK24.06.2015
EE24.06.2015
ES24.06.2015
FI24.06.2015
HR24.06.2015
LT24.06.2015
LV24.06.2015
PL24.06.2015
RO24.06.2015
SK24.06.2015
BG24.09.2015
NO24.09.2015
GR25.09.2015
IS24.10.2015
PT26.10.2015
Former [2016/11]AT24.06.2015
CZ24.06.2015
EE24.06.2015
ES24.06.2015
FI24.06.2015
HR24.06.2015
LT24.06.2015
LV24.06.2015
PL24.06.2015
RO24.06.2015
SK24.06.2015
BG24.09.2015
NO24.09.2015
GR25.09.2015
IS24.10.2015
PT26.10.2015
Former [2016/10]CZ24.06.2015
EE24.06.2015
ES24.06.2015
FI24.06.2015
HR24.06.2015
LT24.06.2015
LV24.06.2015
PL24.06.2015
RO24.06.2015
SK24.06.2015
BG24.09.2015
NO24.09.2015
GR25.09.2015
IS24.10.2015
PT26.10.2015
Former [2016/09]EE24.06.2015
FI24.06.2015
HR24.06.2015
LT24.06.2015
LV24.06.2015
BG24.09.2015
NO24.09.2015
GR25.09.2015
Former [2015/50]FI24.06.2015
HR24.06.2015
LT24.06.2015
LV24.06.2015
BG24.09.2015
NO24.09.2015
GR25.09.2015
Former [2015/49]FI24.06.2015
HR24.06.2015
LT24.06.2015
LV24.06.2015
NO24.09.2015
GR25.09.2015
Documents cited:Search[XAI]WO2008052706  (DOW CORNING [US], et al) [X] 9 * page 1, line 1 - line 19 * * page 3, line 18 - page 4, line 20 * * page 5, line 1 - page 6, line 16 * * figure 3 * [A] 1-8 [I] 10-14;
 [XAI]US5956602  (ISHIHARA SHUNICHI [JP]) [X] 9 * column 1, lines 4-7 * * column 3, line 60 - column 4, line 15 * * column 8, line 29 - column 10, line 26; figures 4,5 * * column 21, line 25 - column 22, line 20 * [A] 1-8 [I] 10-14;
 [AD]  - N. LAYADI; P. R. CABARROCAS; B. DREVILLON; I. SOLOMON, "Real-time spectroscopic ellipsometry study of the growth of amorphous and microcrystalline silicon thin films prepared by alternating silicon deposition and hydrogen plasma treatment", PHYS. REV. B, (1995), vol. 52, pages 5136 - 5143, XP000542706 [AD] 1-14 * the whole document *

DOI:   http://dx.doi.org/10.1103/PhysRevB.52.5136
International search[A]JPH08250433  (CANON KK);
 [A]JPH04372118  (CANON KK);
 [A]JPH05166733  (CANON KK)
by applicant   - N. LAYADI; P. R. CABARROCAS; B. DREVILLON; I. SOLOMON, "Real-time spectroscopic ellipsometry study of the growth of amorphous and microcrystalline silicon thin films prepared by alternating silicon deposition and hydrogen plasma treatment", PHYS. REV. B, (1995), vol. 52, pages 5136 - 5143
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.