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Extract from the Register of European Patents

EP About this file: EP2352164

EP2352164 - SOI SUBSTRATE MANUFACTURING METHOD [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  27.10.2017
Database last updated on 26.04.2025
FormerThe patent has been granted
Status updated on  18.11.2016
Most recent event   Tooltip06.03.2020Lapse of the patent in a contracting state
New state(s): TR
published on 08.04.2020  [2020/15]
Applicant(s)For all designated states
Shin-Etsu Chemical Co., Ltd.
6-1, Ohtemachi 2-chome Chiyoda-ku
Tokyo 100-0004 / JP
[2011/31]
Inventor(s)01 / AKIYAMA Shoji
c/o Advanced Functional Materials Research Center
SHIN-ETSU CHEMICAL CO. LTD.
13-1 Isobe 2-chome
Annaka-shi Gunma 379-0195 / JP
02 / ITO Atsuo
c/o SHIN-ETSU CHEMICAL CO. LTD.
6-1 Otemachi 2-chome
Chiyoda-ku
Tokyo 100-0004 / JP
 [2016/51]
Former [2011/31]01 / AKIYAMA Shoji
c/o Advanced Functional Materials Research Center SHIN-ETSU CHEMICAL CO. LTD. 13-1 Isobe 2-chome
Annaka-shi Gunma 379-0195 / JP
02 / ITO Atsuo
c/o SHIN-ETSU CHEMICAL CO. LTD. 6-1 Otemachi 2-chome Chiyoda-ku
Tokyo 100-0004 / JP
Representative(s)Weber, Jean-François, et al
Cabinet Didier Martin
Les Terrasses des Bruyères -Bâtiment C
314 C Allée des Noisetiers
69760 Limonest / FR
[N/P]
Former [2016/51]Martin, Didier Roland Valéry
Cabinet Didier Martin
50, chemin des Verrières
69260 Charbonnières-les-Bains / FR
Former [2011/31]Martin, Didier Roland Valéry
Cabinet Didier Martin 50, chemin des Verrières
69260 Charbonnières-les Bains / FR
Application number, filing date09826104.311.11.2009
[2011/31]
WO2009JP69208
Priority number, dateJP2008029028712.11.2008         Original published format: JP 2008290287
JP2009025685410.11.2009         Original published format: JP 2009256854
[2011/31]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2010055857
Date:20.05.2010
Language:JA
[2010/20]
Type: A1 Application with search report 
No.:EP2352164
Date:03.08.2011
Language:EN
[2011/31]
Type: B1 Patent specification 
No.:EP2352164
Date:21.12.2016
Language:EN
[2016/51]
Search report(s)International search report - published on:JP20.05.2010
(Supplementary) European search report - dispatched on:EP01.02.2013
ClassificationIPC:H01L21/02, H01L27/12, H01L21/762
[2013/10]
CPC:
H01L21/76254 (EP,US); H01L21/02 (KR); H10D86/00 (KR)
Former IPC [2011/31]H01L21/02, H01L27/12
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   SM,   TR [2016/51]
Former [2011/31]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  SE,  SI,  SK,  SM,  TR 
Extension statesALNot yet paid
BANot yet paid
RSNot yet paid
TitleGerman:SOI-SUBSTRATHERSTELLUNGSVERFAHREN[2011/31]
English:SOI SUBSTRATE MANUFACTURING METHOD[2011/31]
French:PROCÉDÉ DE FABRICATION D UN SUBSTRAT SOI[2011/31]
Entry into regional phase11.05.2011Translation filed 
11.05.2011National basic fee paid 
11.05.2011Search fee paid 
11.05.2011Designation fee(s) paid 
11.05.2011Examination fee paid 
Examination procedure11.05.2011Examination requested  [2011/31]
14.08.2013Amendment by applicant (claims and/or description)
15.06.2016Communication of intention to grant the patent
14.10.2016Fee for grant paid
14.10.2016Fee for publishing/printing paid
14.10.2016Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  15.06.2016
Opposition(s)22.09.2017No opposition filed within time limit [2017/48]
Fees paidRenewal fee
29.09.2011Renewal fee patent year 03
13.11.2012Renewal fee patent year 04
18.11.2013Renewal fee patent year 05
10.11.2014Renewal fee patent year 06
10.11.2015Renewal fee patent year 07
10.11.2016Renewal fee patent year 08
Opt-out from the exclusive  Tooltip
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Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU11.11.2009
AT21.12.2016
BE21.12.2016
CY21.12.2016
CZ21.12.2016
DK21.12.2016
EE21.12.2016
ES21.12.2016
FI21.12.2016
HR21.12.2016
IT21.12.2016
LT21.12.2016
LV21.12.2016
MC21.12.2016
MK21.12.2016
NL21.12.2016
PL21.12.2016
RO21.12.2016
SE21.12.2016
SI21.12.2016
SK21.12.2016
SM21.12.2016
TR21.12.2016
BG21.03.2017
NO21.03.2017
GR22.03.2017
IS21.04.2017
PT21.04.2017
[2020/15]
Former [2019/51]HU11.11.2009
AT21.12.2016
BE21.12.2016
CY21.12.2016
CZ21.12.2016
DK21.12.2016
EE21.12.2016
ES21.12.2016
FI21.12.2016
HR21.12.2016
IT21.12.2016
LT21.12.2016
LV21.12.2016
MC21.12.2016
MK21.12.2016
NL21.12.2016
PL21.12.2016
RO21.12.2016
SE21.12.2016
SI21.12.2016
SK21.12.2016
SM21.12.2016
BG21.03.2017
NO21.03.2017
GR22.03.2017
IS21.04.2017
PT21.04.2017
Former [2019/46]HU11.11.2009
AT21.12.2016
BE21.12.2016
CY21.12.2016
CZ21.12.2016
DK21.12.2016
EE21.12.2016
ES21.12.2016
FI21.12.2016
HR21.12.2016
IT21.12.2016
LT21.12.2016
LV21.12.2016
MC21.12.2016
NL21.12.2016
PL21.12.2016
RO21.12.2016
SE21.12.2016
SI21.12.2016
SK21.12.2016
SM21.12.2016
BG21.03.2017
NO21.03.2017
GR22.03.2017
IS21.04.2017
PT21.04.2017
Former [2019/31]HU11.11.2009
AT21.12.2016
BE21.12.2016
CZ21.12.2016
DK21.12.2016
EE21.12.2016
ES21.12.2016
FI21.12.2016
HR21.12.2016
IT21.12.2016
LT21.12.2016
LV21.12.2016
MC21.12.2016
NL21.12.2016
PL21.12.2016
RO21.12.2016
SE21.12.2016
SI21.12.2016
SK21.12.2016
SM21.12.2016
BG21.03.2017
NO21.03.2017
GR22.03.2017
IS21.04.2017
PT21.04.2017
Former [2018/33]AT21.12.2016
BE21.12.2016
CZ21.12.2016
DK21.12.2016
EE21.12.2016
ES21.12.2016
FI21.12.2016
HR21.12.2016
IT21.12.2016
LT21.12.2016
LV21.12.2016
MC21.12.2016
NL21.12.2016
PL21.12.2016
RO21.12.2016
SE21.12.2016
SI21.12.2016
SK21.12.2016
SM21.12.2016
BG21.03.2017
NO21.03.2017
GR22.03.2017
IS21.04.2017
PT21.04.2017
Former [2018/14]AT21.12.2016
BE21.12.2016
CZ21.12.2016
DK21.12.2016
EE21.12.2016
ES21.12.2016
FI21.12.2016
HR21.12.2016
IT21.12.2016
LT21.12.2016
LV21.12.2016
NL21.12.2016
PL21.12.2016
RO21.12.2016
SE21.12.2016
SI21.12.2016
SK21.12.2016
SM21.12.2016
BG21.03.2017
NO21.03.2017
GR22.03.2017
IS21.04.2017
PT21.04.2017
Former [2018/01]AT21.12.2016
BE21.12.2016
CZ21.12.2016
DK21.12.2016
EE21.12.2016
ES21.12.2016
FI21.12.2016
HR21.12.2016
IT21.12.2016
LT21.12.2016
LV21.12.2016
NL21.12.2016
PL21.12.2016
RO21.12.2016
SE21.12.2016
SK21.12.2016
SM21.12.2016
BG21.03.2017
NO21.03.2017
GR22.03.2017
IS21.04.2017
PT21.04.2017
Former [2017/41]AT21.12.2016
BE21.12.2016
CZ21.12.2016
EE21.12.2016
ES21.12.2016
FI21.12.2016
HR21.12.2016
IT21.12.2016
LT21.12.2016
LV21.12.2016
NL21.12.2016
PL21.12.2016
RO21.12.2016
SE21.12.2016
SK21.12.2016
SM21.12.2016
BG21.03.2017
NO21.03.2017
GR22.03.2017
IS21.04.2017
PT21.04.2017
Former [2017/35]CZ21.12.2016
EE21.12.2016
FI21.12.2016
HR21.12.2016
LT21.12.2016
LV21.12.2016
NL21.12.2016
RO21.12.2016
SE21.12.2016
NO21.03.2017
GR22.03.2017
Former [2017/31]FI21.12.2016
HR21.12.2016
LT21.12.2016
LV21.12.2016
NL21.12.2016
SE21.12.2016
NO21.03.2017
GR22.03.2017
Former [2017/28]FI21.12.2016
HR21.12.2016
LT21.12.2016
LV21.12.2016
SE21.12.2016
NO21.03.2017
GR22.03.2017
Former [2017/12]LV21.12.2016
Documents cited:Search[I]US6486008  (LEE TIEN-HSI [TW]);
 [IA]EP1482548  (SOITEC SILICON ON INSULATOR [FR]);
 [XI]EP1986218  (SHINETSU CHEMICAL CO [JP])
International search[Y]JP2001244444  (RII TEIEN SHI);
 [Y]JP2004119636  (SHARP KK);
 [Y]JP2004140266  (ISHIKAWAJIMA HARIMA HEAVY IND);
 [Y]JP2005005699  (SOITEC SILICON ON INSULATOR TECHNOLOGIES SA);
 [Y]JP2005333042  (SONY CORP);
 [Y]JP2007220900  (SHINETSU CHEMICAL CO)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.