EP2317592 - ELECTRODE MATERIAL COMPRISING SILICON AND/OR TIN PARTICLES AND PRODUCTION METHOD AND USE THEREOF [Right-click to bookmark this link] | |||
Former [2011/18] | Electrode material comprising silicon and/or tin particles and production method and use thereof | ||
[2019/02] | Status | No opposition filed within time limit Status updated on 10.04.2020 Database last updated on 03.01.2025 | |
Former | The patent has been granted Status updated on 03.05.2019 | ||
Former | Grant of patent is intended Status updated on 08.01.2019 | ||
Former | Examination is in progress Status updated on 03.03.2017 | Most recent event Tooltip | 09.07.2021 | Lapse of the patent in a contracting state New state(s): HU | published on 11.08.2021 [2021/32] | Applicant(s) | For all designated states Showa Denko K.K. 13-9, Shiba Daimon, 1-chome, Minato-ku Tokyo 105-8518 / JP | [2011/18] | Inventor(s) | 01 /
Nanba, Youichi c/o Corporate R&D Center SHOWA DENKO K.K. 5-1, Okawacho Kawasaki-ku Kawasaki-shi Kanagawa 210-0858 / JP | 02 /
Iinou, Satoshi c/o OMACHI PLANT Showa Denko K.K. 6850, Oaza Omachi Omachi-shi Nagano 398-0002 / JP | 03 /
Masuko, Tsutomu c/o OMACHI PLANT Showa Denko K.K. 6850, Oaza Omachi Omachi-shi Nagano 398-0002 / JP | [2019/23] |
Former [2011/18] | 01 /
Nanba, Youichi c/o Corporate R&D Center SHOWA DENKO K.K. 5-1, Okawacho Kawasaki-ku Kawasaki-shi Kanagawa 210-0858 / JP | ||
02 /
Iinou, Satoshi c/o OMACHI PLANT, Showa Denko K.K. 6850, Oaza Omachi Omachi-shi Nagano 398-0002 / JP | |||
03 /
Masuko, Tsutomu c/o OMACHI PLANT, Showa Denko K.K. 6850, Oaza Omachi Omachi-shi Nagano 398-0002 / JP | Representative(s) | Strehl Schübel-Hopf & Partner Maximilianstrasse 54 80538 München / DE | [2019/23] |
Former [2011/18] | Strehl Schübel-Hopf & Partner Maximilianstrasse 54 80538 München / DE | Application number, filing date | 10010951.1 | 25.11.2003 | [2011/18] | Priority number, date | JP20020342689 | 26.11.2002 Original published format: JP 2002342689 | JP20020350094 | 02.12.2002 Original published format: JP 2002350094 | [2011/18] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP2317592 | Date: | 04.05.2011 | Language: | EN | [2011/18] | Type: | B1 Patent specification | No.: | EP2317592 | Date: | 05.06.2019 | Language: | EN | [2019/23] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 07.03.2011 | Classification | IPC: | H01M4/58, H01M4/02 | [2011/18] | CPC: |
H01M10/0525 (EP,KR,US);
H01M4/58 (EP,KR,US);
H01M10/05 (KR);
H01M4/02 (KR);
H01M4/0471 (EP,US);
H01M4/13 (EP,US);
H01M4/131 (EP,US);
H01M4/133 (EP,US);
H01M4/134 (EP,US);
H01M4/364 (EP,US);
H01M4/366 (EP,US);
H01M4/386 (EP,US);
H01M4/387 (EP,US);
H01M4/40 (EP,US);
H01M4/485 (EP,US);
H01M4/5815 (EP,US);
H01M4/583 (EP,US);
H01M4/587 (EP,US);
H01M4/625 (EP,US);
H01M10/052 (EP,US);
H01M2004/021 (EP,US);
H01M2004/027 (EP,US);
H01M4/405 (EP,US);
H01M4/582 (EP,US);
Y02E60/10 (EP)
(-)
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR [2019/23] |
Former [2011/18] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR | Title | German: | ELEKTRODENMATERIAL ENTHALTEND SILIZIUM UND/ODER ZINN PARTIKEL, HERSTELLUNGSVERFAHREN UND VERWENDUNG | [2019/02] | English: | ELECTRODE MATERIAL COMPRISING SILICON AND/OR TIN PARTICLES AND PRODUCTION METHOD AND USE THEREOF | [2019/02] | French: | MATERIAU D'ÉLECTRODE COMPRENANT DES PARTICULES DE SILICIUM ET/OU D'ÉTAIN, PROCÉDÉ DE FABRICATION ET UTILISATION | [2019/02] |
Former [2011/18] | Elektrodenmaterial enthaltend Silizium und/oder Zinn Partikel, Herstellungsverfahren und Verwendung | ||
Former [2011/18] | Electrode material comprising silicon and/or tin particles and production method and use thereof | ||
Former [2011/18] | Materiau d'electrode comprenant particules du silicium et/ou d'étain, procede de fabrication et utilisation | Examination procedure | 05.09.2011 | Amendment by applicant (claims and/or description) | 31.10.2011 | Examination requested [2011/50] | 03.03.2017 | Despatch of a communication from the examining division (Time limit: M04) | 20.06.2017 | Reply to a communication from the examining division | 31.07.2017 | Despatch of a communication from the examining division (Time limit: M04) | 14.11.2017 | Reply to a communication from the examining division | 22.12.2017 | Despatch of a communication from the examining division (Time limit: M04) | 28.02.2018 | Reply to a communication from the examining division | 06.04.2018 | Despatch of a communication from the examining division (Time limit: M04) | 02.08.2018 | Reply to a communication from the examining division | 09.01.2019 | Communication of intention to grant the patent | 11.03.2019 | Receipt of the translation of the claim(s) | 20.04.2019 | Fee for grant paid | 20.04.2019 | Fee for publishing/printing paid | Parent application(s) Tooltip | EP03811918.6 / EP1573835 | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued (EP20030811918) is 12.06.2007 | Opposition(s) | 06.03.2020 | No opposition filed within time limit [2020/20] | Fees paid | Renewal fee | 26.01.2011 | Renewal fee patent year 03 | 26.01.2011 | Renewal fee patent year 04 | 26.01.2011 | Renewal fee patent year 05 | 26.01.2011 | Renewal fee patent year 06 | 26.01.2011 | Renewal fee patent year 07 | 26.01.2011 | Renewal fee patent year 08 | 23.11.2011 | Renewal fee patent year 09 | 27.11.2012 | Renewal fee patent year 10 | 28.11.2013 | Renewal fee patent year 11 | 27.11.2014 | Renewal fee patent year 12 | 30.11.2015 | Renewal fee patent year 13 | 30.11.2016 | Renewal fee patent year 14 | 30.11.2017 | Renewal fee patent year 15 | 30.11.2018 | Renewal fee patent year 16 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 25.11.2003 | AT | 05.06.2019 | CY | 05.06.2019 | CZ | 05.06.2019 | DK | 05.06.2019 | EE | 05.06.2019 | ES | 05.06.2019 | FI | 05.06.2019 | IT | 05.06.2019 | MC | 05.06.2019 | NL | 05.06.2019 | RO | 05.06.2019 | SE | 05.06.2019 | SI | 05.06.2019 | SK | 05.06.2019 | TR | 05.06.2019 | BG | 05.09.2019 | GR | 06.09.2019 | PT | 07.10.2019 | GB | 25.11.2019 | IE | 25.11.2019 | LU | 25.11.2019 | BE | 30.11.2019 | CH | 30.11.2019 | FR | 30.11.2019 | LI | 30.11.2019 | [2021/32] |
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FI | 05.06.2019 | Documents cited: | Search | [Y]EP0883199 (MATSUSHITA ELECTRIC IND CO LTD [JP]) [Y] 1-23 * the whole document *; | [XD]JP2000173612 (MATSUSHITA ELECTRIC IND CO LTD) [XD] 1-23 * abstract *; | [XD]EP1045465 (SONY CORP [JP]) [XD] 1-23 * the whole document * * see col.2, [0008], col.4/5, [0020] - [0030], col. 5-9, [0039]-[0058], claims *; | [Y]EP1052712 (MATSUSHITA ELECTRIC IND CO LTD [JP]) [Y] 1-23 * the whole document * * see p.3, [0003], see p.5, [0021], ciaims *; | [Y]JP2001102052 (MATSUSHITA ELECTRIC IND CO LTD) [Y] 1-23 * abstract *; | [XD]JP2002008652 (SAMSUNG YOKOHAMA RES INST CO) [XD] 1-23 * abstract *; | US2002009646 [ ] (MATSUBARA KEIKO [JP], et al); | [XD]JP2002255529 (SAMSUNG SDI CO LTD) [XD] 1-23 * abstract *; | US2002164479 [ ] (MATSUBARA KEIKO [JP], et al); | [E]EP1396894 (MATSUSHITA ELECTRIC IND CO LTD [JP], et al) [E] 1-23* the whole document * | by applicant | JP2000173612 | JP2000357515 | US6300013 | JP2002008652 | JP2002255529 | US20020430646 | US20020432250 |