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EP2261967
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EP About this file: EP2261967
| EP2261967 - Tape for processing semiconductor wafer [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 13.12.2013 Database last updated on 18.10.2024 | Most recent event Tooltip | 13.12.2013 | Application deemed to be withdrawn | published on 15.01.2014 [2014/03] | Applicant(s) | For all designated states Furukawa Electric Co., Ltd. 2-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100-8322 / JP | [N/P] |
| Former [2010/50] | For all designated states Furukawa Electric Co., Ltd. 2-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100-8322 / JP | Inventor(s) | 01 /
Maruyama, Hiromitsu Furukawa Electric Co., Ltd. 2-3 Marunouchi 2-chome Chiyoda-ku Tokyo 100-8322 / JP | 02 /
Taguchi, Shuzo Furukawa Electric Co., Ltd. 2-3 Marunouchi 2-chome Chiyoda-ku Tokyo 100-8322 / JP | 03 /
Sakuma, Noboru Furukawa Electric Co., Ltd. 2-3 Marunouchi 2-chome Chiyoda-ku Tokyo 100-8322 / JP | 04 /
Morishima, Yasumasa Furukawa Electric Co., Ltd. 2-3 Marunouchi 2-chome Chiyoda-ku Tokyo 100-8322 / JP | 05 /
Ishiwata, Shinichi Furukawa Electric Co., Ltd. 2-3 Marunouchi 2-chome Chiyoda-ku Tokyo 100-8322 / JP | [2010/50] | Representative(s) | Horn Kleimann Waitzhofer Schmid-Dreyer Patent- und Rechtsanwälte PartG mbB Theresienhöhe 12 80339 München / DE | [N/P] |
| Former [2011/36] | Horn Kleimann Waitzhofer Elsenheimerstrasse 65 80687 München / DE | ||
| Former [2010/50] | Patentship Patentanwaltskanzlei GbR Vorhoelzerstraße 21 81477 München / DE | Application number, filing date | 10177278.8 | 16.07.2008 | [2010/50] | Priority number, date | JP20070238865 | 14.09.2007 Original published format: JP 2007238865 | JP20080068670 | 18.03.2008 Original published format: JP 2008068670 | JP20080172022 | 01.07.2008 Original published format: JP 2008172022 | [2010/50] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP2261967 | Date: | 15.12.2010 | Language: | EN | [2010/50] | Type: | A3 Search report | No.: | EP2261967 | Date: | 27.06.2012 | Language: | EN | [2012/26] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 30.05.2012 | Classification | IPC: | H01L21/683, C09J7/02, H01L21/301, H01L21/67, H01L21/68 | [2012/26] | CPC: |
H01L21/67132 (EP,KR,US);
C09J7/20 (EP,KR,US);
C09J7/40 (EP,US);
C09J7/403 (KR);
H01L21/6836 (EP,KR,US);
C09J2203/326 (EP,KR,US);
H01L2221/68327 (EP,KR,US);
Y10T428/1467 (EP,US);
Y10T428/28 (EP,US);
Y10T428/2878 (EP,US)
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| Former IPC [2010/50] | H01L21/683, C09J7/02, H01L21/301, H01L21/00, H01L21/68 | Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR [2010/50] | Title | German: | Band zur Verarbeitung eines Halbleiterwafers | [2010/50] | English: | Tape for processing semiconductor wafer | [2010/50] | French: | Bande de traitement d'une tranche semi-conductrice | [2010/50] | Examination procedure | 29.11.2012 | Amendment by applicant (claims and/or description) | 29.11.2012 | Examination requested [2013/02] | 21.03.2013 | Despatch of a communication from the examining division (Time limit: M04) | 02.08.2013 | Application deemed to be withdrawn, date of legal effect [2014/03] | 06.09.2013 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2014/03] | Parent application(s) Tooltip | EP08791179.8 / EP2192611 | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued (EP20080791179) is 10.06.2011 | Fees paid | Renewal fee | 17.09.2010 | Renewal fee patent year 03 | 07.07.2011 | Renewal fee patent year 04 | 23.07.2012 | Renewal fee patent year 05 | Penalty fee | Additional fee for renewal fee | 31.07.2013 | 06 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JPH04170488 (KYUSHU NIPPON ELECTRIC) [A] 1* abstract *; | [A]DE4421485 (HILDEBRANDT SPULEN BOBBINS GMB [DE]) [A] 1 * abstract * * column 2, line 53 - line 58 *; | [A]JP2000203765 (FUJI PHOTO FILM CO LTD) [A] 1 * abstract *; | [A]EP1548821 (NITTO DENKO CORP [JP]) [A] 1 * abstract * * column 14, line 35 - line 40 *; | [A]JP2007002173 (HITACHI CHEMICAL CO LTD) [A] 1 * abstract * | by applicant | JP2004035836 | JP2007002173 |