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Extract from the Register of European Patents

EP About this file: EP2270871

EP2270871 - WIDE BANDGAP HEMTS WITH SOURCE CONNECTED FIELD PLATES [Right-click to bookmark this link]
Former [2011/01]Wide bandgap HEMTs with source connected field plates
[2022/49]
StatusNo opposition filed within time limit
Status updated on  17.11.2023
Database last updated on 17.07.2024
FormerThe patent has been granted
Status updated on  09.12.2022
FormerGrant of patent is intended
Status updated on  07.11.2022
FormerExamination is in progress
Status updated on  09.12.2016
Most recent event   Tooltip24.05.2024Lapse of the patent in a contracting state
New state(s): IT		published on 26.06.2024  [2024/26]
Applicant(s)For all designated states
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703 / US
[2011/01]
Inventor(s)01 / Wu, Yifeng
528 Fireside Lane
Goleta, CA 93117 / US
02 / Parikh, Primit
6832 Shadowbrook Drive
Goleta, CA 93117 / US
03 / Mishra, Umesh
2040 Creekside Drive
Montecito, CA 93108 / US
04 / Moore, Marcia
1438 West Valerio Street
Santa Barbara, CA 93101 / US
 [2011/01]
Representative(s)FRKelly
Waterways House
Grand Canal Quay
Dublin D02 PD39 / IE
[N/P]
Former [2023/02]FRKelly
27 Clyde Road
Dublin D04 F838 / IE
Former [2013/38]Brophy, David Timothy, et al
FRKelly 27 Clyde Road Ballsbridge
Dublin 4 / IE
Former [2011/01]Boyce, Conor
FRKelly 27 Clyde Road Ballsbridge
Dublin 4 / IE
Application number, filing date10183607.024.03.2005
[2011/01]
Priority number, dateUS20040570519P11.05.2004         Original published format: US 570519 P
US2004095897004.10.2004         Original published format: US 958970
[2011/01]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP2270871
Date:05.01.2011
Language:EN
[2011/01]
Type: B1 Patent specification 
No.:EP2270871
Date:11.01.2023
Language:EN
[2023/02]
Search report(s)(Supplementary) European search report - dispatched on:EP06.12.2010
ClassificationIPC:H01L29/778, H01L29/06, H01L29/40, H01L29/20, H01L29/417, H01L29/423
[2022/45]
CPC:
H01L29/402 (EP,KR,US); H01L29/7787 (EP,KR,US); H01L29/2003 (EP,KR,US);
H01L29/41725 (EP,US); H01L29/42316 (EP,US); H01L29/66462 (KR)
Former IPC [2011/01]H01L29/778, H01L29/06
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2023/02]
Former [2011/01]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:HEMTS MIT GROSSEM BANDABSTAND MIT SOURCE-VERBUNDENEN FELDPLATTEN[2022/45]
English:WIDE BANDGAP HEMTS WITH SOURCE CONNECTED FIELD PLATES[2022/49]
French:TRANSISTORS A HAUTE MOBILITE D'ELECTRONS A GRANDE LARGEUR DE BANDE INTERDITE COMPORTANT DES PLAQUES DE CHAMP RELIEES A LA SOURCE[2022/45]
Former [2011/01]Hemts mit grossem Bandabstand mit source-verbundenen Feldplatten
Former [2011/01]Wide bandgap HEMTs with source connected field plates
Former [2011/01]Transistors a haute mobilite d'electrons a grande largeur de bande interdite comportant des plaques de champ reliees a la source
Examination procedure04.07.2011Amendment by applicant (claims and/or description)
04.07.2011Examination requested  [2011/32]
13.12.2016Despatch of a communication from the examining division (Time limit: M06)
13.06.2017Reply to a communication from the examining division
21.02.2019Despatch of a communication from the examining division (Time limit: M04)
24.06.2019Reply to a communication from the examining division
02.01.2020Despatch of a communication from the examining division (Time limit: M06)
03.06.2020Reply to a communication from the examining division
08.10.2020Despatch of a communication from the examining division (Time limit: M04)
19.01.2021Reply to a communication from the examining division
19.02.2021Despatch of a communication from the examining division (Time limit: M04)
27.05.2021Reply to a communication from the examining division
04.10.2022Cancellation of oral proceeding that was planned for 10.10.2022
10.10.2022Date of oral proceedings (cancelled)
08.11.2022Communication of intention to grant the patent
02.12.2022Fee for grant paid
02.12.2022Fee for publishing/printing paid
02.12.2022Receipt of the translation of the claim(s)
Parent application(s)   TooltipEP05731252.2  / EP1751803
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued (EP20050731252) is  30.07.2008
Opposition(s)12.10.2023No opposition filed within time limit [2023/51]
Fees paidRenewal fee
31.01.2011Renewal fee patent year 03
31.01.2011Renewal fee patent year 04
31.01.2011Renewal fee patent year 05
31.01.2011Renewal fee patent year 06
29.03.2011Renewal fee patent year 07
14.03.2012Renewal fee patent year 08
11.03.2013Renewal fee patent year 09
12.03.2014Renewal fee patent year 10
10.03.2015Renewal fee patent year 11
10.03.2016Renewal fee patent year 12
10.03.2017Renewal fee patent year 13
13.03.2018Renewal fee patent year 14
13.03.2019Renewal fee patent year 15
27.03.2020Renewal fee patent year 16
29.03.2021Renewal fee patent year 17
28.03.2022Renewal fee patent year 18
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT11.01.2023
CZ11.01.2023
DK11.01.2023
EE11.01.2023
ES11.01.2023
FI11.01.2023
IT11.01.2023
LT11.01.2023
MC11.01.2023
NL11.01.2023
PL11.01.2023
RO11.01.2023
SE11.01.2023
SI11.01.2023
SK11.01.2023
IE24.03.2023
LU24.03.2023
BE31.03.2023
CH31.03.2023
FR31.03.2023
LI31.03.2023
GB11.04.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
[2024/26]
Former [2024/11]AT11.01.2023
CZ11.01.2023
DK11.01.2023
EE11.01.2023
ES11.01.2023
FI11.01.2023
LT11.01.2023
MC11.01.2023
NL11.01.2023
PL11.01.2023
RO11.01.2023
SE11.01.2023
SI11.01.2023
SK11.01.2023
IE24.03.2023
LU24.03.2023
BE31.03.2023
CH31.03.2023
FR31.03.2023
LI31.03.2023
GB11.04.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2024/09]AT11.01.2023
CZ11.01.2023
DK11.01.2023
EE11.01.2023
ES11.01.2023
FI11.01.2023
LT11.01.2023
MC11.01.2023
NL11.01.2023
PL11.01.2023
RO11.01.2023
SE11.01.2023
SK11.01.2023
IE24.03.2023
LU24.03.2023
CH31.03.2023
LI31.03.2023
GB11.04.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2024/08]AT11.01.2023
CZ11.01.2023
DK11.01.2023
EE11.01.2023
ES11.01.2023
FI11.01.2023
LT11.01.2023
MC11.01.2023
NL11.01.2023
PL11.01.2023
RO11.01.2023
SE11.01.2023
SK11.01.2023
IE24.03.2023
LU24.03.2023
GB11.04.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2024/02]AT11.01.2023
CZ11.01.2023
DK11.01.2023
EE11.01.2023
ES11.01.2023
FI11.01.2023
LT11.01.2023
MC11.01.2023
NL11.01.2023
PL11.01.2023
RO11.01.2023
SE11.01.2023
SK11.01.2023
LU24.03.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2023/50]AT11.01.2023
CZ11.01.2023
DK11.01.2023
EE11.01.2023
ES11.01.2023
FI11.01.2023
LT11.01.2023
MC11.01.2023
NL11.01.2023
PL11.01.2023
RO11.01.2023
SE11.01.2023
SK11.01.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2023/49]AT11.01.2023
CZ11.01.2023
DK11.01.2023
EE11.01.2023
ES11.01.2023
FI11.01.2023
LT11.01.2023
MC11.01.2023
NL11.01.2023
PL11.01.2023
RO11.01.2023
SE11.01.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2023/48]AT11.01.2023
DK11.01.2023
EE11.01.2023
ES11.01.2023
FI11.01.2023
LT11.01.2023
MC11.01.2023
NL11.01.2023
PL11.01.2023
SE11.01.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2023/46]AT11.01.2023
DK11.01.2023
ES11.01.2023
FI11.01.2023
LT11.01.2023
NL11.01.2023
PL11.01.2023
SE11.01.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2023/39]AT11.01.2023
ES11.01.2023
FI11.01.2023
LT11.01.2023
NL11.01.2023
PL11.01.2023
SE11.01.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2023/38]AT11.01.2023
ES11.01.2023
FI11.01.2023
LT11.01.2023
NL11.01.2023
PL11.01.2023
SE11.01.2023
GR12.04.2023
PT11.05.2023
Former [2023/37]AT11.01.2023
ES11.01.2023
FI11.01.2023
LT11.01.2023
NL11.01.2023
SE11.01.2023
GR12.04.2023
PT11.05.2023
Former [2023/36]AT11.01.2023
ES11.01.2023
FI11.01.2023
LT11.01.2023
NL11.01.2023
SE11.01.2023
PT11.05.2023
Former [2023/35]AT11.01.2023
ES11.01.2023
LT11.01.2023
NL11.01.2023
PT11.05.2023
Former [2023/34]ES11.01.2023
LT11.01.2023
NL11.01.2023
PT11.05.2023
Former [2023/33]ES11.01.2023
LT11.01.2023
NL11.01.2023
Former [2023/31]NL11.01.2023
Documents cited:Search[Y]US2002005528  (NAGAHARA MASAKI [JP]) [Y] 7 * paragraph [0029]; figures 2,3,5,15-19 * * abstract *;
 [XYI]US2002137318  (PEAKE STEVEN T [GB], et al) [X] 1,3,6 * paragraphs [0041] , [0066]; figure 4 * [Y] 2,7 [I] 4,5;
 [A]EP1336989  (INFINEON TECHNOLOGIES AG [DE]) [A] 1-7* Fig. 3 and corresponding text. *;
 [A]US2003222327  (YAMAGUCHI MASAKAZU [JP], et al) [A] 1-7 * abstract *;
 [XP]WO2004068590  (TOSHIBA KK [JP], et al) [XP] 1-7 * abstract *;
 [YA]  - SAITO W ET AL, "DESIGN AND DEMONSTRATION OF HIGH BREAKDOWN VOLTAGE GAN HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) USING FIELD PLATE STRUCTURE FOR POWER ELECTRONICS APPLICATIONS", JAPANESE JOURNAL OF APPLIED PHYSICS, JAPAN SOCIETY OF APPLIED PHYSICS, TOKYO, JP, (200404), vol. 43, no. 4B, ISSN 0021-4922, pages 2239 - 2242, XP001227744 [Y] 2 * the whole document * [A] 1,3-7

DOI:   http://dx.doi.org/10.1143/JJAP.43.2239
ExaminationUS6100571
 US6445038
by applicantUS5192987
 US5290393
 US5296395
 US5393993
 US5523589
 US5686738
 US5739554
 US6316793
 US2002167023
 US2003020092
 US6548333
 US6586781
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The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.