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Extract from the Register of European Patents

EP About this file: EP2285002

EP2285002 - Antifuse reroute of dies [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  18.11.2022
Database last updated on 13.11.2024
FormerExamination is in progress
Status updated on  08.06.2018
Most recent event   Tooltip18.11.2022Application deemed to be withdrawnpublished on 21.12.2022  [2022/51]
Applicant(s)For all designated states
Micron Technology, Inc.
8000 South Federal Way
Boise, ID 83707-0006 / US
[2011/07]
Inventor(s)01 / Duesman, Kevin
3555 Barber Drive
Boise, ID 83716 / US
 [2011/07]
Representative(s)Carpmaels & Ransford LLP
One Southampton Row
London WC1B 5HA / GB
[N/P]
Former [2011/15]Carpmaels & Ransford
One Southampton Row London
WC1B 5HA / GB
Former [2011/07]Kent, Peter Joseph, et al
Keltie Fleet Place House 2 Fleet Place
London EC4M 7ET / GB
Application number, filing date10186003.915.03.2002
[2011/07]
Priority number, dateUS2001080953715.03.2001         Original published format: US 809537
[2011/07]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP2285002
Date:16.02.2011
Language:EN
[2011/07]
Type: A3 Search report 
No.:EP2285002
Date:09.07.2014
Language:EN
[2014/28]
Search report(s)(Supplementary) European search report - dispatched on:EP05.06.2014
ClassificationIPC:H03K19/173, G11C5/06, G11C29/00, G11C29/48, H01L23/525, H03K17/693
[2014/28]
CPC:
H03K19/1736 (EP,US); G11C5/12 (KR); G11C29/48 (EP,US);
G11C5/06 (EP,US); H01L23/525 (EP,US); H01L23/5252 (EP,US);
H03K17/693 (EP,US); H01L2924/0002 (EP,US); H01L2924/3011 (EP,US) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Former IPC [2011/07]H03K19/173, G11C5/06, G11C29/00
Designated contracting statesAT,   BE,   CH,   CY,   DE,   DK,   ES,   FI,   FR,   GB,   GR,   IE,   IT,   LI,   LU,   MC,   NL,   PT,   SE,   TR [2011/07]
TitleGerman:Umleitung von Signalen auf ICs mit Antischmelzsicherungen[2011/07]
English:Antifuse reroute of dies[2011/07]
French:Réacheminement anti-fusible de moules[2011/07]
Examination procedure09.01.2015Amendment by applicant (claims and/or description)
09.01.2015Examination requested  [2015/09]
06.06.2018Despatch of a communication from the examining division (Time limit: M06)
13.12.2018Reply to a communication from the examining division
22.03.2021Despatch of a communication from the examining division (Time limit: M04)
28.07.2021Reply to a communication from the examining division
17.03.2022Despatch of a communication from the examining division (Time limit: M04)
28.07.2022Application deemed to be withdrawn, date of legal effect  [2022/51]
18.08.2022Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2022/51]
Parent application(s)   TooltipEP02721425.3  / EP1386398
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued (EP20020721425) is  23.08.2006
Fees paidRenewal fee
28.10.2010Renewal fee patent year 03
28.10.2010Renewal fee patent year 04
28.10.2010Renewal fee patent year 05
28.10.2010Renewal fee patent year 06
28.10.2010Renewal fee patent year 07
28.10.2010Renewal fee patent year 08
28.10.2010Renewal fee patent year 09
15.03.2011Renewal fee patent year 10
14.03.2012Renewal fee patent year 11
11.03.2013Renewal fee patent year 12
12.03.2014Renewal fee patent year 13
10.03.2015Renewal fee patent year 14
10.03.2016Renewal fee patent year 15
10.03.2017Renewal fee patent year 16
13.03.2018Renewal fee patent year 17
13.03.2019Renewal fee patent year 18
27.03.2020Renewal fee patent year 19
29.03.2021Renewal fee patent year 20
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Documents cited:Search[XYI]US5299160  (MORI SHIGERU [JP]) [X] 7-9 * figure 6 * [Y] 14 [I] 1,3-6,13;
 [A]US5724282  (LOUGHMILLER DANIEL R [US], et al) [A] 1* the whole document *;
 [Y]WO9814953  (MICRON TECHNOLOGY INC [US]) [Y] 11,14 * page 6, line 3 - page 6, line 20; figure 3 *;
 [XYI]  - "ENGINEERING CHANGE PAD SHARING WITH FUSIBLE LINKS", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, (19880801), vol. 31, no. 3, ISSN 0018-8689, pages 330 - 334, XP000097563 [X] 7-10,12 * the whole document * [Y] 11,14 [I] 1-4
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.