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Extract from the Register of European Patents

EP About this file: EP2405034

EP2405034 - COPPER-ZINC ALLOY ELECTROPLATING BATH AND METHOD OF PLATING USING SAME [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  01.05.2015
Database last updated on 07.10.2024
Most recent event   Tooltip01.05.2015Withdrawal of applicationpublished on 03.06.2015  [2015/23]
Applicant(s)For all designated states
Bridgestone Corporation
10-1, Kyobashi 1-chome
Chuo-ku
Tokyo 104-8340 / JP
[N/P]
Former [2012/02]For all designated states
Bridgestone Corporation
10-1, Kyobashi 1-chome Chuo-ku
Tokyo 104-8340 / JP
Inventor(s)01 / WADA, Yukiko
c/o BRIDGESTONE CORPORATION
Technical Center
3-1-1 Ogawahigashi-cho
Kodaira-shi Tokyo 187-0031 / JP
 [2012/02]
Representative(s)Oxley, Robin John George, et al
Marks & Clerk LLP
15 Fetter Lane
London EC4A 1BW / GB
[N/P]
Former [2014/30]Oxley, Robin John George, et al
Marks & Clerk LLP
90 Long Acre
London
WC2E 9RA / GB
Former [2012/49]Waldren, Robin Michael, et al
Marks & Clerk LLP
90 Long Acre
London
WC2E 9RA / GB
Former [2012/02]Lamb, Martin John Carstairs
Marks & Clerk LLP 90 Long Acre London
WC2E 9RA / GB
Application number, filing date10748805.804.03.2010
WO2010JP53524
Priority number, dateJP2009005043804.03.2009         Original published format: JP 2009050438
[2012/02]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2010101212
Date:10.09.2010
Language:JA
[2010/36]
Type: A1 Application with search report 
No.:EP2405034
Date:11.01.2012
Language:EN
[2012/02]
Search report(s)International search report - published on:JP10.09.2010
(Supplementary) European search report - dispatched on:EP08.04.2015
ClassificationIPC:C25D3/58
[2012/02]
CPC:
C25D3/58 (EP,KR,US); C25D7/0607 (KR); Y10T428/12493 (EP,US)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   SM,   TR [2012/02]
TitleGerman:ELEKTROPLATTIERUNGSBAD AUS EINER KUPFER-ZINK-LEGIERUNG UND PLATTIERUNGSVERFAHREN DAMIT[2012/02]
English:COPPER-ZINC ALLOY ELECTROPLATING BATH AND METHOD OF PLATING USING SAME[2012/02]
French:BAIN D'ÉLECTRO-PLACAGE D'ALLIAGE DE CUIVRE ET DE ZINC ET PROCÉDÉ DE PLACAGE AU MOYEN DE CELUI-CI[2012/02]
Entry into regional phase07.09.2011Translation filed 
07.09.2011National basic fee paid 
07.09.2011Search fee paid 
07.09.2011Designation fee(s) paid 
07.09.2011Examination fee paid 
Examination procedure07.09.2011Examination requested  [2012/02]
02.04.2015Application withdrawn by applicant  [2015/23]
Fees paidRenewal fee
14.03.2012Renewal fee patent year 03
11.03.2013Renewal fee patent year 04
12.03.2014Renewal fee patent year 05
10.03.2015Renewal fee patent year 06
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Documents cited:Search[XYI]US2002043467  (MORRISSEY DENIS [US], et al) [X] 1-3,6,7,10 * paragraphs [0026] , [0027] , [0030] , [0033] - [0044] * [Y] 4,8,11 [I] 5,9;
 [IY]EP0752484  (PIRELLI [IT]) [I] 1-11 * abstract * * page 2, lines 6-9 * * page 2, lines 39-43 * * page 4, line 26 - page 5, line 15 * * pages 5-10; examples 1-6 * [Y] 4,8,11
International search[X]US6974767  (LOPATIN SERGEY [US]);
 [A]JPH0320478B  (OSAKA-SHI);
 [A]JPH09217193  (GOULD ELECTRONICS INC)
by applicantJPH0598496
 JPH0320478B
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.