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Extract from the Register of European Patents

EP About this file: EP2441859

EP2441859 - PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  08.02.2013
Database last updated on 02.11.2024
Most recent event   Tooltip08.02.2013Withdrawal of applicationpublished on 13.03.2013  [2013/11]
Applicant(s)For all designated states
Mitsubishi Heavy Industries, Ltd.
16-5, Konan 2-chome Minato-ku
Tokyo 108-8215 / JP
[2012/16]
Inventor(s)01 / MATSUDA Ryuichi
c/o TAKASAGO Research&Development Center
MITSUBISHI HEAVY INDUSTRIES LTD.
1-1 Arai-cho Shinhama 2-chome
Takasago-shi Hyogo 676-8686 / JP
02 / YOSHIDA Kazuto
c/o KOBE Shipyard&Machinery Works
MITSUBISHI HEAVY INDUSTRIES LTD.
1-1 Wadasaki-cho 1-chome
Hyogo-ku
Kobe-shi Hyogo 652-8585 / JP
03 / KAWANO Yuichi
c/o TAKASAGO Research&Development Center
MITSUBISHI HEAVY INDUSTRIES LTD.
1-1 Arai-cho Shinhama 2-chome
Takasago-shi Hyogo 676-8686 / JP
 [2012/16]
Representative(s)Hoffmann Eitle
Patent- und Rechtsanwälte PartmbB
Arabellastrasse 30
81925 München / DE
[N/P]
Former [2012/16]HOFFMANN EITLE
Patent- und Rechtsanwälte Arabellastrasse 4
81925 München / DE
Application number, filing date10786056.124.05.2010
WO2010JP58734
Priority number, dateJP2009013979511.06.2009         Original published format: JP 2009139795
[2012/16]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2010143525
Date:16.12.2010
Language:JA
[2010/50]
Type: A1 Application with search report 
No.:EP2441859
Date:18.04.2012
Language:EN
[2012/16]
Search report(s)International search report - published on:JP16.12.2010
ClassificationIPC:C23C16/44, H01L21/205
[2012/16]
CPC:
H01J37/32577 (EP,US); C23C16/4404 (EP,KR,US); C23C16/50 (EP,KR,US);
H01J37/32467 (EP,KR,US); H01J37/32504 (EP,KR,US); Y10S156/916 (EP,US)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   SM,   TR [2012/16]
TitleGerman:VORRICHTUNG ZUR PLASMAVERARBEITUNG UND VERFAHREN ZUR PLASMAVERARBEITUNG[2012/16]
English:PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD[2012/16]
French:APPAREIL DE TRAITEMENT AU PLASMA ET PROCÉDÉ DE TRAITEMENT AU PLASMA[2012/16]
Entry into regional phase06.12.2011Translation filed 
06.12.2011National basic fee paid 
06.12.2011Search fee paid 
06.12.2011Designation fee(s) paid 
06.12.2011Examination fee paid 
Examination procedure06.12.2011Examination requested  [2012/16]
04.02.2013Application withdrawn by applicant  [2013/11]
Fees paidRenewal fee
29.03.2012Renewal fee patent year 03
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Cited inInternational search[A]JPH02183533  (FUJITSU LTD);
 [Y]JPH08172080  (APPLIED MATERIALS INC);
 [Y]JPH1038300  (FUJI INDUSTRIES CO LTD);
 [A]JPH10321559  (HITACHI LTD);
 [A]JP2000173931  (SONY CORP);
 [Y]JP2005191023  (MITSUBISHI HEAVY IND LTD)
by applicantJP2005191023
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