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Extract from the Register of European Patents

EP About this file: EP2453467

EP2453467 - FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  15.03.2013
Database last updated on 13.11.2024
Most recent event   Tooltip15.03.2013Withdrawal of applicationpublished on 17.04.2013  [2013/16]
Applicant(s)For all designated states
Sumitomo Bakelite Company Limited
5-8 Higashi-shinagawa 2-chome Shinagawa-ku
Tokyo 140-0002 / JP
[2012/20]
Inventor(s)01 / YASUDA Hiroyuki
c/o SUMITOMO BAKELITE COMPANY LIMITED
5-8 Higashi-shinagawa 2-chome
Shinagawa-ku
Tokyo 140-0002 / JP
02 / HIRANO Takashi
c/o SUMITOMO BAKELITE COMPANY LIMITED
5-8 Higashi-shinagawa 2-chome
Shinagawa-ku
Tokyo 140-0002 / JP
 [2012/20]
Representative(s)Solf, Alexander
Patent- und Rechtsanwälte
Dr. Solf & Zapf
Candidplatz 15
81543 München / DE
[N/P]
Former [2012/20]Solf, Alexander
Patentanwälte Dr. Solf und Zapf Candidplatz 15
D-81543 München / DE
Application number, filing date10796968.531.05.2010
WO2010JP59188
Priority number, dateJP2009016303409.07.2009         Original published format: JP 2009163034
[2012/20]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2011004657
Date:13.01.2011
Language:JA
[2011/02]
Type: A1 Application with search report 
No.:EP2453467
Date:16.05.2012
Language:EN
[2012/20]
Search report(s)International search report - published on:JP13.01.2011
ClassificationIPC:H01L21/301, C09J5/00, C09J7/02, C09J201/00
[2012/20]
CPC:
H01L24/29 (EP,KR,US); H01L21/67132 (EP,KR,US); C09J7/38 (EP,KR,US);
C09J7/40 (KR); H01L21/6836 (EP,KR,US); H01L24/27 (EP,US);
H01L24/83 (EP,US); C09J2203/326 (EP,KR,US); C09J2301/208 (EP,KR,US);
C09J2301/312 (KR); H01L2221/68318 (EP,KR,US); H01L2221/68327 (EP,US);
H01L2221/68336 (EP,US); H01L2221/68359 (EP,US); H01L2224/27436 (EP,US);
H01L2224/2919 (EP,US); H01L2224/32225 (EP,US); H01L2224/48091 (EP,US);
H01L2224/48227 (EP,US); H01L2224/73265 (EP,KR,US); H01L2224/83191 (EP,US);
H01L2224/838 (EP,US); H01L2224/92247 (EP,US); H01L24/48 (EP,US);
H01L24/73 (EP,US); H01L2924/00 (KR); H01L2924/00014 (EP,US);
H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/01013 (EP,US);
H01L2924/01015 (EP,US); H01L2924/01019 (EP,US); H01L2924/01027 (EP,US);
H01L2924/01029 (EP,US); H01L2924/01033 (EP,US); H01L2924/01047 (EP,US);
H01L2924/01059 (EP,US); H01L2924/01061 (EP,US); H01L2924/01078 (EP,US);
H01L2924/01082 (EP,US); H01L2924/0132 (EP,US); H01L2924/014 (EP,US);
H01L2924/0665 (EP,US); H01L2924/10253 (EP,US); H01L2924/10329 (EP,US);
H01L2924/14 (EP,US); H01L2924/15311 (EP,US); H01L2924/15787 (EP,US);
H01L2924/181 (EP,US); H01L2924/30105 (EP,US); Y10T428/24942 (EP,US);
Y10T428/24983 (EP,US); Y10T428/2809 (EP,US); Y10T428/2848 (EP,US) (-)
C-Set:
H01L2224/2919, H01L2924/0665, H01L2924/00 (US,EP);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (US,EP);
H01L2224/92247, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (US,EP);
H01L2924/00014, H01L2224/45015, H01L2924/207 (US,EP);
H01L2924/00014, H01L2224/45099 (EP,US);
H01L2924/0132, H01L2924/01031, H01L2924/01033, H01L2924/00012 (US,EP);
H01L2924/0665, H01L2924/00 (US,EP);
H01L2924/10253, H01L2924/00 (US,EP);
H01L2924/15311, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (US,EP);
H01L2924/15787, H01L2924/00 (EP,US);
H01L2924/181, H01L2924/00012 (EP,US);
H01L2924/3512, H01L2924/00 (US,EP)
(-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   SM,   TR [2012/20]
TitleGerman:FILM FÜR EINEN HALBLEITER UND VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERBAUELEMENTS[2012/20]
English:FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD[2012/20]
French:FILM POUR SEMI-CONDUCTEUR ET PROCÉDÉ DE FABRICATION DE DISPOSITIF À SEMI-CONDUCTEUR[2012/20]
Entry into regional phase02.02.2012Translation filed 
02.02.2012National basic fee paid 
02.02.2012Search fee paid 
02.02.2012Designation fee(s) paid 
02.02.2012Examination fee paid 
Examination procedure02.02.2012Examination requested  [2012/20]
07.03.2013Application withdrawn by applicant  [2013/16]
Fees paidRenewal fee
23.05.2012Renewal fee patent year 03
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Cited inInternational search[Y]JP2003034780  (FURUKAWA ELECTRIC CO LTD);
 [Y]JP2003142429  (MURATA MANUFACTURING CO);
 [Y]JP2007027215  (FURUKAWA ELECTRIC CO LTD);
 [Y]WO2008032367  (NITTO DENKO CORP [JP], et al);
 [Y]WO2008047610  (SUMITOMO BAKELITE CO [JP], et al)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.