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EP2485254
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EP About this file: EP2485254
| EP2485254 - INSULATION CIRCUIT BOARD, AND POWER SEMICONDUCTOR DEVICE OR INVERTER MODULE USING THE SAME [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 03.04.2020 Database last updated on 08.10.2024 | |
| Former | Examination is in progress Status updated on 07.12.2019 | Most recent event Tooltip | 03.04.2020 | Withdrawal of application | published on 06.05.2020 [2020/19] | Applicant(s) | For all designated states Hitachi, Ltd. 6-6, Marunouchi 1-chome Chiyoda-ku Tokyo 100-8280 / JP | [N/P] |
| Former [2012/32] | For all designated states Hitachi, Ltd. 6-6, Marunouchi 1-chome Chiyoda-ku Tokyo 100-8280 / JP | Inventor(s) | 01 /
MATSUMOTO Hironori c/o Hitachi Research Laboratory HITACHI LTD. 1-1 Omikacho 7-chome Hitachi-shi Ibaraki 319-1292 / JP | 02 /
KUSUKAWA Jumpei c/o Hitachi Research Laboratory HITACHI LTD. 1-1 Omikacho 7-chome Hitachi-shi Ibaraki 319-1292 / JP | [2012/32] | Representative(s) | Matias, Bruno M. MERH-IP Matias Erny Reichl Hoffmann Patentanwälte PartG mbB Paul-Heyse-Straße 29 80336 München / DE | [N/P] |
| Former [2012/32] | Matias, Bruno M. MERH-IP Matias Erny Reichl Hoffmann Paul-Heyse-Strasse 29 80336 München / DE | Application number, filing date | 10820175.7 | 24.02.2010 | WO2010JP52847 | Priority number, date | JP20090225903 | 30.09.2009 Original published format: JP 2009225903 | [2012/32] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2011040054 | Date: | 07.04.2011 | Language: | JA | [2011/14] | Type: | A1 Application with search report | No.: | EP2485254 | Date: | 08.08.2012 | Language: | EN | [2012/32] | Search report(s) | International search report - published on: | JP | 07.04.2011 | (Supplementary) European search report - dispatched on: | EP | 27.10.2017 | Classification | IPC: | H05K1/02, H05K1/05, H01L23/12, H01L25/07, H01L25/18, H02M1/32, H01L23/62, H01L23/64, H01L23/14, // H01L23/498 | [2017/48] | CPC: |
H05K1/056 (EP,US);
H01L23/142 (EP,US);
H01L23/62 (EP,US);
H01L23/647 (EP,US);
H01L25/072 (EP,US);
H01L25/18 (EP,US);
H05K1/0257 (EP,US);
H05K1/053 (EP,US);
H01L23/49844 (EP,US);
H01L2924/0002 (EP,US);
H01L2924/09701 (EP,US);
H01L2924/12044 (EP,US);
H02M7/003 (EP);
H05K1/0204 (EP,US);
H05K1/0256 (EP,US);
H05K1/0262 (EP,US);
H05K2201/0154 (EP,US);
H05K2201/0162 (EP,US);
H05K2201/0209 (EP,US);
H05K2201/0761 (EP,US);
H05K2201/09781 (EP,US);
H05K2201/10022 (EP,US)
(-)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
|
| Former IPC [2012/32] | H01L23/12, H01L25/07, H01L25/18, H05K1/05 | Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR [2012/32] | Title | German: | ISOLATIONSLEITERPLATTE UND STROMHALBLEITERVORRICHTUNG ODER UMRICHTERMODUL DAMIT | [2012/32] | English: | INSULATION CIRCUIT BOARD, AND POWER SEMICONDUCTOR DEVICE OR INVERTER MODULE USING THE SAME | [2012/32] | French: | CARTE DE CIRCUIT ISOLANT, ET DISPOSITIF À SEMI-CONDUCTEURS DE PUISSANCE OU MODULE D'ONDULEUR UTILISANT CETTE CARTE | [2012/32] | Entry into regional phase | 06.02.2012 | Translation filed | 02.03.2012 | National basic fee paid | 02.03.2012 | Search fee paid | 02.03.2012 | Designation fee(s) paid | 02.03.2012 | Examination fee paid | Examination procedure | 02.03.2012 | Examination requested [2012/32] | 17.05.2018 | Amendment by applicant (claims and/or description) | 11.12.2019 | Despatch of a communication from the examining division (Time limit: M04) | 02.04.2020 | Application withdrawn by applicant [2020/19] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 11.12.2019 | Fees paid | Renewal fee | 02.03.2012 | Renewal fee patent year 03 | 28.02.2013 | Renewal fee patent year 04 | 28.02.2014 | Renewal fee patent year 05 | 02.03.2015 | Renewal fee patent year 06 | 29.02.2016 | Renewal fee patent year 07 | 28.02.2017 | Renewal fee patent year 08 | 28.02.2018 | Renewal fee patent year 09 | 28.02.2019 | Renewal fee patent year 10 | 02.03.2020 | Renewal fee patent year 11 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]US5420455 (GILMOUR RICHARD A [US], et al) [Y] 1-11 * figure - * * the whole document *; | [X]US6340798 (TOKUDA KAZUHIKO [JP]) [X] 1-11 * figures 2A,3A,4 * * column 1, lines 29-31,44-57 * * column 3, line 60 - line 65 * * column 5, lines 26-47,66-67 * * column 6, line 1 - line 33 *; | [Y]EP1835790 (IBIDEN CO LTD [JP]) [Y] 1-11 * paragraphs [0018] , [0030]; figure 10; claim 1 ** the whole document *; | [X]US2008218285 (YEH SHIH-KUN [TW]) [X] 1-11 * paragraphs [0004] , [0012] - [0013]; figures 1-2 * | International search | [A]JP2000252597 (SANYO ELECTRIC CO); | [A]JP2003303940 (HITACHI LTD); | [A]JP2009065017 (FUJI ELEC DEVICE TECH CO LTD) | by applicant | JP2001057409 | JP2001177054 | JP2009225903 |