blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...
blank Related links

Extract from the Register of European Patents

EP About this file: EP2509400

EP2509400 - METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND CONDUCTIVE FILM [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  16.10.2015
Database last updated on 27.07.2024
Most recent event   Tooltip16.10.2015Application deemed to be withdrawnpublished on 18.11.2015  [2015/47]
Applicant(s)For all designated states
Dexerials Corporation
8F, East Tower
Gate City Osaki
11-2, Osaki 1-chome
Shinagawa-ku
Tokyo / JP
[2013/34]
Former [2012/41]For all designated states
Sony Chemical & Information Device Corporation
Gate City Osaki East Tower 8F 1-11-2, Osaki Shinagawa-ku
Tokyo 141-0032 / JP
Inventor(s)01 / OKUMIYA, Hideaki
c/o Sony Chemical&Information Device Corporation
1078 Kami-ishikawa
Kanuma-shi Tochigi 322-8503 / JP
02 / SUGA, Yasuhiro
c/o Sony Chemical&Information Device Corporation
1078 Kami-ishikawa
Kanuma-shi Tochigi 322-8503 / JP
 [2012/41]
Representative(s)Michalski Hüttermann & Partner Patentanwälte mbB
Kaistraße 16A
40221 Düsseldorf / DE
[N/P]
Former [2012/41]Michalski Hüttermann & Partner
Neuer Zollhof 2
40221 Düsseldorf / DE
Application number, filing date10834332.822.06.2010
WO2010JP04144
Priority number, dateJP2009027399801.12.2009         Original published format: JP 2009273998
[2012/41]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2011067875
Date:09.06.2011
Language:JA
[2011/23]
Type: A1 Application with search report 
No.:EP2509400
Date:10.10.2012
Language:EN
[2012/41]
Search report(s)International search report - published on:JP09.06.2011
(Supplementary) European search report - dispatched on:EP27.10.2014
ClassificationIPC:H05K3/32, H01B5/16, H01L21/60, H01L31/04
[2012/41]
CPC:
H01L31/05 (EP); H05K3/32 (KR); H01B5/16 (KR);
H01L21/6835 (EP); H01L31/04 (KR); H01L2224/83101 (EP);
H01L2924/00013 (EP); H05K3/323 (EP); Y02E10/50 (EP) (-)
C-Set:
H01L2924/00013, H01L2224/05099 (EP);
H01L2924/00013, H01L2224/05599 (EP);
H01L2924/00013, H01L2224/13099 (EP);
H01L2924/00013, H01L2224/13599 (EP);
H01L2924/00013, H01L2224/29099 (EP);
H01L2924/00013, H01L2224/29599 (EP)
(-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   SM,   TR [2012/41]
TitleGerman:VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN KOMPONENTE, ELEKTRONISCHE KOMPONENTE UND LEITFÄHIGER FILM[2012/41]
English:METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND CONDUCTIVE FILM[2012/41]
French:PROCÉDÉ DE FABRICATION DE COMPOSANT ÉLECTRONIQUE, COMPOSANT ÉLECTRONIQUE ET FILM CONDUCTEUR[2012/41]
Entry into regional phase11.04.2012Translation filed 
11.04.2012National basic fee paid 
11.04.2012Search fee paid 
11.04.2012Designation fee(s) paid 
11.04.2012Examination fee paid 
Examination procedure11.04.2012Examination requested  [2012/41]
27.05.2015Application deemed to be withdrawn, date of legal effect  [2015/47]
01.07.2015Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2015/47]
Fees paidRenewal fee
29.06.2012Renewal fee patent year 03
28.06.2013Renewal fee patent year 04
27.03.2014Renewal fee patent year 05
Penalty fee
Additional fee for renewal fee
30.06.201506   M06   Not yet paid
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[X]EP2056355  (SANYO ELECTRIC CO [JP]) [X] 8 * paragraphs [0025] , [0038] , [0039]; figures 6-8 *;
 [XI]WO2009099179  (SANYO ELECTRIC CO [JP], et al) [X] 8 * paragraph [0054]; figure 1 * [I] 9,10;
 [E]EP2267794  (SANYO ELECTRIC CO [JP]) [E] 8 * paragraph [0054]; figure 1 *;
 [X]WO2009099042  (SONY CHEM & INF DEVICE CORP [JP], et al) [X] 11 * paragraphs [0024] , [0025]; figure 1A *;
 [XP]EP2144283  (SONY CHEM & INF DEVICE CORP [JP]) [XP] 11 * paragraphs [0024] , [0025]; figure 1A *;
 [A]JPH02293721  (SHARP KK) [A] 1 * abstract *;
 [A]JPH0837208  (TOSHIBA CORP, et al) [A] 1 * abstract *;
 [A]JPH11204567  (SEIKO EPSON CORP) [A] 1 * abstract *
International search[A]WO2009099042  (SONY CHEM & INF DEVICE CORP [JP], et al);
 [A]JP2008135646  (SANYO ELECTRIC CO)
by applicantJP2005327922
 JP2008135652
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.