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Extract from the Register of European Patents

EP About this file: EP2461356

EP2461356 - Wafer mold material and method for manufacturing semiconductor apparatus [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  20.11.2020
Database last updated on 31.08.2024
FormerThe patent has been granted
Status updated on  13.12.2019
FormerGrant of patent is intended
Status updated on  31.07.2019
FormerExamination is in progress
Status updated on  10.04.2018
Most recent event   Tooltip08.07.2022Lapse of the patent in a contracting state
New state(s): MK		published on 10.08.2022  [2022/32]
Applicant(s)For all designated states
Shin-Etsu Chemical Co., Ltd.
6-1, Ohtemachi 2-chome
Chiyoda-ku
Tokyo / JP
[2019/35]
Former [2012/23]For all designated states
Shin-Etsu Chemical Co., Ltd.
6-2 Ohtemachi 2-chome Chiyoda-ku
Tokyo / JP
Inventor(s)01 / Sugo, Michihiro
Silicone Electronics Materials Research Center
Shin-Etsu Chemical Co., Ltd.
1-10, Hitomi
Matsuida-machi
Annaka-shi Gunma-ken / JP
02 / Kondo, Kazunori
Silicone Electronics Materials Research Center
Shin-Etsu Chemical Co., Ltd.
1-10, Hitomi
Matsuida-machi
Annaka-shi Gunma-ken / JP
03 / Kato, Hideto
Silicone Electronics Materials Research Center
Shin-Etsu Chemical Co., Ltd.
1-10, Hitomi
Matsuida-machi
Annaka-shi Gunma-ken / JP
 [2020/03]
Former [2012/23]01 / Sugo, Michihiro
Silicone Electronics Materials Research Center
Shin-Etsu Chemical., Ltd.
1-10, Hitomi
Matsuida-machi
Annaka-shi Gunma-ken / JP
02 / Kondo, Kazunori
Silicone Electronics Materials Research Center
Shin-Etsu Chemical., Ltd.
1-10, Hitomi
Matsuida-machi
Annaka-shi Gunma-ken / JP
03 / Kato, Hideto
Silicone Electronics Materials Research Center
Shin-Etsu Chemical., Ltd.
1-10, Hitomi
Matsuida-machi
Annaka-shi Gunma-ken / JP
Representative(s)Wibbelmann, Jobst
Wuesthoff & Wuesthoff
Patentanwälte und Rechtsanwalt PartG mbB
Schweigerstrasse 2
81541 München / DE
[N/P]
Former [2020/03]Wibbelmann, Jobst
Wuesthoff & Wuesthoff
Patentanwälte PartG mbB
Schweigerstrasse 2
81541 München / DE
Former [2012/23]Wibbelmann, Jobst
Wuesthoff & Wuesthoff Patent- und Rechtsanwälte Schweigerstrasse 2
81541 München / DE
Application number, filing date11009285.523.11.2011
[2012/23]
Priority number, dateJP2010027002703.12.2010         Original published format: JP 2010270027
[2012/23]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP2461356
Date:06.06.2012
Language:EN
[2012/23]
Type: B1 Patent specification 
No.:EP2461356
Date:15.01.2020
Language:EN
[2020/03]
Search report(s)(Supplementary) European search report - dispatched on:EP04.04.2012
ClassificationIPC:H01L21/56, H01L23/00, H01L23/29, C08L33/20, C08L63/00, C08L83/04, C08L83/06, C08G77/14, C08G77/455, C08L83/10
[2019/33]
CPC:
H01L23/295 (EP,US); H01L23/29 (KR); C08G59/56 (KR);
C08G59/62 (KR); C08G77/14 (EP,US); C08G77/455 (EP,US);
C08L33/20 (EP,US); C08L63/00 (EP,US); C08L83/06 (EP,US);
C08L83/10 (EP,US); H01L21/565 (EP,US); H01L24/97 (EP,US);
H01L2224/16225 (EP,US); H01L2224/32225 (EP,US); H01L2224/73204 (EP,US);
H01L2224/97 (EP,US); H01L2924/01029 (EP,US); H01L2924/12041 (EP,US);
H01L2924/15311 (EP,US); H01L2924/181 (EP,US) (-)
C-Set:
H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP);
H01L2224/97, H01L2224/81 (EP,US);
H01L2924/15311, H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP);
H01L2924/181, H01L2924/00012 (US,EP)
Former IPC [2012/23]H01L21/56, H01L23/29, C08L33/20, C08L63/00, C08L79/08, C08L83/04, C08L83/06
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/03]
Former [2012/23]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:Waferformmaterial und Verfahren zur Herstellung einer Halbleitervorrichtung[2012/23]
English:Wafer mold material and method for manufacturing semiconductor apparatus[2012/23]
French:Matériau de moule pour plaquettes et procédé de fabrication de l'appareil semi-conducteur[2012/23]
Examination procedure12.11.2012Amendment by applicant (claims and/or description)
12.11.2012Examination requested  [2012/52]
16.04.2014Despatch of a communication from the examining division (Time limit: M04)
07.08.2014Reply to a communication from the examining division
26.02.2016Despatch of a communication from the examining division (Time limit: M04)
24.06.2016Reply to a communication from the examining division
03.04.2018Despatch of a communication from the examining division (Time limit: M04)
02.08.2018Reply to a communication from the examining division
26.02.2019Despatch of a communication from the examining division (Time limit: M04)
25.06.2019Reply to a communication from the examining division
01.08.2019Communication of intention to grant the patent
02.12.2019Fee for grant paid
02.12.2019Fee for publishing/printing paid
02.12.2019Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  16.04.2014
Opposition(s)16.10.2020No opposition filed within time limit [2020/52]
Fees paidRenewal fee
18.11.2013Renewal fee patent year 03
10.11.2014Renewal fee patent year 04
10.11.2015Renewal fee patent year 05
10.11.2016Renewal fee patent year 06
13.11.2017Renewal fee patent year 07
14.11.2018Renewal fee patent year 08
14.11.2019Renewal fee patent year 09
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU23.11.2011
AL15.01.2020
AT15.01.2020
CY15.01.2020
CZ15.01.2020
DK15.01.2020
EE15.01.2020
ES15.01.2020
FI15.01.2020
HR15.01.2020
IT15.01.2020
LT15.01.2020
LV15.01.2020
MC15.01.2020
MK15.01.2020
MT15.01.2020
NL15.01.2020
PL15.01.2020
RO15.01.2020
RS15.01.2020
SE15.01.2020
SI15.01.2020
SK15.01.2020
SM15.01.2020
TR15.01.2020
BG15.04.2020
NO15.04.2020
GR16.04.2020
IS15.05.2020
PT07.06.2020
[2022/31]
Former [2022/30]HU23.11.2011
AL15.01.2020
AT15.01.2020
CY15.01.2020
CZ15.01.2020
DK15.01.2020
EE15.01.2020
ES15.01.2020
FI15.01.2020
HR15.01.2020
IT15.01.2020
LT15.01.2020
LV15.01.2020
MC15.01.2020
MT15.01.2020
NL15.01.2020
PL15.01.2020
RO15.01.2020
RS15.01.2020
SE15.01.2020
SI15.01.2020
SK15.01.2020
SM15.01.2020
TR15.01.2020
BG15.04.2020
NO15.04.2020
GR16.04.2020
IS15.05.2020
PT07.06.2020
Former [2022/27]HU23.11.2011
AT15.01.2020
CY15.01.2020
CZ15.01.2020
DK15.01.2020
EE15.01.2020
ES15.01.2020
FI15.01.2020
HR15.01.2020
IT15.01.2020
LT15.01.2020
LV15.01.2020
MC15.01.2020
MT15.01.2020
NL15.01.2020
PL15.01.2020
RO15.01.2020
RS15.01.2020
SE15.01.2020
SI15.01.2020
SK15.01.2020
SM15.01.2020
TR15.01.2020
BG15.04.2020
NO15.04.2020
GR16.04.2020
IS15.05.2020
PT07.06.2020
Former [2022/26]AT15.01.2020
CZ15.01.2020
DK15.01.2020
EE15.01.2020
ES15.01.2020
FI15.01.2020
HR15.01.2020
IT15.01.2020
LT15.01.2020
LV15.01.2020
MC15.01.2020
NL15.01.2020
PL15.01.2020
RO15.01.2020
RS15.01.2020
SE15.01.2020
SI15.01.2020
SK15.01.2020
SM15.01.2020
TR15.01.2020
BG15.04.2020
NO15.04.2020
GR16.04.2020
IS15.05.2020
PT07.06.2020
Former [2021/31]AT15.01.2020
CZ15.01.2020
DK15.01.2020
EE15.01.2020
ES15.01.2020
FI15.01.2020
HR15.01.2020
IT15.01.2020
LT15.01.2020
LV15.01.2020
MC15.01.2020
NL15.01.2020
PL15.01.2020
RO15.01.2020
RS15.01.2020
SE15.01.2020
SI15.01.2020
SK15.01.2020
SM15.01.2020
BG15.04.2020
NO15.04.2020
GR16.04.2020
IS15.05.2020
PT07.06.2020
Former [2021/10]AT15.01.2020
CZ15.01.2020
DK15.01.2020
EE15.01.2020
ES15.01.2020
FI15.01.2020
HR15.01.2020
IT15.01.2020
LT15.01.2020
LV15.01.2020
NL15.01.2020
PL15.01.2020
RO15.01.2020
RS15.01.2020
SE15.01.2020
SI15.01.2020
SK15.01.2020
SM15.01.2020
BG15.04.2020
NO15.04.2020
GR16.04.2020
IS15.05.2020
PT07.06.2020
Former [2020/50]CZ15.01.2020
DK15.01.2020
EE15.01.2020
ES15.01.2020
FI15.01.2020
HR15.01.2020
LT15.01.2020
LV15.01.2020
NL15.01.2020
RO15.01.2020
RS15.01.2020
SE15.01.2020
SK15.01.2020
SM15.01.2020
BG15.04.2020
NO15.04.2020
GR16.04.2020
IS15.05.2020
PT07.06.2020
Former [2020/49]CZ15.01.2020
DK15.01.2020
ES15.01.2020
FI15.01.2020
HR15.01.2020
LT15.01.2020
LV15.01.2020
NL15.01.2020
RO15.01.2020
RS15.01.2020
SE15.01.2020
SK15.01.2020
SM15.01.2020
BG15.04.2020
NO15.04.2020
GR16.04.2020
IS15.05.2020
PT07.06.2020
Former [2020/48]DK15.01.2020
ES15.01.2020
FI15.01.2020
HR15.01.2020
LT15.01.2020
LV15.01.2020
NL15.01.2020
RO15.01.2020
RS15.01.2020
SE15.01.2020
SM15.01.2020
BG15.04.2020
NO15.04.2020
GR16.04.2020
IS15.05.2020
PT07.06.2020
Former [2020/47]DK15.01.2020
ES15.01.2020
FI15.01.2020
HR15.01.2020
LT15.01.2020
LV15.01.2020
NL15.01.2020
RS15.01.2020
SE15.01.2020
BG15.04.2020
NO15.04.2020
GR16.04.2020
IS15.05.2020
PT07.06.2020
Former [2020/40]FI15.01.2020
HR15.01.2020
LV15.01.2020
NL15.01.2020
RS15.01.2020
SE15.01.2020
BG15.04.2020
NO15.04.2020
GR16.04.2020
IS15.05.2020
PT07.06.2020
Former [2020/39]FI15.01.2020
HR15.01.2020
LV15.01.2020
NL15.01.2020
RS15.01.2020
SE15.01.2020
BG15.04.2020
NO15.04.2020
GR16.04.2020
PT07.06.2020
Former [2020/38]FI15.01.2020
HR15.01.2020
LV15.01.2020
NL15.01.2020
RS15.01.2020
SE15.01.2020
NO15.04.2020
GR16.04.2020
PT07.06.2020
Former [2020/37]FI15.01.2020
HR15.01.2020
LV15.01.2020
NL15.01.2020
RS15.01.2020
SE15.01.2020
NO15.04.2020
PT07.06.2020
Former [2020/36]FI15.01.2020
NL15.01.2020
RS15.01.2020
NO15.04.2020
PT07.06.2020
Former [2020/35]FI15.01.2020
NL15.01.2020
NO15.04.2020
Former [2020/33]NL15.01.2020
Documents cited:Search[I]JPS6124258  (FUJITSU LTD) [I] 1-5 * abstract *;
 [I]US2001033016  (SUMIKAWA MASATO [JP], et al) [I] 1-5 * figures 1A-1E * * claims 3, 4 * * paragraph [0013] *;
 [A]DE102007032636  (INFINEON TECHNOLOGIES AG [DE]) [A] 1-5* figure 1 *;
 [A]US2009160071  (SHEN GENG-SHIN [TW]) [A] 1-5 * figures 3, 4 * * paragraphs [0025] - [0028] *;
 [A]US2010252940  (HUANG TANG-CHIEH [TW], et al) [A] 1-5 * figures 5, 6 *;
 [AP]EP2280044  (NAGASE CHEMTEX CORP [JP]) [AP] 1-5 * abstract *
ExaminationEP1777278
 US2007098995
 JP2009283927
 WO2010106780
 EP2410001
by applicantJP2004161886
 WO2009142065
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.