EP2461356 - Wafer mold material and method for manufacturing semiconductor apparatus [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 20.11.2020 Database last updated on 31.08.2024 | |
Former | The patent has been granted Status updated on 13.12.2019 | ||
Former | Grant of patent is intended Status updated on 31.07.2019 | ||
Former | Examination is in progress Status updated on 10.04.2018 | Most recent event Tooltip | 08.07.2022 | Lapse of the patent in a contracting state New state(s): MK | published on 10.08.2022 [2022/32] | Applicant(s) | For all designated states Shin-Etsu Chemical Co., Ltd. 6-1, Ohtemachi 2-chome Chiyoda-ku Tokyo / JP | [2019/35] |
Former [2012/23] | For all designated states Shin-Etsu Chemical Co., Ltd. 6-2 Ohtemachi 2-chome Chiyoda-ku Tokyo / JP | Inventor(s) | 01 /
Sugo, Michihiro Silicone Electronics Materials Research Center Shin-Etsu Chemical Co., Ltd. 1-10, Hitomi Matsuida-machi Annaka-shi Gunma-ken / JP | 02 /
Kondo, Kazunori Silicone Electronics Materials Research Center Shin-Etsu Chemical Co., Ltd. 1-10, Hitomi Matsuida-machi Annaka-shi Gunma-ken / JP | 03 /
Kato, Hideto Silicone Electronics Materials Research Center Shin-Etsu Chemical Co., Ltd. 1-10, Hitomi Matsuida-machi Annaka-shi Gunma-ken / JP | [2020/03] |
Former [2012/23] | 01 /
Sugo, Michihiro Silicone Electronics Materials Research Center Shin-Etsu Chemical., Ltd. 1-10, Hitomi Matsuida-machi Annaka-shi Gunma-ken / JP | ||
02 /
Kondo, Kazunori Silicone Electronics Materials Research Center Shin-Etsu Chemical., Ltd. 1-10, Hitomi Matsuida-machi Annaka-shi Gunma-ken / JP | |||
03 /
Kato, Hideto Silicone Electronics Materials Research Center Shin-Etsu Chemical., Ltd. 1-10, Hitomi Matsuida-machi Annaka-shi Gunma-ken / JP | Representative(s) | Wibbelmann, Jobst Wuesthoff & Wuesthoff Patentanwälte und Rechtsanwalt PartG mbB Schweigerstrasse 2 81541 München / DE | [N/P] |
Former [2020/03] | Wibbelmann, Jobst Wuesthoff & Wuesthoff Patentanwälte PartG mbB Schweigerstrasse 2 81541 München / DE | ||
Former [2012/23] | Wibbelmann, Jobst Wuesthoff & Wuesthoff Patent- und Rechtsanwälte Schweigerstrasse 2 81541 München / DE | Application number, filing date | 11009285.5 | 23.11.2011 | [2012/23] | Priority number, date | JP20100270027 | 03.12.2010 Original published format: JP 2010270027 | [2012/23] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP2461356 | Date: | 06.06.2012 | Language: | EN | [2012/23] | Type: | B1 Patent specification | No.: | EP2461356 | Date: | 15.01.2020 | Language: | EN | [2020/03] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 04.04.2012 | Classification | IPC: | H01L21/56, H01L23/00, H01L23/29, C08L33/20, C08L63/00, C08L83/04, C08L83/06, C08G77/14, C08G77/455, C08L83/10 | [2019/33] | CPC: |
H01L23/295 (EP,US);
H01L23/29 (KR);
C08G59/56 (KR);
C08G59/62 (KR);
C08G77/14 (EP,US);
C08G77/455 (EP,US);
C08L33/20 (EP,US);
C08L63/00 (EP,US);
C08L83/06 (EP,US);
C08L83/10 (EP,US);
H01L21/565 (EP,US);
H01L24/97 (EP,US);
H01L2224/16225 (EP,US);
H01L2224/32225 (EP,US);
H01L2224/73204 (EP,US);
H01L2224/97 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/12041 (EP,US);
| C-Set: |
H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP);
H01L2224/97, H01L2224/81 (EP,US);
H01L2924/15311, H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP);
H01L2924/181, H01L2924/00012 (US,EP) |
Former IPC [2012/23] | H01L21/56, H01L23/29, C08L33/20, C08L63/00, C08L79/08, C08L83/04, C08L83/06 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2020/03] |
Former [2012/23] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | Waferformmaterial und Verfahren zur Herstellung einer Halbleitervorrichtung | [2012/23] | English: | Wafer mold material and method for manufacturing semiconductor apparatus | [2012/23] | French: | Matériau de moule pour plaquettes et procédé de fabrication de l'appareil semi-conducteur | [2012/23] | Examination procedure | 12.11.2012 | Amendment by applicant (claims and/or description) | 12.11.2012 | Examination requested [2012/52] | 16.04.2014 | Despatch of a communication from the examining division (Time limit: M04) | 07.08.2014 | Reply to a communication from the examining division | 26.02.2016 | Despatch of a communication from the examining division (Time limit: M04) | 24.06.2016 | Reply to a communication from the examining division | 03.04.2018 | Despatch of a communication from the examining division (Time limit: M04) | 02.08.2018 | Reply to a communication from the examining division | 26.02.2019 | Despatch of a communication from the examining division (Time limit: M04) | 25.06.2019 | Reply to a communication from the examining division | 01.08.2019 | Communication of intention to grant the patent | 02.12.2019 | Fee for grant paid | 02.12.2019 | Fee for publishing/printing paid | 02.12.2019 | Receipt of the translation of the claim(s) | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 16.04.2014 | Opposition(s) | 16.10.2020 | No opposition filed within time limit [2020/52] | Fees paid | Renewal fee | 18.11.2013 | Renewal fee patent year 03 | 10.11.2014 | Renewal fee patent year 04 | 10.11.2015 | Renewal fee patent year 05 | 10.11.2016 | Renewal fee patent year 06 | 13.11.2017 | Renewal fee patent year 07 | 14.11.2018 | Renewal fee patent year 08 | 14.11.2019 | Renewal fee patent year 09 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 23.11.2011 | AL | 15.01.2020 | AT | 15.01.2020 | CY | 15.01.2020 | CZ | 15.01.2020 | DK | 15.01.2020 | EE | 15.01.2020 | ES | 15.01.2020 | FI | 15.01.2020 | HR | 15.01.2020 | IT | 15.01.2020 | LT | 15.01.2020 | LV | 15.01.2020 | MC | 15.01.2020 | MK | 15.01.2020 | MT | 15.01.2020 | NL | 15.01.2020 | PL | 15.01.2020 | RO | 15.01.2020 | RS | 15.01.2020 | SE | 15.01.2020 | SI | 15.01.2020 | SK | 15.01.2020 | SM | 15.01.2020 | TR | 15.01.2020 | BG | 15.04.2020 | NO | 15.04.2020 | GR | 16.04.2020 | IS | 15.05.2020 | PT | 07.06.2020 | [2022/31] |
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SM | 15.01.2020 | ||
TR | 15.01.2020 | ||
BG | 15.04.2020 | ||
NO | 15.04.2020 | ||
GR | 16.04.2020 | ||
IS | 15.05.2020 | ||
PT | 07.06.2020 | ||
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GR | 16.04.2020 | ||
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GR | 16.04.2020 | ||
IS | 15.05.2020 | ||
PT | 07.06.2020 | ||
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GR | 16.04.2020 | ||
IS | 15.05.2020 | ||
PT | 07.06.2020 | ||
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PT | 07.06.2020 | ||
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IS | 15.05.2020 | ||
PT | 07.06.2020 | ||
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BG | 15.04.2020 | ||
NO | 15.04.2020 | ||
GR | 16.04.2020 | ||
IS | 15.05.2020 | ||
PT | 07.06.2020 | ||
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FI | 15.01.2020 | ||
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BG | 15.04.2020 | ||
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PT | 07.06.2020 | ||
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IS | 15.05.2020 | ||
PT | 07.06.2020 | ||
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HR | 15.01.2020 | ||
LV | 15.01.2020 | ||
NL | 15.01.2020 | ||
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BG | 15.04.2020 | ||
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GR | 16.04.2020 | ||
PT | 07.06.2020 | ||
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NL | 15.01.2020 | ||
RS | 15.01.2020 | ||
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NO | 15.04.2020 | ||
GR | 16.04.2020 | ||
PT | 07.06.2020 | ||
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HR | 15.01.2020 | ||
LV | 15.01.2020 | ||
NL | 15.01.2020 | ||
RS | 15.01.2020 | ||
SE | 15.01.2020 | ||
NO | 15.04.2020 | ||
PT | 07.06.2020 | ||
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NL | 15.01.2020 | ||
RS | 15.01.2020 | ||
NO | 15.04.2020 | ||
PT | 07.06.2020 | ||
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NL | 15.01.2020 | ||
NO | 15.04.2020 | ||
Former [2020/33] | NL | 15.01.2020 | Documents cited: | Search | [I]JPS6124258 (FUJITSU LTD) [I] 1-5 * abstract *; | [I]US2001033016 (SUMIKAWA MASATO [JP], et al) [I] 1-5 * figures 1A-1E * * claims 3, 4 * * paragraph [0013] *; | [A]DE102007032636 (INFINEON TECHNOLOGIES AG [DE]) [A] 1-5* figure 1 *; | [A]US2009160071 (SHEN GENG-SHIN [TW]) [A] 1-5 * figures 3, 4 * * paragraphs [0025] - [0028] *; | [A]US2010252940 (HUANG TANG-CHIEH [TW], et al) [A] 1-5 * figures 5, 6 *; | [AP]EP2280044 (NAGASE CHEMTEX CORP [JP]) [AP] 1-5 * abstract * | Examination | EP1777278 | US2007098995 | JP2009283927 | WO2010106780 | EP2410001 | by applicant | JP2004161886 | WO2009142065 |