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Extract from the Register of European Patents

EP About this file: EP2434539

EP2434539 - System and method of chip package build-up [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  02.12.2022
Database last updated on 20.12.2024
FormerThe patent has been granted
Status updated on  24.12.2021
FormerGrant of patent is intended
Status updated on  15.08.2021
FormerRequest for examination was made
Status updated on  20.07.2018
Most recent event   Tooltip06.09.2024Lapse of the patent in a contracting state
New state(s): MT
published on 09.10.2024  [2024/41]
Applicant(s)For all designated states
General Electric Company
1 River Road
Schenectady, NY 12345 / US
[2022/04]
Former [2012/13]For all designated states
General Electric Company
1 River Road
Schenectady, NY 12345 / US
Inventor(s)01 / McConnelee, Paul Alan
One Research Circle
Niskayuna, NY 12309 / US
02 / Durocher, Kevin Matthew
One Research Circle
Mail Stop KW B1313
Niskayuna, NY 12309 / US
03 / Smith, Scott
One Research Circle
Niskayuna, NY 12309 / US
04 / Principe, Laura A.
One Research Circle
Niskayuna, NY 12309 / US
 [2012/13]
Representative(s)Dennemeyer & Associates S.A.
Landaubogen 1-3
81373 München / DE
[2022/04]
Former [2012/13]Bedford, Grant Richard
Global Patent Operation - Europe GE International Inc. 15 John Adam Street
London WC2N 6LU / GB
Application number, filing date11174096.515.07.2011
[2012/13]
Priority number, dateUS2010084360626.07.2010         Original published format: US 843606
[2012/13]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP2434539
Date:28.03.2012
Language:EN
[2012/13]
Type: A3 Search report 
No.:EP2434539
Date:17.01.2018
Language:EN
[2018/03]
Type: B1 Patent specification 
No.:EP2434539
Date:26.01.2022
Language:EN
[2022/04]
Search report(s)(Supplementary) European search report - dispatched on:EP18.12.2017
ClassificationIPC:H01L21/60, H01L23/48
[2012/13]
CPC:
H01L24/27 (EP,US); H01L23/48 (KR); H01L23/562 (US);
H01L23/481 (KR); H01L23/5226 (US); H01L24/19 (EP,US);
H01L24/24 (EP,US); H01L24/29 (EP,US); H01L24/32 (EP,US);
H01L24/82 (EP,US); H01L24/83 (EP,US); H01L24/97 (EP,US);
H01L2224/04105 (EP,US); H01L2224/29101 (EP,US); H01L2224/2919 (EP,US);
H01L2224/82039 (EP,US); H01L2224/82047 (EP,US); H01L2224/83101 (EP,US);
H01L2224/83192 (EP,US); H01L2224/83194 (EP,US); H01L2224/83856 (EP,US);
H01L2224/92 (EP,US); H01L2224/92144 (EP,US); H01L2224/97 (EP,US);
H01L2924/01005 (EP,US); H01L2924/01024 (EP,US); H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US); H01L2924/01075 (EP,US); H01L2924/01078 (EP,US);
H01L2924/014 (EP,US); H01L2924/0665 (EP,US); H01L2924/10253 (EP,US);
H01L2924/12042 (EP,US); H01L2924/14 (EP,US); H01L2924/15151 (EP,US);
H01L2924/17151 (EP,US); H01L2924/19105 (EP,US) (-)
C-Set:
H01L2224/29101, H01L2924/014, H01L2924/00 (EP,US);
H01L2224/2919, H01L2924/0665 (US,EP);
H01L2224/2919, H01L2924/0665, H01L2924/00 (EP,US);
H01L2224/83192, H01L2224/83101, H01L2924/00 (EP,US);
H01L2224/92, H01L2224/83, H01L2224/82 (US,EP);
H01L2224/97, H01L2224/82 (US,EP);
H01L2924/0665, H01L2924/00 (US,EP);
H01L2924/12042, H01L2924/00 (EP,US)
(-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2018/34]
Former [2012/13]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:System und Verfahren für Chipgehäuse[2022/03]
English:System and method of chip package build-up[2012/13]
French:Système et procédé d'accumulation d'emballage de puces[2012/13]
Former [2012/13]System und Verfahren für Chipverkapselungsaufbau
Examination procedure15.07.2011Date on which the examining division has become responsible
16.07.2018Amendment by applicant (claims and/or description)
17.07.2018Examination requested  [2018/34]
16.08.2021Communication of intention to grant the patent
14.12.2021Fee for grant paid
14.12.2021Fee for publishing/printing paid
14.12.2021Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  16.08.2021
Opposition(s)27.10.2022No opposition filed within time limit [2023/01]
Fees paidRenewal fee
31.07.2013Renewal fee patent year 03
31.07.2014Renewal fee patent year 04
31.07.2015Renewal fee patent year 05
01.08.2016Renewal fee patent year 06
31.07.2017Renewal fee patent year 07
31.01.2019Renewal fee patent year 08
22.07.2019Renewal fee patent year 09
22.07.2020Renewal fee patent year 10
20.07.2021Renewal fee patent year 11
Penalty fee
Additional fee for renewal fee
31.07.201808   M06   Fee paid on   31.01.2019
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Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU15.07.2011
AL26.01.2022
AT26.01.2022
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CZ26.01.2022
DK26.01.2022
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GR27.04.2022
IS26.05.2022
PT26.05.2022
IE15.07.2022
LU15.07.2022
BE31.07.2022
CH31.07.2022
LI31.07.2022
[2024/41]
Former [2024/29]HU15.07.2011
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GR27.04.2022
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PT26.05.2022
IE15.07.2022
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BE31.07.2022
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Former [2024/22]HU15.07.2011
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NO26.04.2022
GR27.04.2022
IS26.05.2022
PT26.05.2022
IE15.07.2022
LU15.07.2022
BE31.07.2022
CH31.07.2022
LI31.07.2022
Former [2024/20]HU15.07.2011
AL26.01.2022
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DK26.01.2022
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BG26.04.2022
NO26.04.2022
GR27.04.2022
IS26.05.2022
PT26.05.2022
IE15.07.2022
LU15.07.2022
BE31.07.2022
CH31.07.2022
LI31.07.2022
Former [2024/18]HU15.07.2011
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DK26.01.2022
EE26.01.2022
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BG26.04.2022
NO26.04.2022
GR27.04.2022
IS26.05.2022
PT26.05.2022
IE15.07.2022
LU15.07.2022
BE31.07.2022
CH31.07.2022
LI31.07.2022
Former [2023/35]AL26.01.2022
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CZ26.01.2022
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EE26.01.2022
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BG26.04.2022
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GR27.04.2022
IS26.05.2022
PT26.05.2022
IE15.07.2022
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BE31.07.2022
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LI31.07.2022
Former [2023/33]AL26.01.2022
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SM26.01.2022
BG26.04.2022
NO26.04.2022
GR27.04.2022
IS26.05.2022
PT26.05.2022
IE15.07.2022
LU15.07.2022
BE31.07.2022
CH31.07.2022
LI31.07.2022
Former [2023/25]AL26.01.2022
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BG26.04.2022
NO26.04.2022
GR27.04.2022
IS26.05.2022
PT26.05.2022
LU15.07.2022
BE31.07.2022
CH31.07.2022
LI31.07.2022
Former [2023/21]AL26.01.2022
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BG26.04.2022
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GR27.04.2022
IS26.05.2022
PT26.05.2022
LU15.07.2022
CH31.07.2022
LI31.07.2022
Former [2023/11]AL26.01.2022
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GR27.04.2022
IS26.05.2022
PT26.05.2022
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DK26.01.2022
EE26.01.2022
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FI26.01.2022
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LT26.01.2022
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NL26.01.2022
PL26.01.2022
RO26.01.2022
RS26.01.2022
SE26.01.2022
SK26.01.2022
SM26.01.2022
BG26.04.2022
NO26.04.2022
GR27.04.2022
IS26.05.2022
PT26.05.2022
Former [2022/49]AT26.01.2022
CZ26.01.2022
DK26.01.2022
EE26.01.2022
ES26.01.2022
FI26.01.2022
HR26.01.2022
LT26.01.2022
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PL26.01.2022
RO26.01.2022
RS26.01.2022
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SK26.01.2022
SM26.01.2022
BG26.04.2022
NO26.04.2022
GR27.04.2022
IS26.05.2022
PT26.05.2022
Former [2022/48]AT26.01.2022
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BG26.04.2022
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GR27.04.2022
IS26.05.2022
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Documents cited:Search[I]US5355102  (KORNRUMPF WILLIAM P [US], et al) [I] 1,6,9,10 * column 7, line 49 - line 55 * * column 13, line 42 - column 16, line 21 * * figures 2,3,4 *;
 [I]US5401687  (COLE HERBERT S [US], et al) [I] 1,5,6,9,10 * figures 2(b)-2(e) * * column 1, line 9 - line 12 * * column 1, line 60 - column 2, line 21 * * column 3, line 12 - column 9, line 23 *;
 [I]EP1215726  (GEN ELECTRIC [US]) [I] 1,5,6,9,10* paragraphs [0001] , [0006] , [0007] , [0008] , [0013] - [0025]; figures 1-7 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.