EP2434539 - System and method of chip package build-up [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 02.12.2022 Database last updated on 20.12.2024 | |
Former | The patent has been granted Status updated on 24.12.2021 | ||
Former | Grant of patent is intended Status updated on 15.08.2021 | ||
Former | Request for examination was made Status updated on 20.07.2018 | Most recent event Tooltip | 06.09.2024 | Lapse of the patent in a contracting state New state(s): MT | published on 09.10.2024 [2024/41] | Applicant(s) | For all designated states General Electric Company 1 River Road Schenectady, NY 12345 / US | [2022/04] |
Former [2012/13] | For all designated states General Electric Company 1 River Road Schenectady, NY 12345 / US | Inventor(s) | 01 /
McConnelee, Paul Alan One Research Circle Niskayuna, NY 12309 / US | 02 /
Durocher, Kevin Matthew One Research Circle Mail Stop KW B1313 Niskayuna, NY 12309 / US | 03 /
Smith, Scott One Research Circle Niskayuna, NY 12309 / US | 04 /
Principe, Laura A. One Research Circle Niskayuna, NY 12309 / US | [2012/13] | Representative(s) | Dennemeyer & Associates S.A. Landaubogen 1-3 81373 München / DE | [2022/04] |
Former [2012/13] | Bedford, Grant Richard Global Patent Operation - Europe GE International Inc. 15 John Adam Street London WC2N 6LU / GB | Application number, filing date | 11174096.5 | 15.07.2011 | [2012/13] | Priority number, date | US20100843606 | 26.07.2010 Original published format: US 843606 | [2012/13] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP2434539 | Date: | 28.03.2012 | Language: | EN | [2012/13] | Type: | A3 Search report | No.: | EP2434539 | Date: | 17.01.2018 | Language: | EN | [2018/03] | Type: | B1 Patent specification | No.: | EP2434539 | Date: | 26.01.2022 | Language: | EN | [2022/04] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 18.12.2017 | Classification | IPC: | H01L21/60, H01L23/48 | [2012/13] | CPC: |
H01L24/27 (EP,US);
H01L23/48 (KR);
H01L23/562 (US);
H01L23/481 (KR);
H01L23/5226 (US);
H01L24/19 (EP,US);
H01L24/24 (EP,US);
H01L24/29 (EP,US);
H01L24/32 (EP,US);
H01L24/82 (EP,US);
H01L24/83 (EP,US);
H01L24/97 (EP,US);
H01L2224/04105 (EP,US);
H01L2224/29101 (EP,US);
H01L2224/2919 (EP,US);
H01L2224/82039 (EP,US);
H01L2224/82047 (EP,US);
H01L2224/83101 (EP,US);
H01L2224/83192 (EP,US);
H01L2224/83194 (EP,US);
H01L2224/83856 (EP,US);
H01L2224/92 (EP,US);
H01L2224/92144 (EP,US);
H01L2224/97 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01024 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01075 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/014 (EP,US);
H01L2924/0665 (EP,US);
H01L2924/10253 (EP,US);
H01L2924/12042 (EP,US);
H01L2924/14 (EP,US);
H01L2924/15151 (EP,US);
| C-Set: |
H01L2224/29101, H01L2924/014, H01L2924/00 (EP,US);
H01L2224/2919, H01L2924/0665 (US,EP);
H01L2224/2919, H01L2924/0665, H01L2924/00 (EP,US);
H01L2224/83192, H01L2224/83101, H01L2924/00 (EP,US);
H01L2224/92, H01L2224/83, H01L2224/82 (US,EP);
H01L2224/97, H01L2224/82 (US,EP); | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2018/34] |
Former [2012/13] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | System und Verfahren für Chipgehäuse | [2022/03] | English: | System and method of chip package build-up | [2012/13] | French: | Système et procédé d'accumulation d'emballage de puces | [2012/13] |
Former [2012/13] | System und Verfahren für Chipverkapselungsaufbau | Examination procedure | 15.07.2011 | Date on which the examining division has become responsible | 16.07.2018 | Amendment by applicant (claims and/or description) | 17.07.2018 | Examination requested [2018/34] | 16.08.2021 | Communication of intention to grant the patent | 14.12.2021 | Fee for grant paid | 14.12.2021 | Fee for publishing/printing paid | 14.12.2021 | Receipt of the translation of the claim(s) | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 16.08.2021 | Opposition(s) | 27.10.2022 | No opposition filed within time limit [2023/01] | Fees paid | Renewal fee | 31.07.2013 | Renewal fee patent year 03 | 31.07.2014 | Renewal fee patent year 04 | 31.07.2015 | Renewal fee patent year 05 | 01.08.2016 | Renewal fee patent year 06 | 31.07.2017 | Renewal fee patent year 07 | 31.01.2019 | Renewal fee patent year 08 | 22.07.2019 | Renewal fee patent year 09 | 22.07.2020 | Renewal fee patent year 10 | 20.07.2021 | Renewal fee patent year 11 | Penalty fee | Additional fee for renewal fee | 31.07.2018 | 08   M06   Fee paid on   31.01.2019 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 15.07.2011 | AL | 26.01.2022 | AT | 26.01.2022 | CY | 26.01.2022 | CZ | 26.01.2022 | DK | 26.01.2022 | EE | 26.01.2022 | ES | 26.01.2022 | FI | 26.01.2022 | HR | 26.01.2022 | IT | 26.01.2022 | LT | 26.01.2022 | LV | 26.01.2022 | MC | 26.01.2022 | MK | 26.01.2022 | MT | 26.01.2022 | NL | 26.01.2022 | PL | 26.01.2022 | RO | 26.01.2022 | RS | 26.01.2022 | SE | 26.01.2022 | SI | 26.01.2022 | SK | 26.01.2022 | SM | 26.01.2022 | TR | 26.01.2022 | BG | 26.04.2022 | NO | 26.04.2022 | GR | 27.04.2022 | IS | 26.05.2022 | PT | 26.05.2022 | IE | 15.07.2022 | LU | 15.07.2022 | BE | 31.07.2022 | CH | 31.07.2022 | LI | 31.07.2022 | [2024/41] |
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Former [2022/30] | NL | 26.01.2022 | Documents cited: | Search | [I]US5355102 (KORNRUMPF WILLIAM P [US], et al) [I] 1,6,9,10 * column 7, line 49 - line 55 * * column 13, line 42 - column 16, line 21 * * figures 2,3,4 *; | [I]US5401687 (COLE HERBERT S [US], et al) [I] 1,5,6,9,10 * figures 2(b)-2(e) * * column 1, line 9 - line 12 * * column 1, line 60 - column 2, line 21 * * column 3, line 12 - column 9, line 23 *; | [I]EP1215726 (GEN ELECTRIC [US]) [I] 1,5,6,9,10* paragraphs [0001] , [0006] , [0007] , [0008] , [0013] - [0025]; figures 1-7 * |