EP2410767 - MEMS dynamic pressure sensor, in particular for microphone-making applications [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 30.06.2017 Database last updated on 03.09.2024 | Most recent event Tooltip | 10.07.2020 | Lapse of the patent in a contracting state New state(s): IS | published on 12.08.2020 [2020/33] | Applicant(s) | For all designated states Commissariat à l'Énergie Atomique et aux Énergies Alternatives Bâtiment "Le Ponant D" 25, rue Leblanc 75015 Paris / FR | [2012/04] | Inventor(s) | 01 /
ROBERT, Philippe 4, rue de Boston 38000 GRENOBLE / FR | 02 /
WALTHER, Arnaud 5, rue d'Alsace 38000 GRENOBLE / FR | [2012/04] | Representative(s) | Ilgart, Jean-Christophe BREVALEX 95, Rue d'Amsterdam 75378 Paris Cedex 8 / FR | [N/P] |
Former [2016/34] | Ilgart, Jean-Christophe BREVALEX 95, rue d'Amsterdam 75378 Paris Cedex 8 / FR | ||
Former [2012/04] | Ilgart, Jean-Christophe BREVALEX 95 rue d'Amsterdam 75378 Paris Cedex 8 / FR | Application number, filing date | 11174608.7 | 20.07.2011 | [2012/04] | Priority number, date | FR20100056002 | 22.07.2010 Original published format: FR 1056002 | [2012/04] | Filing language | FR | Procedural language | FR | Publication | Type: | A1 Application with search report | No.: | EP2410767 | Date: | 25.01.2012 | Language: | FR | [2012/04] | Type: | B1 Patent specification | No.: | EP2410767 | Date: | 24.08.2016 | Language: | FR | [2016/34] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 17.10.2011 | Classification | IPC: | H04R9/08, H04R11/04, H04R19/00, H04R19/04 | [2012/04] | CPC: |
H04R19/005 (EP,US);
B81B3/0021 (EP,US);
H04R11/04 (EP,US);
H04R19/04 (EP,US);
H04R9/08 (EP,US);
B81B2201/0257 (EP,US);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2016/34] |
Former [2012/04] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | Dynamischer MEMS-Drucksensor, insbesondere für Anwendungen im Zusammenhang mit der Herstellung von Mikrophonen | [2012/04] | English: | MEMS dynamic pressure sensor, in particular for microphone-making applications | [2012/04] | French: | Capteur de pression dynamique mems, en particulier pour des applications à la réalisation de microphones | [2012/04] | Examination procedure | 11.07.2012 | Amendment by applicant (claims and/or description) | 11.07.2012 | Examination requested [2012/34] | 16.07.2014 | Despatch of a communication from the examining division (Time limit: M06) | 15.01.2015 | Reply to a communication from the examining division | 17.07.2015 | Despatch of a communication from the examining division (Time limit: M04) | 30.10.2015 | Reply to a communication from the examining division | 15.03.2016 | Communication of intention to grant the patent | 13.07.2016 | Fee for grant paid | 13.07.2016 | Fee for publishing/printing paid | 13.07.2016 | Receipt of the translation of the claim(s) | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 16.07.2014 | Opposition(s) | 26.05.2017 | No opposition filed within time limit [2017/31] | Fees paid | Renewal fee | 21.06.2013 | Renewal fee patent year 03 | 25.06.2014 | Renewal fee patent year 04 | 29.06.2015 | Renewal fee patent year 05 | 30.06.2016 | Renewal fee patent year 06 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 20.07.2011 | AL | 24.08.2016 | AT | 24.08.2016 | CY | 24.08.2016 | CZ | 24.08.2016 | DK | 24.08.2016 | EE | 24.08.2016 | ES | 24.08.2016 | FI | 24.08.2016 | HR | 24.08.2016 | IT | 24.08.2016 | LT | 24.08.2016 | LV | 24.08.2016 | MC | 24.08.2016 | MK | 24.08.2016 | MT | 24.08.2016 | NL | 24.08.2016 | PL | 24.08.2016 | RO | 24.08.2016 | RS | 24.08.2016 | SE | 24.08.2016 | SI | 24.08.2016 | SK | 24.08.2016 | SM | 24.08.2016 | TR | 24.08.2016 | BG | 24.11.2016 | NO | 24.11.2016 | GR | 25.11.2016 | IS | 24.12.2016 | PT | 26.12.2016 | [2020/33] |
Former [2020/15] | HU | 20.07.2011 | |
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Former [2017/07] | LT | 24.08.2016 | Documents cited: | Search | [IY]JPS5850895 (NIPPON ELECTRIC CO) [I] 1,4-12,15 * abstract * [Y] 2; | [IY]GB2218303 (PRIMO CO LTD [JP]) [I] 1,4-7,9-12,15 * abstract * * page 1, paragraph 2 * * page 5, paragraph 4 * * page 8, paragraph 1 * [Y] 2; | [IY]WO9319561 (MOTOROLA INC [US]) [I] 1,4-12,15 * abstract * * page 1, line 10 - page 3, line 6 * * page 5, line 29 - page 7, line 23 * * page 8, line 23 - page 9, line 6 * [Y] 2; | [A]WO9414240 (UNIV CALIFORNIA [US]) [A] 4 * abstract *; | [A]US2002009202 (SHEPLAK MARK [US], et al) [A] 1 * abstract * * paragraphs [0003] , [0017] , [0019] - [0025] - [0095] , [0114] *; | [A]US2005052723 (WATANABE SHIN-ICHIRO [JP], et al) [A] 4 * abstract *; | [A]WO2005031299 (NANTERO INC [US], et al) [A] 1* abstract *; | [A]DE102005008511 (EPCOS AG [DE]) [A] 1-15 * abstract *; | [IY]EP1978779 (FUNAI EAA TECH RES INST INC [JP], et al) [I] 1,4-7,9-12,15 * abstract * * paragraphs [0007] , [0019] - [0021] - [0053] - [0068] - [0070] - [0072] - [0128] * [Y] 2; | [YD] - MATTHIAS WINTER ET AL, "Influence of a chip scale package on the frequency response of a MEMS microphone", MICROSYSTEM TECHNOLOGIES ; MICRO AND NANOSYSTEMS INFORMATION STORAGE AND PROCESSING SYSTEMS, SPRINGER, BERLIN, DE, (20091225), vol. 16, no. 5, ISSN 1432-1858, pages 809 - 815, XP019804454 [YD] 2 * abstract * | [A] - PETERSEN K ET AL, "Resonant beam pressure sensor fabricated with silicon fusion bonding", TRANSDUCERS. SAN FRANCISCO, JUNE 24 - 27, 1991; [PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON SOLID STATE SENSORS AND ACTUATORS], NEW YORK, IEEE, US, (19910624), vol. CONF. 6, doi:10.1109/SENSOR.1991.148968, ISBN 978-0-87942-585-2, pages 664 - 667, XP010037438 [A] 5 * abstract * DOI: http://dx.doi.org/10.1109/SENSOR.1991.148968 | by applicant | FR957462 | US2007222011 | - A. DEHE, "Silicon microphone development and application", SENSOR AND ACTUATORS A, vol. 1333, pages 283 - 287 | - M. BRAUER ET AL., "Improved signal-to-noise ratio of Silicon microphones by a high-impedance resistor", J.MICROMECH. MICROENG., (2004), vol. 14, pages 86 - 89 |