EP2429270 - Multilayer circuit board and production method thereof and communication device [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 15.08.2014 Database last updated on 06.11.2024 | Most recent event Tooltip | 15.08.2014 | Withdrawal of application | published on 17.09.2014 [2014/38] | Applicant(s) | For all designated states Huawei Technologies Co., Ltd. Huawei Administration Building Bantian Longgang District Shenzhen, Guangdong 518129 / CN | [N/P] |
Former [2012/11] | For all designated states Huawei Technologies Co., Ltd. Huawei Administration Building Bantian Longgang District, Shenzhen Guangdong 518129 / CN | Inventor(s) | 01 /
Huang, Mingli c/o Huawei Technologies Co., Ltd. Huawei Administration Building Bantian, Longgang District 518129 Shenzhen / CN | 02 /
Zhang, Shun c/o Huawei Technologies Co., Ltd. Huawei Administration Building Bantian, Longgang District 518129 Shenzhen / CN | 03 /
Yang, Xichen c/o Huawei Technologies Co., Ltd. Huawei Administration Building Bantian, Longgang District 518129 Shenzhen / CN | 04 /
Zhao, Junying c/o Huawei Technologies Co., Ltd. Huawei Administration Building Bantian, Longgang District 518129 Shenzhen / CN | 05 /
Luo, Bing c/o Huawei Technologies Co., Ltd. Huawei Administration Building Bantian, Longgang District 518129 Shenzhen / CN | 06 /
Li, Zhihai c/o Huawei Technologies Co., Ltd. Huawei Administration Building Bantian, Longgang District 518129 Shenzhen / CN | 07 /
Wang, Guoliang c/o Huawei Technologies Co., Ltd. Huawei Administration Building Bantian, Longgang District 518129 Shenzhen / CN | [2012/11] | Representative(s) | Körber, Martin Hans Mitscherlich PartmbB Patent- und Rechtsanwälte Sonnenstrasse 33 80331 München / DE | [N/P] |
Former [2012/11] | Körber, Martin Hans Mitscherlich & Partner Patent- und Rechtsanwälte Sonnenstraße 33 80331 München / DE | Application number, filing date | 11192345.4 | 24.04.2009 | [2012/11] | Priority number, date | CN200810216597 | 28.09.2008 Original published format: CN200810216597 | CN20091005975 | 22.01.2009 Original published format: CN200910005975 | [2012/11] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP2429270 | Date: | 14.03.2012 | Language: | EN | [2012/11] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 01.02.2012 | Classification | IPC: | H05K3/46 | [2012/11] | CPC: |
H05K1/0206 (EP,US);
H05K3/4614 (CN);
H05K1/0201 (CN);
H05K1/0204 (EP,US);
H05K3/4038 (EP);
H05K2201/09309 (EP,US);
H05K2201/09554 (EP);
H05K2201/10416 (EP,US);
H05K2203/063 (EP,US);
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR [2012/11] | Title | German: | Mehrschichtleiterplatte und Herstellungsverfahren dafür sowie Kommunikationsvorrichtung | [2012/11] | English: | Multilayer circuit board and production method thereof and communication device | [2012/11] | French: | Carte à circuit multicouche et procédé de production et dispositif de communication | [2012/11] | Examination procedure | 07.12.2011 | Examination requested [2012/11] | 11.09.2012 | Amendment by applicant (claims and/or description) | 19.12.2012 | Despatch of a communication from the examining division (Time limit: M04) | 12.04.2013 | Reply to a communication from the examining division | 08.08.2014 | Application withdrawn by applicant [2014/38] | 08.08.2014 | Cancellation of oral proceeding that was planned for 17.09.2014 | 17.09.2014 | Date of oral proceedings (cancelled) | Parent application(s) Tooltip | EP09815564.1 / EP2227076 | Divisional application(s) | EP14179125.1 / EP2822369 | EP18195346.4 | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued (EP20090815564) is 19.12.2012 | Fees paid | Renewal fee | 07.12.2011 | Renewal fee patent year 03 | 30.03.2012 | Renewal fee patent year 04 | 29.04.2013 | Renewal fee patent year 05 | 28.04.2014 | Renewal fee patent year 06 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP1261028 (HITACHI LTD [JP]); | [A]WO2004103038 (MERIX CORP [US], et al); | [Y]US2007284711 (LEE TIEN YU T [US], et al); | [Y]US2008158821 (SANDWALL JOHAN [SE]) | Examination | EP1628515 | WO2006059923 | WO2007096313 |