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Extract from the Register of European Patents

EP About this file: EP2506295

EP2506295 - Bonding apparatus and bonding method [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  15.09.2017
Database last updated on 17.09.2024
Most recent event   Tooltip15.09.2017Withdrawal of applicationpublished on 18.10.2017  [2017/42]
Applicant(s)For all designated states
Apic Yamada Corporation
90 Ooaza Kamitokuma, Togura-machi Hanishina-gun
Nagano 389-0898 / JP
[2012/40]
Inventor(s)01 / Kobayashi, Kazuhiko, @ Apic Yamada Corporation
90, Ooaza Kamitokuma
Chikuma-shi, Nagano 389-0898 / JP
 [2012/40]
Representative(s)Bailey, Sam Rogerson, et al
Mewburn Ellis LLP
City Tower
40 Basinghall Street
London EC2V 5DE / GB
[N/P]
Former [2012/40]Stuart, Ian Alexander, et al
Mewburn Ellis LLP 33 Gutter Lane London
EC2V 8AS / GB
Application number, filing date11250676.127.07.2011
[2012/40]
Priority number, dateJP2011006934428.03.2011         Original published format: JP 2011069344
JP2011009961027.04.2011         Original published format: JP 2011099610
[2012/40]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP2506295
Date:03.10.2012
Language:EN
[2012/40]
Type: A3 Search report 
No.:EP2506295
Date:01.07.2015
Language:EN
[2015/27]
Search report(s)(Supplementary) European search report - dispatched on:EP01.06.2015
ClassificationIPC:H01L21/67, H01L21/60
[2015/27]
CPC:
H01L24/75 (EP,KR,US); H01L24/81 (EP,KR,US); H01L24/83 (EP,KR,US);
H01L24/92 (EP,KR,US); H01L24/95 (EP,KR,US); H01L2224/16225 (EP,US);
H01L2224/32225 (EP,US); H01L2224/73204 (EP,KR,US); H01L2224/75102 (EP,US);
H01L2224/75252 (EP,KR,US); H01L2224/753 (EP,US); H01L2224/75313 (EP,US);
H01L2224/75315 (EP,KR,US); H01L2224/75317 (EP,US); H01L2224/7532 (EP,US);
H01L2224/755 (EP,US); H01L2224/75502 (EP,US); H01L2224/75704 (EP,US);
H01L2224/75755 (EP,US); H01L2224/75756 (EP,US); H01L2224/75804 (EP,KR,US);
H01L2224/7598 (EP,US); H01L2224/75984 (EP,US); H01L2224/81048 (EP,US);
H01L2224/8109 (EP,US); H01L2224/81093 (EP,US); H01L2224/83048 (EP,US);
H01L2224/8309 (EP,US); H01L2224/83093 (EP,US); H01L2224/83855 (EP,KR,US);
H01L2224/9211 (EP,KR,US); H01L2224/95093 (EP,US); H01L2224/97 (EP,US);
H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/01019 (EP,US);
H01L2924/01029 (EP,US); H01L2924/01033 (EP,US); H01L2924/01074 (EP,US);
H01L2924/01079 (EP,US); H01L2924/01082 (EP,US); H01L2924/014 (EP,US);
H01L2924/07802 (EP,US); H01L2924/09701 (EP,US); H01L2924/15787 (EP,US) (-)
C-Set:
H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (EP,US);
H01L2924/07802, H01L2924/00 (US,EP);
H01L2924/15787, H01L2924/00 (US,EP)
Former IPC [2012/40]H01L21/67
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2016/06]
Former [2012/40]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
Extension statesBANot yet paid
MENot yet paid
TitleGerman:Haftvorrichtung und Haftverfahren[2012/40]
English:Bonding apparatus and bonding method[2012/40]
French:Appareil de liaison et procédé de liaison[2012/40]
Examination procedure22.12.2015Amendment by applicant (claims and/or description)
22.12.2015Examination requested  [2016/06]
08.09.2017Application withdrawn by applicant  [2017/42]
Fees paidRenewal fee
22.07.2013Renewal fee patent year 03
24.07.2014Renewal fee patent year 04
24.07.2015Renewal fee patent year 05
15.06.2016Renewal fee patent year 06
Penalty fee
Additional fee for renewal fee
31.07.201707   M06   Not yet paid
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[X]US5800667  (KOSAKI KATSUYA [JP], et al) [X] 1,6 * figure 1 * * column 4, line 41 - column 5, line 45 *;
 [A]US2007231961  (TESHIROGI KAZUO [JP], et al) [A] 1-9 * figures 1, 2 * * paragraphs [0099] - [0167] *;
 [A]JP2007294607  (SONY CHEM & INF DEVICE CORP) [A] 1-9* figures 3-7 and the associated text *;
 [A]US2009291524  (TAKAHASHI YOSHIMI [JP]) [A] 1-9 * figures 1-5 and the associated text *
by applicantJP2000100837
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.