blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability

2022.02.11

More...
blank News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...
blank Related links

Release notes
European Patent Register Assistant
European Patent Register Resource Book
European Patent Register – pocket guide
FAQ - European Patent Register
Federated Register (Flyer)
Global Dossier (Flyer)
Register events
Deep link coverage
Federated Register content
The Patent Information Tour
Fair use charter

Extract from the Register of European Patents

EP About this file: EP2638570

EP2638570 - ADHESIVE COMPOUND AND METHOD FOR ENCAPSULATING AN ELECTRONIC ASSEMBLY [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  05.01.2024
Database last updated on 03.10.2024
FormerGrant of patent is intended
Status updated on  28.03.2023
FormerExamination is in progress
Status updated on  17.11.2016
Most recent event   Tooltip05.01.2024Application deemed to be withdrawnpublished on 07.02.2024  [2024/06]
Applicant(s)For all designated states
tesa SE
Hugo-Kirchberg-Straße 1
22848 Norderstedt / DE
[N/P]
Former [2015/51]For all designated states
tesa SE
Hugo-Kirchberg-Strasse 1
22848 Norderstedt / DE
Former [2013/38]For all designated states
Tesa SE
Quickbornstraße 24
20253 Hamburg / DE
Inventor(s)01 / STEEN, Alexander
Am Güsgensberg 2
53175 Bonn / DE
02 / KRAWINKEL, Thorsten
Burgwedelkamp 25
22457 Hamburg / DE
03 / KEITE-TELGENBÜSCHER, Klaus
Emil-Andresen-Str. 35
22529 Hamburg / DE
04 / GRÜNAUER, Judith
Billstedter Hauptstrasse 78
22117 Hamburg / DE
05 / ELLINGER, Jan
Müggenkampstraße 1
20257 Hamburg / DE
 [2013/44]
Former [2013/38]01 / STEEN, Alexander
Am Güsgensberg 2
53175 Bonn / DE
02 / KRAWINKEL, Thorsten
Burgwedelkamp 25
22457 Hamburg / DE
03 / KEITE-TELGENBÜSCHER, Klaus
Emil-Andresen-Str. 35
22529 Hamburg / DE
04 / GRÜNAUER, Judith
Am Diebsteich 1A
22761 Hamburg / DE
05 / ELLINGER, Jan
Müggenkampstraße 1
20257 Hamburg / DE
Representative(s)tesa SE
Hugo-Kirchberg-Straße 1
22848 Norderstedt / DE
[N/P]
Application number, filing date11779147.527.10.2011
WO2011EP68822
Priority number, dateDE2010104387112.11.2010         Original published format: DE102010043871
[2013/38]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report
No.:WO2012062587
Date:18.05.2012
Language:DE
[2012/20]
Type: A1 Application with search report 
No.:EP2638570
Date:18.09.2013
Language:DE
The application published by WIPO in one of the EPO official languages on 18.05.2012 takes the place of the publication of the European patent application.
[2013/38]
Search report(s)International search report - published on:EP18.05.2012
ClassificationIPC:H01L23/29, C09J109/06, C09J153/00
[2013/38]
CPC:
C09J109/06 (EP,KR); C09J153/00 (KR); C09J153/005 (EP);
H01L23/28 (KR); H01L23/293 (EP); H01L2924/0002 (EP);
H01L2924/12044 (EP) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2013/38]
TitleGerman:KLEBMASSE UND VERFAHREN ZUR KAPSELUNG EINER ELEKTRONISCHEN ANORDNUNG[2013/38]
English:ADHESIVE COMPOUND AND METHOD FOR ENCAPSULATING AN ELECTRONIC ASSEMBLY[2013/38]
French:ADHÉSIF ET PROCÉDÉ D'ENCAPSULATION D'UN SYSTÈME ÉLECTRONIQUE[2013/38]
Entry into regional phase12.06.2013National basic fee paid 
12.06.2013Designation fee(s) paid 
12.06.2013Examination fee paid 
Examination procedure12.06.2013Examination requested  [2013/38]
18.12.2013Amendment by applicant (claims and/or description)
09.09.2014Despatch of a communication from the examining division (Time limit: M06)
18.03.2015Reply to a communication from the examining division
12.04.2016Despatch of a communication from the examining division (Time limit: M06)
01.12.2016Reply to a communication from the examining division
23.12.2020Despatch of a communication from the examining division (Time limit: M06)
28.06.2021Reply to a communication from the examining division
10.11.2022Despatch of a communication from the examining division (Time limit: M04)
22.02.2023Reply to a communication from the examining division
29.03.2023Communication of intention to grant the patent
09.08.2023Application deemed to be withdrawn, date of legal effect  [2024/06]
15.09.2023Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time  [2024/06]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  09.09.2014
Request for further processing for:The application is deemed to be withdrawn due to failure to reply to the examination report
01.12.2016Request for further processing filed
01.12.2016Full payment received (date of receipt of payment)
Request granted
08.12.2016Decision despatched
Fees paidRenewal fee
31.10.2013Renewal fee patent year 03
31.10.2014Renewal fee patent year 04
26.10.2015Renewal fee patent year 05
21.10.2016Renewal fee patent year 06
25.10.2017Renewal fee patent year 07
24.10.2018Renewal fee patent year 08
25.10.2019Renewal fee patent year 09
23.10.2020Renewal fee patent year 10
25.10.2021Renewal fee patent year 11
25.10.2022Renewal fee patent year 12
Penalty fee
Additional fee for renewal fee
31.10.202313   M06   Not yet paid
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited inInternational search[XAY]WO0146320  (3M INNOVATIVE PROPERTIES CO [US]) [X] 1,2,4,5,7-10 * examples 2, 3 * [A] 3 [Y] 6;
 [A]EP1114845  (HITACHI CHEMICAL CO LTD [JP]) [A] 1-10 * paragraph [0031]; claim 17 *;
 [YA]EP1921111  (SHINETSU CHEMICAL CO [JP]) [Y] 6 * paragraphs [0005] , [0 37] * [A] 1-5,7-10;
 [A]DE102008062130  (TESA SE [DE]) [A] 1-10* paragraph [0088] *;
 [XP]WO2011018356  (TESA SE [DE], et al) [XP] 1-4,7-10 * claims 5, 11, 25 * * page 23, lines 6-7 *
by applicantUS4051195
 US4552604
 US5304419
 US5591379
 EP0827994
 WO9821287
 EP1037192
 JP2000311782
 WO03065470
 JP2004296381
 US2004225025
 US6833668
 US2006100299
 WO2007087281
 DE102008047964
    - A.G. ERLAT, 47TH ANNUAL TECHNICAL CONFERENCE PROCEEDINGS-SOCIETY OF VACUUM COATERS, (2004), pages 654 - 659
    - M. E. GROSS ET AL., 46TH ANNUAL TECHNICAL CONFERENCE PROCEEDINGS-SOCIETY OF VACUUM COATERS, (2003), pages 89 - 92
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.