EP2555334 - Connection structure for connecting circuit board, terminal fitting and connection method therefor [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 01.07.2016 Database last updated on 01.01.2025 | Most recent event Tooltip | 01.07.2016 | Application deemed to be withdrawn | published on 03.08.2016 [2016/31] | Applicant(s) | For all designated states Sumitomo Wiring Systems, Ltd. 1-14, Nishisuehiro-cho Yokkaichi-shi, Mie 510-8503 / JP | [2013/06] | Inventor(s) | 01 /
Tonosaki, Takashi c/o Sumitomo Wiring Systems, Ltd. 1-14, Nishisuehiro-cho Yokkaichi-City Mie 510-8503 / JP | [2013/06] | Representative(s) | Müller-Boré & Partner Patentanwälte PartG mbB Friedenheimer Brücke 21 80639 München / DE | [N/P] |
Former [2013/06] | Müller-Boré & Partner Patentanwälte Grafinger Straße 2 81671 München / DE | Application number, filing date | 12005075.2 | 09.07.2012 | [2013/06] | Priority number, date | JP20110170595 | 04.08.2011 Original published format: JP 2011170595 | [2013/06] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP2555334 | Date: | 06.02.2013 | Language: | EN | [2013/06] | Type: | A3 Search report | No.: | EP2555334 | Date: | 06.03.2013 | [2013/10] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 05.02.2013 | Classification | IPC: | H01R13/03, H01R12/58 | [2013/10] | CPC: |
H01R12/585 (EP,US);
H01R13/03 (EP,US)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2013/06] | Extension states | BA | Not yet paid | ME | Not yet paid | Title | German: | Anschlussstruktur zum Anschließen einer Leiterplatte, Anschlussstück und Anschlussverfahren dafür | [2013/06] | English: | Connection structure for connecting circuit board, terminal fitting and connection method therefor | [2013/06] | French: | Structure de connexion pour carte de circuit de connexion, raccord de borne et procédé d'assemblage correspondant | [2013/06] | Examination procedure | 31.07.2013 | Amendment by applicant (claims and/or description) | 01.08.2013 | Examination requested [2013/38] | 09.04.2015 | Despatch of a communication from the examining division (Time limit: M04) | 02.07.2015 | Reply to a communication from the examining division | 14.10.2015 | Despatch of a communication from the examining division (Time limit: M04) | 25.02.2016 | Application deemed to be withdrawn, date of legal effect [2016/31] | 18.03.2016 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2016/31] | Divisional application(s) | EP13005132.9 / EP2698876 | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 09.04.2015 | Fees paid | Renewal fee | 14.07.2014 | Renewal fee patent year 03 | 10.07.2015 | Renewal fee patent year 04 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]US2006264076 (CHEN PING [US]) [Y] 3,12 * figure 1 *; | [Y]DE102006057143 (TYCO ELECTRONICS BELGIUM EC NV [BE]) [Y] 4,5,13* paragraph [0021]; figures 2-3 *; | [XY]JP2008294299 (FURUKAWA ELECTRIC CO LTD) [X] 1,10 * figures 1-3 * [Y] 3-5,12,13 | by applicant | JP2004022169 |