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Extract from the Register of European Patents

EP About this file: EP2555334

EP2555334 - Connection structure for connecting circuit board, terminal fitting and connection method therefor [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  01.07.2016
Database last updated on 01.01.2025
Most recent event   Tooltip01.07.2016Application deemed to be withdrawnpublished on 03.08.2016  [2016/31]
Applicant(s)For all designated states
Sumitomo Wiring Systems, Ltd.
1-14, Nishisuehiro-cho
Yokkaichi-shi, Mie 510-8503 / JP
[2013/06]
Inventor(s)01 / Tonosaki, Takashi
c/o Sumitomo Wiring Systems, Ltd.
1-14, Nishisuehiro-cho
Yokkaichi-City Mie 510-8503 / JP
 [2013/06]
Representative(s)Müller-Boré & Partner Patentanwälte PartG mbB
Friedenheimer Brücke 21
80639 München / DE
[N/P]
Former [2013/06]Müller-Boré & Partner Patentanwälte
Grafinger Straße 2
81671 München / DE
Application number, filing date12005075.209.07.2012
[2013/06]
Priority number, dateJP2011017059504.08.2011         Original published format: JP 2011170595
[2013/06]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP2555334
Date:06.02.2013
Language:EN
[2013/06]
Type: A3 Search report 
No.:EP2555334
Date:06.03.2013
[2013/10]
Search report(s)(Supplementary) European search report - dispatched on:EP05.02.2013
ClassificationIPC:H01R13/03, H01R12/58
[2013/10]
CPC:
H01R12/585 (EP,US); H01R13/03 (EP,US)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2013/06]
Extension statesBANot yet paid
MENot yet paid
TitleGerman:Anschlussstruktur zum Anschließen einer Leiterplatte, Anschlussstück und Anschlussverfahren dafür[2013/06]
English:Connection structure for connecting circuit board, terminal fitting and connection method therefor[2013/06]
French:Structure de connexion pour carte de circuit de connexion, raccord de borne et procédé d'assemblage correspondant[2013/06]
Examination procedure31.07.2013Amendment by applicant (claims and/or description)
01.08.2013Examination requested  [2013/38]
09.04.2015Despatch of a communication from the examining division (Time limit: M04)
02.07.2015Reply to a communication from the examining division
14.10.2015Despatch of a communication from the examining division (Time limit: M04)
25.02.2016Application deemed to be withdrawn, date of legal effect  [2016/31]
18.03.2016Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2016/31]
Divisional application(s)EP13005132.9  / EP2698876
The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  09.04.2015
Fees paidRenewal fee
14.07.2014Renewal fee patent year 03
10.07.2015Renewal fee patent year 04
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Documents cited:Search[Y]US2006264076  (CHEN PING [US]) [Y] 3,12 * figure 1 *;
 [Y]DE102006057143  (TYCO ELECTRONICS BELGIUM EC NV [BE]) [Y] 4,5,13* paragraph [0021]; figures 2-3 *;
 [XY]JP2008294299  (FURUKAWA ELECTRIC CO LTD) [X] 1,10 * figures 1-3 * [Y] 3-5,12,13
by applicantJP2004022169
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.