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Extract from the Register of European Patents

EP About this file: EP2665096

EP2665096 - A METHOD OF WAFER-SCALE INTEGRATION OF SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
Former [2013/47]A method of wafer-scale integration of semiconductor devices and semiconductor device
[2019/43]
StatusNo opposition filed within time limit
Status updated on  26.02.2021
Database last updated on 20.09.2024
FormerThe patent has been granted
Status updated on  20.03.2020
FormerGrant of patent is intended
Status updated on  26.02.2020
FormerExamination is in progress
Status updated on  22.01.2020
FormerGrant of patent is intended
Status updated on  23.09.2019
FormerExamination is in progress
Status updated on  19.04.2018
Most recent event   Tooltip08.07.2022Lapse of the patent in a contracting state
New state(s): MK		published on 10.08.2022  [2022/32]
Applicant(s)For all designated states
ams AG
Schloss Premstätten
Tobelbader Str. 30
8141 Premstätten / AT
[2020/09]
Former [2013/47]For all designated states
austriamicrosystems AG
Schloss Premstätten
8141 Unterpremstätten / AT
Inventor(s)01 / Cassidy, Cathal
Schloss Premstätten
Tobelbader Str. 30
8141 Premstätten / AT
02 / Siegert, Jörg
Schloss Premstätten
Tobelbader Str. 30
8141 Premstätten / AT
03 / Schrank, Franz
Schloss Premstätten
Tobelbader Str. 30
8141 Premstätten / AT
 [2020/09]
Former [2013/47]01 / Cassidy, Cathal
3-9-23-3 Mihara
904-2155 Okinawa City / JP
02 / Siegert, Jörg
Pfarrgasse 20
8020 Graz / AT
03 / Schrank, Franz
Handelsstrasse 54
8052 Graz / AT
Representative(s)Epping - Hermann - Fischer
Patentanwaltsgesellschaft mbH
Schloßschmidstraße 5
80639 München / DE
[2020/17]
Former [2013/47]Epping - Hermann - Fischer
Patentanwaltsgesellschaft mbH Ridlerstrasse 55
80339 München / DE
Application number, filing date12168069.815.05.2012
[2013/47]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP2665096
Date:20.11.2013
Language:EN
[2013/47]
Type: B1 Patent specification 
No.:EP2665096
Date:22.04.2020
Language:EN
[2020/17]
Search report(s)(Supplementary) European search report - dispatched on:EP26.09.2012
ClassificationIPC:H01L27/146
[2013/47]
CPC:
H01L27/1469 (EP,US); H01L24/32 (US); H01L24/83 (US);
H01L27/14634 (EP,US); H01L27/14636 (EP,US); H01L27/14661 (EP,US);
H01L27/14663 (EP,US); H01L27/14696 (EP,US); H01L31/0296 (US);
H01L31/02966 (US); H01L2924/14 (US); H01L2924/37001 (US) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/17]
Former [2013/47]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:VERFAHREN ZUR INTEGRATION VON HALBLEITERVORRICHTUNGEN AUF WAFEREBENE SOWIE HALBLEITERVORRICHTUNG[2020/13]
English:A METHOD OF WAFER-SCALE INTEGRATION OF SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE[2019/43]
French:PROCÉDÉ D'INTÉGRATION À L'ÉCHELLE D'UNE TRANCHE DE DISPOSITIFS À SEMI-CONDUCTEURS ET DISPOSITIF SEMI-CONDUCTEUR[2020/13]
Former [2013/47]Verfahren zur Integration von Halbleitervorrichtungen auf Waferebene sowie Halbleitervorrichtung
Former [2013/47]A method of wafer-scale integration of semiconductor devices and semiconductor device
Former [2013/47]Procédé d'intégration à l'échelle d'une tranche de dispositifs à semi-conducteurs et dispositif semi-conducteur
Examination procedure03.04.2014Amendment by applicant (claims and/or description)
03.04.2014Examination requested  [2014/20]
18.06.2014Despatch of a communication from the examining division (Time limit: M04)
28.08.2014Reply to a communication from the examining division
07.12.2015Despatch of a communication from the examining division (Time limit: M04)
01.04.2016Reply to a communication from the examining division
09.04.2018Despatch of a communication from the examining division (Time limit: M02)
08.05.2018Reply to a communication from the examining division
24.09.2019Communication of intention to grant the patent
21.01.2020Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO
27.02.2020Communication of intention to grant the patent
16.03.2020Fee for grant paid
16.03.2020Fee for publishing/printing paid
16.03.2020Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  18.06.2014
Opposition(s)25.01.2021No opposition filed within time limit [2021/13]
Fees paidRenewal fee
22.05.2014Renewal fee patent year 03
19.05.2015Renewal fee patent year 04
24.05.2016Renewal fee patent year 05
22.05.2017Renewal fee patent year 06
17.05.2018Renewal fee patent year 07
22.05.2019Renewal fee patent year 08
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU15.05.2012
AL22.04.2020
AT22.04.2020
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IE15.05.2020
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LI31.05.2020
FR22.06.2020
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NO22.07.2020
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PT24.08.2020
[2022/32]
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Former [2021/09]AL22.04.2020
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IS22.08.2020
PT24.08.2020
Former [2021/08]AL22.04.2020
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CH31.05.2020
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BG22.07.2020
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Former [2021/04]AL22.04.2020
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Former [2021/01]FI22.04.2020
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Former [2020/51]FI22.04.2020
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NL22.04.2020
RS22.04.2020
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PT24.08.2020
Former [2020/50]FI22.04.2020
HR22.04.2020
LT22.04.2020
LV22.04.2020
NL22.04.2020
SE22.04.2020
NO22.07.2020
GR23.07.2020
IS22.08.2020
PT24.08.2020
Former [2020/48]FI22.04.2020
LT22.04.2020
NL22.04.2020
SE22.04.2020
NO22.07.2020
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PT24.08.2020
Former [2020/47]LT22.04.2020
NO22.07.2020
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Former [2020/46]IS22.08.2020
Documents cited:Search[XI]US2005035381  (HOLM PAIGE M [US], et al) [X] 1-3,5-7 * paragraphs [0037] - [0046]; figures 5-15 *[I] 4;
 [XI]US8120683  (TUMER TUMAY O [US], et al) [X] 8-10,12,13 * column 19, line 65 - column 24, line 59; figure 3g * [I] 11;
 [XI]US2012043468  (FLITSCH FREDERICK [US], et al) [X] 8,10,12,13 * paragraphs [0013] - [0024]; figures 1-4 * [I] 9,11
by applicantUS7227150
 US2007285115
 US2008265407
 WO2009072056
 US2009178275
 DE102008048303
 US2010144068
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.