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EP2587907
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EP About this file: EP2587907
| EP2587907 - Thermosiphon cooler arrangement in modules with electric and/or electronic components [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 03.08.2018 Database last updated on 02.11.2024 | |
| Former | Grant of patent is intended Status updated on 01.10.2017 | ||
| Former | Request for examination was made Status updated on 11.08.2017 | ||
| Former | Grant of patent is intended Status updated on 09.04.2017 | Most recent event Tooltip | 03.08.2018 | Application deemed to be withdrawn | published on 05.09.2018 [2018/36] | Applicant(s) | For all designated states ABB Schweiz AG Brown Boveri Strasse 6 5400 Baden / CH | [2017/20] |
| Former [2013/18] | For all designated states ABB Technology AG Affolternstrasse 44 8050 Zürich / CH | Inventor(s) | 01 /
Cottet, Didier Birchstrasse 185 8050 Zürich / CH | 02 /
Agostini, Francesco Heinrichstrasse 239 8005 Zürich / CH | 03 /
Gradinger, Thomas Birkenweg 3 5032 Rohr / CH | 04 /
Vögeli, Andreas Chäppelistrasse 37 5312 Döttingen / CH | [N/P] |
| Former [2013/18] | 01 /
Cottet, Didier Birchstrasse 185 8050 Zürich / CH | ||
| 02 /
Agostini, Francesco Riedtalstrasse 4 4800 Zofingen / CH | |||
| 03 /
Gradinger, Thomas Birkenweg 3 5032 Rohr / CH | |||
| 04 /
Vögeli, Andreas Chäppelistrasse 37 5312 Döttingen / CH | Representative(s) | ABB Patent Attorneys C/o ABB Schweiz AG Intellectual Property (CH-LI/IP) Brown Boveri Strasse 6 5400 Baden / CH | [2013/18] | Application number, filing date | 12188563.6 | 15.10.2012 | [2013/18] | Priority number, date | EP20110187272 | 31.10.2011 Original published format: EP 11187272 | [2013/18] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP2587907 | Date: | 01.05.2013 | Language: | EN | [2013/18] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 26.11.2012 | Classification | IPC: | H05K7/20, F28D15/02, H02M7/00, H02M7/483 | [2017/16] | CPC: |
H05K7/20672 (EP,US);
F28D15/02 (KR);
F28D15/0266 (EP,US);
H02M7/4835 (EP,US);
H05K7/14325 (EP);
H05K7/20 (KR);
|
| Former IPC [2013/18] | H05K7/20 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2013/18] | Extension states | BA | Not yet paid | ME | Not yet paid | Title | German: | Thermosiphon-Kühleranordnung in Modulen mit elektrischen und/oder elektronischen Komponenten | [2013/18] | English: | Thermosiphon cooler arrangement in modules with electric and/or electronic components | [2013/18] | French: | Agencement de refroidisseur à thermosiphon dans des modules avec des composants électriques ou électroniques | [2013/18] | Examination procedure | 04.11.2013 | Amendment by applicant (claims and/or description) | 04.11.2013 | Examination requested [2013/50] | 10.04.2017 | Communication of intention to grant the patent | 02.08.2017 | Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO | 02.10.2017 | Communication of intention to grant the patent | 31.01.2018 | Receipt of the translation of the claim(s) | 13.02.2018 | Application deemed to be withdrawn, date of legal effect [2018/36] | 21.03.2018 | Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time [2018/36] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 10.04.2017 | Fees paid | Renewal fee | 23.10.2014 | Renewal fee patent year 03 | 26.10.2015 | Renewal fee patent year 04 | 21.10.2016 | Renewal fee patent year 05 | 25.10.2017 | Renewal fee patent year 06 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [I]US2005168938 (BASH CULLEN E [US], et al) [I] 1-21 * the whole document *; | [I]US2005248922 (CHU RICHARD C [US], et al) [I] 1-21 * the whole document *; | [IP]EP2429274 (HITACHI LTD [JP]) [IP] 1-21 * figures 3,9 * * paragraphs [0019] - [0020] ** paragraphs [0023] - [0024] * | by applicant | EP2246654 |