EP2587544 - Semiconductor device and the method of manufacturing the same [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 24.02.2023 Database last updated on 12.07.2024 | |
Former | The patent has been granted Status updated on 18.03.2022 | ||
Former | Grant of patent is intended Status updated on 01.11.2021 | ||
Former | Examination is in progress Status updated on 06.05.2020 | ||
Former | Request for examination was made Status updated on 11.05.2018 | Most recent event Tooltip | 14.06.2024 | Lapse of the patent in a contracting state New state(s): TR | published on 17.07.2024 [2024/29] | Applicant(s) | For all designated states Fuji Electric Co., Ltd. 1-1, Tanabeshinden Kawasaki-ku Kawasaki-shi 210-9530 / JP | [2013/18] | Inventor(s) | 01 /
Sasaki, Koji c/o Fuji Electric Co., Ltd. 1-1, Tanabeshinden, Kawasaki-ku Kawasaki-shi 210-9530 / JP | [2013/18] | Representative(s) | MERH-IP Matias Erny Reichl Hoffmann Patentanwälte PartG mbB Paul-Heyse-Strasse 29 80336 München / DE | [2022/16] |
Former [2013/18] | MERH-IP Matias Erny Reichl Hoffmann Paul-Heyse-Strasse 29 80336 München / DE | Application number, filing date | 12189428.1 | 22.10.2012 | [2013/18] | Priority number, date | JP20110236849 | 28.10.2011 Original published format: JP 2011236849 | [2013/18] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP2587544 | Date: | 01.05.2013 | Language: | EN | [2013/18] | Type: | A3 Search report | No.: | EP2587544 | Date: | 01.11.2017 | Language: | EN | [2017/44] | Type: | B1 Patent specification | No.: | EP2587544 | Date: | 20.04.2022 | Language: | EN | [2022/16] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 02.10.2017 | Classification | IPC: | H01L29/739, H01L29/06, H01L29/417, H01L21/331 | [2021/45] | CPC: |
H01L29/41708 (EP,US);
H01L23/481 (US);
H01L29/0696 (EP,US);
H01L29/66348 (EP,US);
H01L29/7397 (EP,US);
H01L2924/0002 (EP,US)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
|
Former IPC [2013/18] | H01L29/739, H01L29/66, H01L29/417 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2018/24] |
Former [2013/18] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | Halbleiterbauelement und Verfahren zu seiner Herstellung | [2013/18] | English: | Semiconductor device and the method of manufacturing the same | [2013/18] | French: | Dispositif semi-conducteur et son procédé de fabrication | [2013/18] | Examination procedure | 22.10.2012 | Date on which the examining division has become responsible | 04.04.2018 | Amendment by applicant (claims and/or description) | 02.05.2018 | Examination requested [2018/24] | 11.05.2020 | Despatch of a communication from the examining division (Time limit: M04) | 21.09.2020 | Reply to a communication from the examining division | 05.10.2021 | Cancellation of oral proceeding that was planned for 11.10.2021 | 11.10.2021 | Date of oral proceedings (cancelled) | 02.11.2021 | Communication of intention to grant the patent | 08.03.2022 | Receipt of the translation of the claim(s) | 09.03.2022 | Fee for grant paid | 09.03.2022 | Fee for publishing/printing paid | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 11.05.2020 | Opposition(s) | 23.01.2023 | No opposition filed within time limit [2023/13] | Fees paid | Renewal fee | 31.10.2014 | Renewal fee patent year 03 | 02.11.2015 | Renewal fee patent year 04 | 31.10.2016 | Renewal fee patent year 05 | 02.11.2017 | Renewal fee patent year 06 | 31.10.2018 | Renewal fee patent year 07 | 31.10.2019 | Renewal fee patent year 08 | 02.11.2020 | Renewal fee patent year 09 | 02.11.2021 | Renewal fee patent year 10 |
Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 22.10.2012 | AL | 20.04.2022 | AT | 20.04.2022 | CY | 20.04.2022 | CZ | 20.04.2022 | DK | 20.04.2022 | EE | 20.04.2022 | ES | 20.04.2022 | FI | 20.04.2022 | HR | 20.04.2022 | IT | 20.04.2022 | LT | 20.04.2022 | LV | 20.04.2022 | MC | 20.04.2022 | MK | 20.04.2022 | NL | 20.04.2022 | PL | 20.04.2022 | RO | 20.04.2022 | RS | 20.04.2022 | SE | 20.04.2022 | SI | 20.04.2022 | SK | 20.04.2022 | SM | 20.04.2022 | TR | 20.04.2022 | BG | 20.07.2022 | NO | 20.07.2022 | GR | 21.07.2022 | IS | 20.08.2022 | PT | 22.08.2022 | GB | 22.10.2022 | IE | 22.10.2022 | LU | 22.10.2022 | BE | 31.10.2022 | CH | 31.10.2022 | FR | 31.10.2022 | LI | 31.10.2022 | [2024/29] |
Former [2024/27] | HU | 22.10.2012 | |
AL | 20.04.2022 | ||
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CY | 20.04.2022 | ||
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BG | 20.07.2022 | ||
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GR | 21.07.2022 | ||
IS | 20.08.2022 | ||
PT | 22.08.2022 | ||
GB | 22.10.2022 | ||
IE | 22.10.2022 | ||
LU | 22.10.2022 | ||
BE | 31.10.2022 | ||
CH | 31.10.2022 | ||
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LI | 31.10.2022 | ||
Former [2024/21] | HU | 22.10.2012 | |
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PT | 22.08.2022 | ||
GB | 22.10.2022 | ||
IE | 22.10.2022 | ||
LU | 22.10.2022 | ||
BE | 31.10.2022 | ||
CH | 31.10.2022 | ||
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LI | 31.10.2022 | ||
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IS | 20.08.2022 | ||
PT | 22.08.2022 | ||
GB | 22.10.2022 | ||
IE | 22.10.2022 | ||
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BE | 31.10.2022 | ||
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PT | 22.08.2022 | ||
GB | 22.10.2022 | ||
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GB | 22.10.2022 | ||
IE | 22.10.2022 | ||
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BE | 31.10.2022 | ||
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BG | 20.07.2022 | ||
NO | 20.07.2022 | ||
GR | 21.07.2022 | ||
IS | 20.08.2022 | ||
PT | 22.08.2022 | ||
GB | 22.10.2022 | ||
LU | 22.10.2022 | ||
BE | 31.10.2022 | ||
CH | 31.10.2022 | ||
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MC | 20.04.2022 | ||
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PL | 20.04.2022 | ||
RO | 20.04.2022 | ||
RS | 20.04.2022 | ||
SE | 20.04.2022 | ||
SI | 20.04.2022 | ||
SK | 20.04.2022 | ||
SM | 20.04.2022 | ||
BG | 20.07.2022 | ||
NO | 20.07.2022 | ||
GR | 21.07.2022 | ||
IS | 20.08.2022 | ||
PT | 22.08.2022 | ||
LU | 22.10.2022 | ||
BE | 31.10.2022 | ||
CH | 31.10.2022 | ||
FR | 31.10.2022 | ||
LI | 31.10.2022 | ||
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SK | 20.04.2022 | ||
SM | 20.04.2022 | ||
BG | 20.07.2022 | ||
NO | 20.07.2022 | ||
GR | 21.07.2022 | ||
IS | 20.08.2022 | ||
PT | 22.08.2022 | ||
LU | 22.10.2022 | ||
CH | 31.10.2022 | ||
FR | 31.10.2022 | ||
LI | 31.10.2022 | ||
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PL | 20.04.2022 | ||
RO | 20.04.2022 | ||
RS | 20.04.2022 | ||
SE | 20.04.2022 | ||
SI | 20.04.2022 | ||
SK | 20.04.2022 | ||
SM | 20.04.2022 | ||
BG | 20.07.2022 | ||
NO | 20.07.2022 | ||
GR | 21.07.2022 | ||
IS | 20.08.2022 | ||
PT | 22.08.2022 | ||
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PL | 20.04.2022 | ||
RO | 20.04.2022 | ||
RS | 20.04.2022 | ||
SE | 20.04.2022 | ||
SI | 20.04.2022 | ||
SK | 20.04.2022 | ||
SM | 20.04.2022 | ||
BG | 20.07.2022 | ||
NO | 20.07.2022 | ||
GR | 21.07.2022 | ||
IS | 20.08.2022 | ||
PT | 22.08.2022 | ||
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BG | 20.07.2022 | ||
NO | 20.07.2022 | ||
GR | 21.07.2022 | ||
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PT | 22.08.2022 | ||
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SM | 20.04.2022 | ||
BG | 20.07.2022 | ||
NO | 20.07.2022 | ||
GR | 21.07.2022 | ||
IS | 20.08.2022 | ||
PT | 22.08.2022 | ||
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RS | 20.04.2022 | ||
SE | 20.04.2022 | ||
BG | 20.07.2022 | ||
NO | 20.07.2022 | ||
GR | 21.07.2022 | ||
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SE | 20.04.2022 | ||
BG | 20.07.2022 | ||
NO | 20.07.2022 | ||
GR | 21.07.2022 | ||
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SE | 20.04.2022 | ||
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NO | 20.07.2022 | ||
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Former [2022/44] | NL | 20.04.2022 | Documents cited: | Search | [Y]US2005199953 (KAWAMURA KEIKO [JP], et al) [Y] 1-15 * paragraph [0134] - paragraph [0135] * * figure 31 *; | [Y]US2009170313 (JUNG SOON WOOK [KR]) [Y] 1-15 * paragraph [0016] - paragraph [0038] ** figures 1-3 *; | [Y]EP2209142 (SANKEN ELECTRIC CO LTD [JP]) [Y] 1-15 * paragraph [0033] - paragraph [0051] * * paragraph [0072] - paragraph [0073] * * figures 1-4,7,8 * | Examination | US7456097 |