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EP2690146
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EP About this file: EP2690146
| EP2690146 - ADHESIVE TAPE FOR PROCESSING SEMICONDUCTOR WAFER AND THE LIKE [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 16.12.2016 Database last updated on 02.11.2024 | Most recent event Tooltip | 16.12.2016 | Withdrawal of application | published on 18.01.2017 [2017/03] | Applicant(s) | For all designated states Sumitomo Bakelite Co., Ltd. 5-8 Higashi-Shinagawa 2-chome Shinagawa-ku Tokyo 140-0002 / JP | [2014/05] | Inventor(s) | 01 /
ISHIBA Akihiro c/o SUMITOMO BAKELITE CO. LTD. 5-8 Higashi-Shinagawa 2-chome Shinagawa-ku Tokyo 140-0002 / JP | 02 /
ISOBE Masatoshi c/o SUMITOMO BAKELITE CO. LTD. 5-8 Higashi-Shinagawa 2-chome Shinagawa-ku Tokyo 140-0002 / JP | [2014/05] | Representative(s) | Ahner, Philippe, et al Brevalex Tour Trinity 1 Bis Esplanade de La Défense CS 60347 92035 Paris La Défense Cedex / FR | [N/P] |
| Former [2014/05] | Ahner, Philippe, et al BREVALEX 95 rue d'Amsterdam 75378 Paris Cedex 8 / FR | Application number, filing date | 12761389.1 | 22.03.2012 | WO2012JP57333 | Priority number, date | JP20110065515 | 24.03.2011 Original published format: JP 2011065515 | [2014/05] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2012128317 | Date: | 27.09.2012 | Language: | JA | [2012/39] | Type: | A1 Application with search report | No.: | EP2690146 | Date: | 29.01.2014 | Language: | EN | [2014/05] | Search report(s) | International search report - published on: | JP | 27.09.2012 | (Supplementary) European search report - dispatched on: | EP | 21.07.2014 | Classification | IPC: | C09J7/02, H01L21/301, H01L21/683 | [2014/34] | CPC: |
H01L21/6836 (EP,US);
C09J7/22 (KR);
C08L23/10 (EP,US);
C09J201/00 (KR);
C09J7/241 (EP,US);
H01L21/30 (KR);
C08L2201/04 (EP,US);
C09J2203/326 (EP,US);
C09J2301/16 (KR);
C09J2301/312 (KR);
C09J2421/006 (EP,KR,US);
C09J2423/106 (EP,KR,US);
C09J2453/006 (EP,KR,US);
H01L2221/68327 (EP,KR,US);
H01L2221/68336 (EP,KR,US);
H01L2221/6834 (EP,US);
H01L2221/68381 (EP,US);
Y10T428/2852 (EP,US);
Y10T428/2878 (EP,US)
(-)
| C-Set: |
C08L23/10, C08L23/04, C08L23/16 (EP,US)
|
| Former IPC [2014/05] | C09J7/02, H01L21/301 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2014/05] | Title | German: | KLEBEBAND ZUR VERARBEITUNG VON HALBLEITERWAFERN UND ÄHNLICHEM | [2014/05] | English: | ADHESIVE TAPE FOR PROCESSING SEMICONDUCTOR WAFER AND THE LIKE | [2014/05] | French: | BANDE ADHÉSIVE SERVANT À TRAITER UNE PLAQUETTE SEMI-CONDUCTRICE ET AUTRE | [2014/05] | Entry into regional phase | 30.09.2013 | Translation filed | 30.09.2013 | National basic fee paid | 30.09.2013 | Search fee paid | 30.09.2013 | Designation fee(s) paid | 30.09.2013 | Examination fee paid | Examination procedure | 30.09.2013 | Examination requested [2014/05] | 13.02.2015 | Amendment by applicant (claims and/or description) | 12.12.2016 | Application withdrawn by applicant [2017/03] | Fees paid | Renewal fee | 19.02.2014 | Renewal fee patent year 03 | 24.02.2015 | Renewal fee patent year 04 | 26.02.2016 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US2010028671 (MITSUI KAZUMA [JP], et al) [X] 1-4,7 * paragraphs [0001] , [0 14] , [0 23] , [0 40] , [0 41] , [0 48] , [ 116] - [0122] - [ 133] - [0141] * * paragraphs [0192] , [ 193] , [ 200] , [ 233] *; | [I]JP2006165071 (ACHILLES CORP) [I] 1-7 * paragraphs [0001] , [00 2] , [00 8] , [00 9] , [0 14] - [0035] *; | [Y]US2003031862 (YAMAMOTO SHOUJI [JP], et al) [Y] 1-7 * abstract * * figure 1 * * paragraphs [0015] , [0 24] , [0 26] , [0 41] , [0 42] , [0 55] , [0 61] , [ 154] , [ 157] , [ 158] *; | [Y]JP2008244377 (SUMITOMO BAKELITE CO) [Y] 1-7 * paragraphs [0006] , [00 7] , [0 21] * | International search | [X]JP2006165071 (ACHILLES CORP); | [X]JPH0620442U (MODERN PLASTICS KOGYO KABUSHIKI KAISHA); | [Y]JPH06128539 (NITTO DENKO CORP); | [A]JP2003064328 (SUMITOMO BAKELITE CO); | [A]JP2004035642 (SUMITOMO BAKELITE CO) | by applicant | JP2007099984 |