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EP2717304
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EP About this file: EP2717304
| EP2717304 - RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 27.11.2020 Database last updated on 20.12.2024 | |
| Former | Grant of patent is intended Status updated on 12.03.2020 | ||
| Former | Examination is in progress Status updated on 20.04.2018 | Most recent event Tooltip | 27.11.2020 | Application deemed to be withdrawn | published on 30.12.2020 [2020/53] | Applicant(s) | For all designated states Sumitomo Bakelite Company Limited 5-8 Higashi-Shinagawa 2-chome Shinagawa-ku Tokyo 140-0002 / JP | [2014/15] | Inventor(s) | 01 /
MURAYAMA Ryuichi c/o SUMITOMO BAKELITE CO. LTD. 5-8 Higashi-Shinagawa 2-chome Shinagawa-ku Tokyo 140-0002 / JP | 02 /
SHIMOBE Yasuo c/o SUMITOMO BAKELITE CO. LTD. 5-8 Higashi-Shinagawa 2-chome Shinagawa-ku Tokyo 140-0002 / JP | 03 /
KANAMORI Naoya c/o SUMITOMO BAKELITE CO. LTD. 5-8 Higashi-Shinagawa 2-chome Shinagawa-ku Tokyo 140-0002 / JP | [2014/15] | Representative(s) | Schnappauf, Georg ZSP Patentanwälte PartG mbB Hansastraße 32 80686 München / DE | [N/P] |
| Former [2014/15] | Schnappauf, Georg ZSP Patentanwälte Partnerschaftsgesellschaft Radlkoferstrasse 2 81373 München / DE | Application number, filing date | 12793698.7 | 28.05.2012 | WO2012JP63631 | Priority number, date | JP20110121386 | 31.05.2011 Original published format: JP 2011121386 | [2014/15] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2012165375 | Date: | 06.12.2012 | Language: | JA | [2012/49] | Type: | A1 Application with search report | No.: | EP2717304 | Date: | 09.04.2014 | Language: | EN | [2014/15] | Search report(s) | International search report - published on: | JP | 06.12.2012 | (Supplementary) European search report - dispatched on: | EP | 07.04.2015 | Classification | IPC: | H01L21/52, C09J11/04, C09J163/00, C09J201/00 | [2014/15] | CPC: |
C08K3/10 (EP,US);
C09J11/04 (EP,CN,KR,US);
H01L23/3107 (EP,CN,US);
C09J9/02 (US);
C09J163/00 (EP,KR,US);
C09J201/00 (KR);
H01L21/52 (KR);
H01L23/49513 (EP,CN,US);
H01L33/62 (US);
H01L33/64 (US);
H01S5/0236 (US);
C08K2003/0806 (EP,CN,US);
C08K2201/001 (US);
C08K2201/005 (EP,US);
C08K7/18 (EP,CN,US);
H01L2224/32245 (EP,CN,US);
H01L2224/48247 (EP,CN,US);
H01L2224/48465 (EP,CN,US);
| C-Set: |
C09J163/00, C08K3/10, C08K2201/005 (US,EP);
H01L2224/48465, H01L2224/48247, H01L2924/00 (EP,CN,US);
H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00 (CN);
H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00012 (US,EP); | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2014/15] | Title | German: | HARZZUSAMMENSETZUNG, HALBLEITERVORRICHTUNG DAMIT UND VERFAHREN ZUR HERSTELLUNG DER HALBLEITERVORRICHTUNG | [2014/15] | English: | RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | [2014/15] | French: | COMPOSITION DE RÉSINE, DISPOSITIF À SEMI-CONDUCTEUR L'UTILISANT ET PROCÉDÉ DE FABRICATION D'UN DISPOSITIF À SEMI-CONDUCTEUR | [2014/15] | Entry into regional phase | 11.11.2013 | Translation filed | 11.11.2013 | National basic fee paid | 11.11.2013 | Search fee paid | 11.11.2013 | Designation fee(s) paid | 11.11.2013 | Examination fee paid | Examination procedure | 15.11.2013 | Examination requested [2014/15] | 30.10.2015 | Amendment by applicant (claims and/or description) | 20.04.2018 | Despatch of a communication from the examining division (Time limit: M04) | 08.08.2018 | Reply to a communication from the examining division | 12.09.2018 | Despatch of a communication from the examining division (Time limit: M04) | 07.01.2019 | Reply to a communication from the examining division | 20.08.2019 | Despatch of a communication from the examining division (Time limit: M04) | 11.11.2019 | Reply to a communication from the examining division | 13.03.2020 | Communication of intention to grant the patent | 24.07.2020 | Application deemed to be withdrawn, date of legal effect [2020/53] | 13.08.2020 | Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time [2020/53] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 20.04.2018 | Fees paid | Renewal fee | 31.03.2014 | Renewal fee patent year 03 | 29.05.2015 | Renewal fee patent year 04 | 31.05.2016 | Renewal fee patent year 05 | 30.05.2017 | Renewal fee patent year 06 | 30.05.2018 | Renewal fee patent year 07 | 29.05.2019 | Renewal fee patent year 08 | Penalty fee | Additional fee for renewal fee | 31.05.2020 | 09 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XI]JP2004277572 (RENESAS TECH CORP) [X] 1,4,6-8,11 * figure -; example -; claim - * [I] 2,3 | International search | [X]JPH0536307 (FUKUDA METAL FOIL POWDER); | [Y]JPH0589721 (MIYAZAKI OKI DENKI KK, et al); | [A]JP2003016838 (SUMITOMO BAKELITE CO, et al) | by applicant | JPH0589721 | JPH07118616 |