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Extract from the Register of European Patents

EP About this file: EP2693474

EP2693474 - Method of manufacturing a semiconductor die assembly with a clip bonded to an aluminium pad coated by a sintered silver structure and with a wire bonded to an uncoated aluminium pad [Right-click to bookmark this link]
Former [2014/06]Method of manufacturing a silver bond pad on a semiconductor power device using silver nanopaste, as well as an assembly including said semiconductor device
[2020/27]
StatusNo opposition filed within time limit
Status updated on  01.10.2021
Database last updated on 17.09.2024
FormerThe patent has been granted
Status updated on  23.10.2020
FormerGrant of patent is intended
Status updated on  22.06.2020
FormerExamination is in progress
Status updated on  14.12.2018
Most recent event   Tooltip06.09.2024Lapse of the patent in a contracting state
New state(s): MT		published on 09.10.2024 [2024/41]
Applicant(s)For all designated states
Littelfuse, Inc.
8755 West Higgins Road, Suite 500
Chicago, IL 60631 / US
[2019/37]
Former [2014/06]For all designated states
IXYS CORPORATION
1590 Buckeye Drive
Milpitas CA 95035-7418 / US
Inventor(s)01 / Zommer, Nathan
5111 SE 5th Avenue 1709
Fort Lauderdale, FL 33301 / US
 [2014/06]
Representative(s)Duxbury, Stephen
Arnold & Siedsma
Bavariaring 17
80336 München / DE
[2020/48]
Former [2014/06]Winter, Brandl, Fürniss, Hübner, Röss, Kaiser, Polte - Partnerschaft
Patent- und Rechtsanwaltskanzlei
Alois-Steinecker-Strasse 22
85354 Freising / DE
Application number, filing date13177989.425.07.2013
[2014/06]
Priority number, dateUS20121356370331.07.2012         Original published format: US201213563703
[2014/06]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP2693474
Date:05.02.2014
Language:EN
[2014/06]
Type: A3 Search report 
No.:EP2693474
Date:08.10.2014
Language:EN
[2014/41]
Type: B1 Patent specification 
No.:EP2693474
Date:25.11.2020
Language:EN
[2020/48]
Search report(s)(Supplementary) European search report - dispatched on:EP04.09.2014
ClassificationIPC:H01L21/60, H01L23/485, H01L23/488, H01L23/49, // H01L23/373, H01L23/495
[2020/27]
CPC:
H01L23/3735 (EP,US); H01L23/48 (US); H01L23/49513 (EP,US);
H01L23/49524 (EP,US); H01L23/49562 (EP,US); H01L24/03 (EP,US);
H01L24/05 (EP,US); H01L24/06 (EP,US); H01L24/40 (EP,US);
H01L24/49 (EP,US); H01L24/73 (EP,US); H01L2224/03312 (EP,US);
H01L2224/0345 (EP,US); H01L2224/035 (EP,US); H01L2224/03505 (EP,US);
H01L2224/0381 (EP,US); H01L2224/04026 (EP,US); H01L2224/04034 (EP,US);
H01L2224/04042 (EP,US); H01L2224/05073 (EP,US); H01L2224/05076 (EP,US);
H01L2224/05083 (EP,US); H01L2224/05124 (EP,US); H01L2224/05155 (EP,US);
H01L2224/05166 (EP,US); H01L2224/05187 (EP,US); H01L2224/05553 (EP,US);
H01L2224/05624 (EP,US); H01L2224/05639 (EP,US); H01L2224/05687 (EP,US);
H01L2224/05794 (EP,US); H01L2224/05839 (EP,US); H01L2224/0589 (EP,US);
H01L2224/0603 (EP,US); H01L2224/06181 (EP); H01L2224/06505 (EP,US);
H01L2224/08238 (EP,US); H01L2224/4007 (EP,US); H01L2224/40225 (EP,US);
H01L2224/40247 (EP,US); H01L2224/40475 (EP,US); H01L2224/45014 (EP,US);
H01L2224/45015 (EP,US); H01L2224/45099 (EP,US); H01L2224/48091 (EP,US);
H01L2224/48247 (EP,US); H01L2224/48463 (EP,US); H01L2224/48472 (EP,US);
H01L2224/4903 (EP,US); H01L2224/4911 (EP,US); H01L2224/73221 (EP,US);
H01L2224/73251 (EP,US); H01L2224/73263 (EP,US); H01L2224/73265 (EP,US);
H01L2224/80439 (EP,US); H01L2224/80895 (EP,US); H01L2224/84205 (EP,US);
H01L2224/84345 (EP); H01L2224/84424 (EP,US); H01L2224/84801 (EP,US);
H01L2224/8484 (EP); H01L2224/85181 (EP,US); H01L2224/85205 (EP,US);
H01L2224/85424 (EP,US); H01L2224/92 (EP,US); H01L2224/92157 (EP,US);
H01L2224/9222 (EP,US); H01L2224/92246 (EP,US); H01L2224/92247 (EP,US);
H01L2224/94 (EP,US); H01L23/4827 (EP,US); H01L24/08 (EP,US);
H01L24/48 (EP,US); H01L24/72 (EP,US); H01L24/80 (EP,US);
H01L24/84 (EP,US); H01L24/85 (EP,US); H01L24/92 (EP,US);
H01L24/95 (EP,US); H01L2924/00014 (EP,US); H01L2924/10253 (EP,US);
H01L2924/1301 (EP,US); H01L2924/1305 (EP,US); H01L2924/1306 (EP,US);
H01L2924/13091 (EP,US); H01L2924/15787 (EP,US); H01L2924/181 (EP,US) (-)
C-Set:
H01L2224/0345, H01L2924/00014 (US,EP);
H01L2224/035, H01L2924/00012 (EP,US);
H01L2224/05073, H01L2224/05639, H01L2224/05124, H01L2924/00012 (US,EP);
H01L2224/05076, H01L2224/05187, H01L2924/05432, H01L2224/05139 (US,EP);
H01L2224/05083, H01L2224/05639, H01L2224/05155, H01L2224/05166, H01L2224/05124, H01L2924/00012, H01L2924/00015 (US,EP);
H01L2224/05124, H01L2924/00014 (US,EP);
H01L2224/05187, H01L2924/05432 (EP,US);
H01L2224/05624, H01L2924/00014 (US,EP);
H01L2224/05687, H01L2924/05432 (EP,US);
H01L2224/05794, H01L2924/00014 (US,EP);
H01L2224/05839, H01L2924/00014 (US,EP);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/48472, H01L2224/48091, H01L2924/00 (US,EP);
H01L2224/48472, H01L2224/48247, H01L2924/00 (US,EP);
H01L2224/4911, H01L2924/00015 (EP,US);
H01L2224/73251, H01L2224/08, H01L2224/40 (US,EP);
H01L2224/73251, H01L2224/08, H01L2224/48 (US,EP);
H01L2224/80439, H01L2924/00014 (US,EP);
H01L2224/84205, H01L2924/00014 (US,EP);
H01L2224/84424, H01L2924/00014 (US,EP);
H01L2224/85181, H01L2224/48472, H01L2924/00 (US,EP);
H01L2224/85181, H01L2924/00014 (EP,US);
H01L2224/85205, H01L2924/00014 (US,EP);
H01L2224/85424, H01L2924/00014 (EP,US);
H01L2224/9222, H01L2224/80, H01L2224/84 (EP,US);
H01L2224/9222, H01L2224/80, H01L2224/85 (US,EP);
H01L2224/92, H01L2224/80, H01L2224/84, H01L2224/85 (US,EP);
H01L2224/94, H01L2224/03 (US,EP);
H01L2924/00014, H01L2224/37099 (EP);
H01L2924/00014, H01L2224/45015, H01L2924/207 (US,EP);
H01L2924/00014, H01L2224/45099 (US,EP);
H01L2924/1301, H01L2924/00 (EP,US);
H01L2924/1305, H01L2924/00 (EP,US);
H01L2924/1306, H01L2924/00 (EP,US);
H01L2924/15787, H01L2924/00 (EP,US);
H01L2924/181, H01L2924/00012 (US,EP)
(-)
Former IPC [2014/41]H01L23/485, H01L23/49, H01L23/488, H01L21/60, // H01L23/373, H01L23/495
Former IPC [2014/32]H01L23/485, H01L23/49, H01L23/488, H01L21/60, // H01L23/495, H01L23/498
Former IPC [2014/06]H01L23/485, // H01L23/495, H01L23/498
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2015/21]
Former [2014/06]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:Verfahren zur Herstellung einer Halbleiterchipanordnung mit einem Clip, der mit einer gesinterten Silberstruktur beschichteten Aluminiumkontaktfläche verbunden ist, und mit einem Bonddraht, der mit einer unbeschichteten Aluminiumkontaktfläche verbunden ist[2020/30]
English:Method of manufacturing a semiconductor die assembly with a clip bonded to an aluminium pad coated by a sintered silver structure and with a wire bonded to an uncoated aluminium pad[2020/27]
French:Méthode de fabrication d'un assemblage d'une puce semi-conductrice avec un clip connecté à un plot de contact en aluminium recouvert d'une structure frittée en argent et avec un fil de connexion connecté à un plot de contact non-recouvert[2020/27]
Former [2014/06]Verfahren zur Herstellung von einer Bondfläche auf einem Leistungshalbleiterbaustein mittels einer Silbernanopaste, sowie eine Anordnung den Halbleiterbaustein enthaltend
Former [2014/06]Method of manufacturing a silver bond pad on a semiconductor power device using silver nanopaste, as well as an assembly including said semiconductor device
Former [2014/06]Méthode de fabrication d'un plot de contact en argent sur un dispositif semi-conducteur de puissance à l'aide d'une nano-pâte d'argent, ainsi qu'un assemblage comprenant ce dispositif semi-conducteur
Examination procedure07.04.2015Amendment by applicant (claims and/or description)
07.04.2015Examination requested  [2015/21]
17.12.2018Despatch of a communication from the examining division (Time limit: M06)
24.06.2019Reply to a communication from the examining division
14.05.2020Cancellation of oral proceeding that was planned for 14.05.2020
14.05.2020Date of oral proceedings (cancelled)
23.06.2020Communication of intention to grant the patent
19.10.2020Fee for grant paid
19.10.2020Fee for publishing/printing paid
19.10.2020Receipt of the translation of the claim(s)
Divisional application(s)EP20174492.7  / EP3742481
The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  17.12.2018
Opposition(s)26.08.2021No opposition filed within time limit [2021/44]
Fees paidRenewal fee
09.07.2015Renewal fee patent year 03
11.07.2016Renewal fee patent year 04
10.07.2017Renewal fee patent year 05
10.07.2018Renewal fee patent year 06
15.07.2019Renewal fee patent year 07
14.07.2020Renewal fee patent year 08
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Lapses during opposition  TooltipHU25.07.2013
AL25.11.2020
AT25.11.2020
CY25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
ES25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
MC25.11.2020
MK25.11.2020
MT25.11.2020
NL25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
IE25.07.2021
LU25.07.2021
BE31.07.2021
CH31.07.2021
LI31.07.2021
[2024/41]
Former [2024/22]HU25.07.2013
AL25.11.2020
AT25.11.2020
CY25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
ES25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
MC25.11.2020
MK25.11.2020
NL25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
IE25.07.2021
LU25.07.2021
BE31.07.2021
CH31.07.2021
LI31.07.2021
Former [2023/30]HU25.07.2013
AL25.11.2020
AT25.11.2020
CY25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
ES25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
MC25.11.2020
NL25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
IE25.07.2021
LU25.07.2021
BE31.07.2021
CH31.07.2021
LI31.07.2021
Former [2023/29]HU25.07.2013
AL25.11.2020
AT25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
ES25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
MC25.11.2020
NL25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
IE25.07.2021
LU25.07.2021
BE31.07.2021
CH31.07.2021
LI31.07.2021
Former [2022/35]AL25.11.2020
AT25.11.2020
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IT25.11.2020
LT25.11.2020
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MC25.11.2020
NL25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
IE25.07.2021
LU25.07.2021
BE31.07.2021
CH31.07.2021
LI31.07.2021
Former [2022/34]AL25.11.2020
AT25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
ES25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
MC25.11.2020
NL25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
LU25.07.2021
BE31.07.2021
CH31.07.2021
LI31.07.2021
Former [2022/23]AL25.11.2020
AT25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
ES25.11.2020
FI25.11.2020
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IT25.11.2020
LT25.11.2020
LV25.11.2020
MC25.11.2020
NL25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
LU25.07.2021
CH31.07.2021
LI31.07.2021
Former [2022/21]AL25.11.2020
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DK25.11.2020
EE25.11.2020
ES25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
MC25.11.2020
NL25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
PT25.03.2021
CH31.07.2021
LI31.07.2021
Former [2022/18]AL25.11.2020
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DK25.11.2020
EE25.11.2020
ES25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
MC25.11.2020
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PL25.11.2020
RO25.11.2020
RS25.11.2020
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SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
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IT25.11.2020
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SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
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PT25.03.2021
Former [2021/51]AL25.11.2020
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FI25.11.2020
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IT25.11.2020
LT25.11.2020
LV25.11.2020
NL25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
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Former [2021/49]AL25.11.2020
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LT25.11.2020
LV25.11.2020
NL25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/48]AL25.11.2020
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EE25.11.2020
FI25.11.2020
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LT25.11.2020
LV25.11.2020
NL25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/46]AL25.11.2020
AT25.11.2020
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DK25.11.2020
EE25.11.2020
FI25.11.2020
HR25.11.2020
LT25.11.2020
LV25.11.2020
NL25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/45]AL25.11.2020
AT25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
FI25.11.2020
HR25.11.2020
LT25.11.2020
LV25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/37]AT25.11.2020
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EE25.11.2020
FI25.11.2020
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PL25.11.2020
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RS25.11.2020
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SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/36]AT25.11.2020
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NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/35]AT25.11.2020
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