EP2704216 - Flexible semiconductor devices and methods of manufacturing the same [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 19.04.2019 Database last updated on 31.08.2024 | |
Former | The patent has been granted Status updated on 11.05.2018 | ||
Former | Grant of patent is intended Status updated on 15.03.2018 | Most recent event Tooltip | 26.06.2020 | Lapse of the patent in a contracting state New state(s): MK | published on 29.07.2020 [2020/31] | Applicant(s) | For all designated states Samsung Electronics Co., Ltd. 129, Samsung-ro Yeongtong-gu Suwon-si Gyeonggi-do 443-742 / KR | [2018/24] |
Former [2014/10] | For all designated states Samsung Electronics Co., Ltd 129, Samsung-ro Yeongtong-gu Suwon-si Gyeonggi-do 443-742 / KR | Inventor(s) | 01 /
Choi, Jun-hee c/o Samsung Advanced Insitute of Technology San 14-1 Nongseo-dong Giheung-gu, Yongin-si 449-712 Gyeonggi-do / KR | 02 /
Choi, Byoung-lyong c/o Samsung Advanced Insitute of Technology San 14-1 Nongseo-dong Giheung-gu, Yongin-si 449-712 Gyeonggi-do / KR | 03 /
Kim, Tae-ho c/o Samsung Advanced Insitute of Technology San 14-1 Nongseo-dong Giheung-gu, Yongin-si 449-712 Gyeonggi-do / KR | [2014/10] | Representative(s) | Elkington and Fife LLP Prospect House 8 Pembroke Road Sevenoaks, Kent TN13 1XR / GB | [N/P] |
Former [2018/24] | Portch, Daniel, et al Elkington and Fife LLP Prospect House 8 Pembroke Road Sevenoaks, Kent TN13 1XR / GB | ||
Former [2014/10] | Greene, Simon Kenneth Elkington and Fife LLP 8 Pembroke Road Sevenoaks Kent TN13 1XR / GB | Application number, filing date | 13180535.0 | 15.08.2013 | [2014/10] | Priority number, date | KR20120093884 | 27.08.2012 Original published format: KR 20120093884 | [2014/10] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP2704216 | Date: | 05.03.2014 | Language: | EN | [2014/10] | Type: | A3 Search report | No.: | EP2704216 | Date: | 16.12.2015 | Language: | EN | [2015/51] | Type: | B1 Patent specification | No.: | EP2704216 | Date: | 13.06.2018 | Language: | EN | [2018/24] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 05.10.2015 | Classification | IPC: | H01L33/24, H01L33/56, H01L31/00 | [2014/10] | CPC: |
B82Y20/00 (EP,US);
H01L33/30 (KR);
H01L31/03044 (US);
H01L31/035218 (EP,US);
H01L31/035236 (EP,US);
H01L31/03529 (EP,US);
H01L31/047 (EP,US);
H01L31/1848 (EP,US);
H01L31/1856 (EP,US);
H01L31/1892 (EP,US);
H01L33/00 (KR);
H01L33/0075 (US);
H01L33/12 (KR);
H01L33/32 (US);
H01L25/0753 (EP,US);
H01L2924/0002 (EP,US);
H01L33/0093 (EP,US);
H01L33/24 (EP,US);
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2016/25] |
Former [2014/10] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | Flexible Halbleiterbauelemente und Verfahren zu ihrer Herstellung | [2014/10] | English: | Flexible semiconductor devices and methods of manufacturing the same | [2014/10] | French: | Dispositifs semi-conducteurs flexibles et procédés de fabrication associés | [2014/10] | Examination procedure | 17.05.2016 | Amendment by applicant (claims and/or description) | 17.05.2016 | Examination requested [2016/25] | 16.03.2018 | Communication of intention to grant the patent | 25.04.2018 | Fee for grant paid | 25.04.2018 | Fee for publishing/printing paid | 25.04.2018 | Receipt of the translation of the claim(s) | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 16.03.2018 | Opposition(s) | 14.03.2019 | No opposition filed within time limit [2019/21] | Fees paid | Renewal fee | 31.08.2015 | Renewal fee patent year 03 | 31.08.2016 | Renewal fee patent year 04 | 31.08.2017 | Renewal fee patent year 05 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 15.08.2013 | AL | 13.06.2018 | AT | 13.06.2018 | CY | 13.06.2018 | CZ | 13.06.2018 | DK | 13.06.2018 | EE | 13.06.2018 | ES | 13.06.2018 | FI | 13.06.2018 | HR | 13.06.2018 | IT | 13.06.2018 | LT | 13.06.2018 | LV | 13.06.2018 | MC | 13.06.2018 | MK | 13.06.2018 | NL | 13.06.2018 | PL | 13.06.2018 | PT | 13.06.2018 | RO | 13.06.2018 | RS | 13.06.2018 | SE | 13.06.2018 | SI | 13.06.2018 | SK | 13.06.2018 | SM | 13.06.2018 | TR | 13.06.2018 | IE | 15.08.2018 | LU | 15.08.2018 | MT | 15.08.2018 | BE | 31.08.2018 | CH | 31.08.2018 | LI | 31.08.2018 | BG | 13.09.2018 | NO | 13.09.2018 | GR | 14.09.2018 | IS | 13.10.2018 | [2020/31] |
Former [2020/27] | HU | 15.08.2013 | |
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BG | 13.09.2018 | ||
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IE | 15.08.2018 | ||
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BE | 31.08.2018 | ||
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BG | 13.09.2018 | ||
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BE | 31.08.2018 | ||
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BG | 13.09.2018 | ||
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CH | 31.08.2018 | ||
LI | 31.08.2018 | ||
BG | 13.09.2018 | ||
NO | 13.09.2018 | ||
GR | 14.09.2018 | ||
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CH | 31.08.2018 | ||
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BG | 13.09.2018 | ||
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NO | 13.09.2018 | Documents cited: | Search | [A]US2003087467 (OOHATA TOYOHARU [JP], et al) [A] 1-3,9 * columns 61,61; figures 4,5 *; | [A]US2007125421 (PARK YOUNG J [KR], et al) [A] 9* figure 1 *; | [XA]US2010283054 (HIRANO KOICHI [JP], et al) [X] 1 * paragraphs [0093] , [0096] , [0100]; figure 2b * [A] 2-9; | [A]US2011042677 (SUZUKI TAKESHI [JP], et al) [A] 1,9 * the whole document *; | [XA]US2011266561 (ROGERS JOHN [US], et al) [X] 1-3,8 * paragraphs [0148] , [0200] - [0204]; figure 40 * [A] 9; | [A] - KALLURI R SARMA ET AL, "The Thermal Expansion Shear Separation (TESS) Technique for Producing Thin Self-Supporting Silicon Films for Low-Cost Solar Cells", IEEE TRANSACTIONS ON ELECTRON DEVICES, IEEE SERVICE CENTER, PISACATAWAY, NJ, US, (19800401), vol. ED-27, no. 4, ISSN 0018-9383, pages 651 - 656, XP001310342 [A] 9-15 * figure 1 * |