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EP2816594
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EP About this file: EP2816594
| EP2816594 - SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 08.07.2016 Database last updated on 02.11.2024 | Most recent event Tooltip | 08.07.2016 | Application deemed to be withdrawn | published on 10.08.2016 [2016/32] | Applicant(s) | For all designated states Panasonic Intellectual Property Management Co., Ltd. 7 OBP Panasonic Tower 1-61, Shiromi 2-chome Chuo-ku Osaka-shi, Osaka 540-6207 / JP | [N/P] |
| Former [2015/14] | For all designated states Panasonic Intellectual Property Management Co., Ltd. 7 OBP Panasonic Tower 1-61, Shiromi 2-chome Chuo-ku Osaka-shi Osaka 540-6207 / JP | ||
| Former [2014/52] | For all designated states Panasonic Corporation 1006 Oaza Kadoma Kadoma-shi, Osaka 571-8501 / JP | Inventor(s) | 01 /
KOJIMA, Toshiyuki c/o Panasonic Corporation Intellectual Property Center Planning and Management Group 7F OBP Panasonic Tower, 2-1-61 Shiromi Chuo-ku, Osaka 540-6207 / JP | 02 /
SHIRAISHI, Tsukasa c/o Panasonic Corporation Intellectual Property Center Planning and Management Group 7F OBP Panasonic Tower, 2-1-61 Shiromi Chuo-ku, Osaka 540-6207 / JP | 03 /
TSUKAHARA, Norihito c/o Panasonic Corporation Intellectual Property Center Planning and Management Group 7F OBP Panasonic Tower, 2-1-61 Shiromi Chuo-ku, Osaka 540-6207 / JP | 04 /
HIROSE, Takayuki c/o Panasonic Corporation Intellectual Property Center Planning and Management Group 7F OBP Panasonic Tower, 2-1-61 Shiromi Chuo-ku, Osaka 540-6207 / JP | 05 /
IKUTA, Keiko c/o Panasonic Corporation Intellectual Property Center Planning and Management Group 7F OBP Panasonic Tower, 2-1-61 Shiromi Chuo-ku, Osaka 540-6207 / JP | 06 /
KOYAMA, Masayoshi c/o Panasonic Corporation Intellectual Property Center Planning and Management Group 7F OBP Panasonic Tower, 2-1-61 Shiromi Chuo-ku, Osaka 540-6207 / JP | [2014/52] | Representative(s) | Grünecker Patent- und Rechtsanwälte PartG mbB Leopoldstraße 4 80802 München / DE | [N/P] |
| Former [2014/52] | Grünecker, Kinkeldey, Stockmair & Schwanhäusser Leopoldstrasse 4 80802 München / DE | Application number, filing date | 13749607.1 | 10.01.2013 | WO2013JP00036 | Priority number, date | JP20120029005 | 14.02.2012 Original published format: JP 2012029005 | [2014/52] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2013121691 | Date: | 22.08.2013 | Language: | JA | [2013/34] | Type: | A1 Application with search report | No.: | EP2816594 | Date: | 24.12.2014 | Language: | EN | [2014/52] | Search report(s) | International search report - published on: | JP | 22.08.2013 | (Supplementary) European search report - dispatched on: | EP | 15.07.2015 | Classification | IPC: | H01L23/40, H01L21/52, H01L23/48, H01L25/07, H01L25/18, H01L23/051 | [2015/33] | CPC: |
H01L23/36 (EP,US);
H01L21/4875 (US);
H01L23/051 (EP,US);
H01L23/4006 (EP,US);
H01L23/4093 (EP,US);
H01L23/492 (EP,US);
H01L24/03 (EP,US);
H01L24/72 (EP,US);
H01L2224/03003 (EP,US);
H01L2224/03005 (EP,US);
H01L2224/05639 (EP,US);
H01L2224/05644 (EP,US);
H01L2224/05655 (EP,US);
H01L2224/0603 (EP,US);
H01L2224/06181 (EP,US);
H01L2224/32225 (EP);
H01L2224/48091 (EP,US);
H01L2224/73265 (EP,US);
H01L23/24 (EP,US);
H01L24/05 (EP,US);
H01L24/06 (EP,US);
H01L2924/00013 (EP,US);
H01L2924/10272 (EP,US);
H01L2924/1033 (EP,US);
H01L2924/1203 (EP,US);
H01L2924/1305 (EP,US);
H01L2924/13055 (EP,US);
| C-Set: |
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2924/00013, H01L2224/05099 (EP,US);
H01L2924/00013, H01L2224/05599 (EP,US);
H01L2924/00013, H01L2224/13099 (US,EP);
H01L2924/13055, H01L2924/00 (US,EP);
H01L2924/13091, H01L2924/00 (US,EP); |
| Former IPC [2014/52] | H01L23/40, H01L21/52, H01L23/48, H01L25/07, H01L25/18 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2014/52] | Title | German: | HALBLEITERBAUELEMENT UND HERSTELLUNGSVERFAHREN DAFÜR | [2014/52] | English: | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | [2014/52] | French: | DISPOSITIF À SEMI-CONDUCTEUR ET PROCÉDÉ DE FABRICATION DE CELUI-CI | [2014/52] | Entry into regional phase | 24.03.2014 | Translation filed | 24.03.2014 | National basic fee paid | 24.03.2014 | Search fee paid | 24.03.2014 | Designation fee(s) paid | 24.03.2014 | Examination fee paid | Examination procedure | 24.03.2014 | Examination requested [2014/52] | 11.02.2016 | Application deemed to be withdrawn, date of legal effect [2016/32] | 21.03.2016 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2016/32] | Fees paid | Renewal fee | 23.01.2015 | Renewal fee patent year 03 | Penalty fee | Additional fee for renewal fee | 31.01.2016 | 04 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]JPH0289352 (MITSUBISHI ELECTRIC CORP) [Y] 5,6* abstract *; | [XYI]JPH11224923 (TOSHIBA CORP) [X] 1,2,4,7,15 * abstract * [Y] 3,5,6,8-12 [I] 13,14; | [Y]US6269864 (KABADI ASHOK N [US]) [Y] 3,8 * claim 15 *; | [Y] - FUMIO MIYASHIRO ET AL, "HIGH THERMAL CONDUCTIVITY ALUMINUM NITRIDE CERAMIC SUBSTRATES AND PACKAGES", IEEE TRANSACTIONS ON COMPONENTS, HYBRIDS AND MANUFACTURING TECHNOLOGY, IEEE INC. NEW YORK, US, (19900601), vol. 13, no. 2, doi:10.1109/33.56163, ISSN 0148-6411, pages 313 - 319, XP000179241 [Y] 9-12 * the whole document * DOI: http://dx.doi.org/10.1109/33.56163 | International search | [Y]JPH0239556 (MITSUBISHI ELECTRIC CORP); | [X]JPH0289352 (MITSUBISHI ELECTRIC CORP); | [A]JP2009117428 (HITACHI LTD) | by applicant | WO2008123386 | - "Direct lead bonded high performance power module", MITSUBISHI ELECTRIC CORPORATION TECHNICAL REPORT, (201004), vol. 84, no. 4, page 232 |