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Extract from the Register of European Patents

EP About this file: EP2864077

EP2864077 - LASER DRILLING METHOD AND SYSTEM FOR PRODUCING SHAPED HOLES [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  22.08.2024
Database last updated on 18.09.2024
FormerThe patent has been granted
Status updated on  15.09.2023
FormerGrant of patent is intended
Status updated on  16.05.2023
FormerExamination is in progress
Status updated on  07.09.2018
Most recent event   Tooltip22.08.2024No opposition filed within time limitpublished on 25.09.2024 [2024/39]
Applicant(s)For all designated states
IPG Photonics Corporation
50 Old Webster Road
Oxford, Massachusetts 01540 / US
[2015/18]
Inventor(s)01 / SHINER, William
c/o IPG Photonics Corporation
50 Old Webster Road
Oxford, MA 01540 / US
02 / MAYNARD, Steve
c/o IPG Photonics Corporation
50 Old Webster Road
Oxford, MA 01540 / US
 [2015/18]
Representative(s)Kobiako von Gamm, Iouri
Kobiako-von Gamm
Patent- und Rechtsanwaltskanzlei
PartG mbB
Bruckmannstraße 13
80638 München / DE
[2023/42]
Former [2015/18]Kobiako von Gamm, Iouri
Bettinger Scheffelt Kobiako von Gamm Rechtsanwälte
Patentanwälte Partnergesellschaft mbB
Bavariaring 14
80336 München / DE
Application number, filing date13806806.924.06.2013
[2023/42]
WO2013US47319
Priority number, dateUS201261663267P22.06.2012         Original published format: US 201261663267 P
[2015/18]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2013192612
Date:27.12.2013
Language:EN
[2013/52]
Type: A1 Application with search report 
No.:EP2864077
Date:29.04.2015
Language:EN
The application published by WIPO in one of the EPO official languages on 27.12.2013 takes the place of the publication of the European patent application.
[2015/18]
Type: B1 Patent specification 
No.:EP2864077
Date:18.10.2023
Language:EN
[2023/42]
Search report(s)International search report - published on:KR27.12.2013
(Supplementary) European search report - dispatched on:EP09.02.2016
ClassificationIPC:B23K26/046, B23K26/06, B23K26/0622, B23K26/382, B23K101/00
[2023/17]
CPC:
B23K26/046 (EP,CN,KR); B23K26/38 (KR); B23K26/0622 (EP,KR);
B23K26/0648 (EP,CN,KR); B23K26/389 (EP,CN,KR); B23K2101/001 (EP,CN)
Former IPC [2015/18]B23K26/38, B23K26/073, B23K26/08
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2015/18]
Extension statesBANot yet paid
MENot yet paid
TitleGerman:LASERBOHRVERFAHREN UND SYSTEM ZUR HERSTELLUNG VON PROFILIERTEN LÖCHERN[2015/18]
English:LASER DRILLING METHOD AND SYSTEM FOR PRODUCING SHAPED HOLES[2015/18]
French:PROCÉDÉ DE PERÇAGE AU LASER ET SYSTÈME DE PRODUCTION DE TROUS PROFILÉS[2015/18]
Entry into regional phase16.12.2014National basic fee paid 
16.12.2014Search fee paid 
16.12.2014Designation fee(s) paid 
16.12.2014Examination fee paid 
Examination procedure16.12.2014Examination requested  [2015/18]
05.09.2016Amendment by applicant (claims and/or description)
07.09.2018Despatch of a communication from the examining division (Time limit: M06)
18.03.2019Reply to a communication from the examining division
28.11.2019Despatch of a communication from the examining division (Time limit: M06)
08.06.2020Reply to a communication from the examining division
16.04.2021Despatch of a communication from the examining division (Time limit: M04)
06.08.2021Reply to a communication from the examining division
17.05.2023Communication of intention to grant the patent
08.09.2023Fee for grant paid
08.09.2023Fee for publishing/printing paid
08.09.2023Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  07.09.2018
Opposition(s)19.07.2024No opposition filed within time limit [2024/39]
Fees paidRenewal fee
20.05.2015Renewal fee patent year 03
10.06.2016Renewal fee patent year 04
16.06.2017Renewal fee patent year 05
11.06.2018Renewal fee patent year 06
13.06.2019Renewal fee patent year 07
15.06.2020Renewal fee patent year 08
14.06.2021Renewal fee patent year 09
13.05.2022Renewal fee patent year 10
12.05.2023Renewal fee patent year 11
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Lapses during opposition  TooltipAT18.10.2023
CZ18.10.2023
DK18.10.2023
EE18.10.2023
ES18.10.2023
HR18.10.2023
IT18.10.2023
LT18.10.2023
LV18.10.2023
NL18.10.2023
PL18.10.2023
RO18.10.2023
RS18.10.2023
SE18.10.2023
SK18.10.2023
SM18.10.2023
BG18.01.2024
NO18.01.2024
GR19.01.2024
IS18.02.2024
PT19.02.2024
[2024/36]
Former [2024/35]AT18.10.2023
CZ18.10.2023
DK18.10.2023
EE18.10.2023
ES18.10.2023
HR18.10.2023
LT18.10.2023
LV18.10.2023
NL18.10.2023
PL18.10.2023
RO18.10.2023
RS18.10.2023
SE18.10.2023
SM18.10.2023
BG18.01.2024
NO18.01.2024
GR19.01.2024
IS18.02.2024
PT19.02.2024
Former [2024/34]AT18.10.2023
DK18.10.2023
EE18.10.2023
ES18.10.2023
HR18.10.2023
LT18.10.2023
LV18.10.2023
NL18.10.2023
PL18.10.2023
RS18.10.2023
SE18.10.2023
SM18.10.2023
BG18.01.2024
NO18.01.2024
GR19.01.2024
IS18.02.2024
PT19.02.2024
Former [2024/33]AT18.10.2023
DK18.10.2023
ES18.10.2023
HR18.10.2023
LT18.10.2023
LV18.10.2023
NL18.10.2023
PL18.10.2023
RS18.10.2023
SE18.10.2023
SM18.10.2023
BG18.01.2024
NO18.01.2024
GR19.01.2024
IS18.02.2024
PT19.02.2024
Former [2024/26]AT18.10.2023
ES18.10.2023
HR18.10.2023
LT18.10.2023
LV18.10.2023
NL18.10.2023
PL18.10.2023
RS18.10.2023
SE18.10.2023
BG18.01.2024
NO18.01.2024
GR19.01.2024
IS18.02.2024
PT19.02.2024
Former [2024/25]AT18.10.2023
ES18.10.2023
HR18.10.2023
LT18.10.2023
NL18.10.2023
PL18.10.2023
RS18.10.2023
SE18.10.2023
BG18.01.2024
NO18.01.2024
GR19.01.2024
IS18.02.2024
PT19.02.2024
Former [2024/24]AT18.10.2023
ES18.10.2023
HR18.10.2023
LT18.10.2023
NL18.10.2023
RS18.10.2023
SE18.10.2023
BG18.01.2024
NO18.01.2024
GR19.01.2024
IS18.02.2024
PT19.02.2024
Former [2024/23]AT18.10.2023
ES18.10.2023
LT18.10.2023
NL18.10.2023
BG18.01.2024
GR19.01.2024
IS18.02.2024
PT19.02.2024
Former [2024/21]LT18.10.2023
NL18.10.2023
BG18.01.2024
GR19.01.2024
IS18.02.2024
Former [2024/20]NL18.10.2023
GR19.01.2024
IS18.02.2024
Former [2024/17]NL18.10.2023
Documents cited:Search[A]US5739502  (ANDERSON THOMAS EDWIN [US], et al) [A] 1-20 * column 2, line 62 - column 4, line 5; figures 5,12,14,15 *;
 [A]DE69424606T  (FUJIKURA LTD [JP]) [A] 1,11 * figure 1B *;
 [A]US2003127438  (RICHTER KARL-HERMANN [DE], et al) [A] 1,9,11-13* paragraph [0023] - paragraph [0032]; claims 6-8 *;
 [A]US2010282721  (BUNKER RONALD SCOTT [US], et al) [A] 1,11 * paragraph [0026] *
International search[A]KR860000128B  (UNITED TECHNOLOGIES CORP [US]);
 [A]US5593606  (OWEN MARK D [US], et al);
 [A]JPH11197871  (TOSHIBA CORP);
 [A]JPH11347766  (SUMITOMO HEAVY INDUSTRIES);
 [A]KR20100136473  (ELECTRO SCIENT IND INC [US])
ExaminationWO2012067228
by applicantWO2012067228
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.