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Extract from the Register of European Patents

EP About this file: EP2875521

EP2875521 - ETCHING METHOD, AND METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE PRODUCT AND SEMICONDUCTOR DEVICE USING THE SAME [Right-click to bookmark this link]
Status	No opposition filed within time limit Status updated on 15.01.2021 Database last updated on 24.01.2025
Former	The patent has been granted Status updated on 07.02.2020
Former	Grant of patent is intended Status updated on 24.11.2019
Most recent event Tooltip	08.07.2022	Lapse of the patent in a contracting state New state(s): MK	published on 10.08.2022 [2022/32]
Applicant(s)	For all designated states FUJIFILM Corporation 26-30, Nishiazabu 2-chome Minato-ku Tokyo 106-8620 / JP
	[N/P]
Former [2015/22]	For all designated states FUJIFILM Corporation 26-30, Nishiazabu 2-chome Minato-ku Tokyo 106-8620 / JP
Inventor(s)	01 / MURO, Naotsugu c/o FUJIFILM Corporation 4000 Kawashiri Yoshida-cho Haibara-gun Shizuoka 421-0396 / JP
	02 / KAMIMURA, Tetsuya c/o FUJIFILM Corporation 4000 Kawashiri Yoshida-cho Haibara-gun Shizuoka 421-0396 / JP
	03 / INABA, Tadashi c/o FUJIFILM Corporation 4000 Kawashiri Yoshida-cho Haibara-gun Shizuoka 421-0396 / JP
	04 / WATANABE, Takahiro c/o FUJIFILM Corporation 4000 Kawashiri Yoshida-cho Haibara-gun Shizuoka 421-0396 / JP
	05 / PARK, Kee Young c/o FUJIFILM Corporation 4000 Kawashiri Yoshida-cho Haibara-gun Shizuoka, 4210396 / JP
	[2015/22]
Representative(s)	Hoffmann Eitle Patent- und Rechtsanwälte PartmbB Arabellastraße 30 81925 München / DE
	[2015/22]
Application number, filing date	13819989.8	17.07.2013
	[2020/11]
	WO2013JP69961
Priority number, date	JP20120161913	20.07.2012 Original published format: JP 2012161913
	[2015/22]
Filing language	EN
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	WO2014014125
	Date:	23.01.2014
	Language:	EN
	[2014/04]
	Type:	A1 Application with search report
	No.:	EP2875521
	Date:	27.05.2015
	Language:	EN
	The application published by WIPO in one of the EPO official languages on 23.01.2014 takes the place of the publication of the European patent application.
	[2015/22]
	Type:	B1 Patent specification
	No.:	EP2875521
	Date:	11.03.2020
	Language:	EN
	[2020/11]
Search report(s)	International search report - published on:	JP	23.01.2014
	(Supplementary) European search report - dispatched on:	EP	28.01.2016
Classification	IPC:	H01L21/3213, // H01L21/311	[2016/09]
	CPC:	H01L21/02063 (EP,CN,KR,US); H01L21/30608 (US); H01L21/31144 (EP,KR,US); H01L21/32134 (EP,CN,KR,US)
	Former IPC [2015/22]	H01L21/306, H01L21/308
Designated contracting states	AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2015/22]
Extension states	BA	Not yet paid
	ME	Not yet paid
Title	German:	ÄTZVERFAHREN UND VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERSUBSTRATPRODUKTS SOWIE HALBLEITERBAUELEMENT DAMIT	[2015/22]
	English:	ETCHING METHOD, AND METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE PRODUCT AND SEMICONDUCTOR DEVICE USING THE SAME	[2015/22]
	French:	PROCÉDÉ DE GRAVURE, PROCÉDÉ DE PRODUCTION D'UN SUBSTRAT SEMI-CONDUCTEUR ET DISPOSITIF À SEMI-CONDUCTEUR L'UTILISANT	[2015/22]
Entry into regional phase	09.02.2015	National basic fee paid
	09.02.2015	Search fee paid
	09.02.2015	Designation fee(s) paid
	09.02.2015	Examination fee paid
Examination procedure	09.02.2015	Examination requested [2015/22]
	22.08.2016	Amendment by applicant (claims and/or description)
	25.11.2019	Communication of intention to grant the patent
	30.01.2020	Fee for grant paid
	30.01.2020	Fee for publishing/printing paid
	30.01.2020	Receipt of the translation of the claim(s)
Divisional application(s)	The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 25.11.2019
Opposition(s)	14.12.2020	No opposition filed within time limit [2021/07]
Fees paid	Renewal fee
	28.07.2015	Renewal fee patent year 03
	11.07.2016	Renewal fee patent year 04
	12.07.2017	Renewal fee patent year 05
	11.07.2018	Renewal fee patent year 06
	15.07.2019	Renewal fee patent year 07
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition Tooltip	HU	17.07.2013
	AL	11.03.2020
	AT	11.03.2020
	CY	11.03.2020
	CZ	11.03.2020
	DK	11.03.2020
	EE	11.03.2020
	ES	11.03.2020
	FI	11.03.2020
	HR	11.03.2020
	IT	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	MC	11.03.2020
	MK	11.03.2020
	MT	11.03.2020
	NL	11.03.2020
	PL	11.03.2020
	RO	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	SI	11.03.2020
	SK	11.03.2020
	SM	11.03.2020
	TR	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
	GB	17.07.2020
	IE	17.07.2020
	LU	17.07.2020
	BE	31.07.2020
	CH	31.07.2020
	FR	31.07.2020
	LI	31.07.2020
	PT	05.08.2020
	[2022/31]
Former [2022/30]	HU	17.07.2013
	AL	11.03.2020
	AT	11.03.2020
	CY	11.03.2020
	CZ	11.03.2020
	DK	11.03.2020
	EE	11.03.2020
	ES	11.03.2020
	FI	11.03.2020
	HR	11.03.2020
	IT	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	MC	11.03.2020
	MT	11.03.2020
	NL	11.03.2020
	PL	11.03.2020
	RO	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	SI	11.03.2020
	SK	11.03.2020
	SM	11.03.2020
	TR	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
	GB	17.07.2020
	IE	17.07.2020
	LU	17.07.2020
	BE	31.07.2020
	CH	31.07.2020
	FR	31.07.2020
	LI	31.07.2020
	PT	05.08.2020
Former [2022/27]	HU	17.07.2013
	AT	11.03.2020
	CY	11.03.2020
	CZ	11.03.2020
	DK	11.03.2020
	EE	11.03.2020
	ES	11.03.2020
	FI	11.03.2020
	HR	11.03.2020
	IT	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	MC	11.03.2020
	MT	11.03.2020
	NL	11.03.2020
	PL	11.03.2020
	RO	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	SI	11.03.2020
	SK	11.03.2020
	SM	11.03.2020
	TR	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
	GB	17.07.2020
	IE	17.07.2020
	LU	17.07.2020
	BE	31.07.2020
	CH	31.07.2020
	FR	31.07.2020
	LI	31.07.2020
	PT	05.08.2020
Former [2022/26]	AT	11.03.2020
	CZ	11.03.2020
	DK	11.03.2020
	EE	11.03.2020
	ES	11.03.2020
	FI	11.03.2020
	HR	11.03.2020
	IT	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	MC	11.03.2020
	NL	11.03.2020
	PL	11.03.2020
	RO	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	SI	11.03.2020
	SK	11.03.2020
	SM	11.03.2020
	TR	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
	GB	17.07.2020
	IE	17.07.2020
	LU	17.07.2020
	BE	31.07.2020
	CH	31.07.2020
	FR	31.07.2020
	LI	31.07.2020
	PT	05.08.2020
Former [2021/37]	AT	11.03.2020
	CZ	11.03.2020
	DK	11.03.2020
	EE	11.03.2020
	ES	11.03.2020
	FI	11.03.2020
	HR	11.03.2020
	IT	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	MC	11.03.2020
	NL	11.03.2020
	PL	11.03.2020
	RO	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	SI	11.03.2020
	SK	11.03.2020
	SM	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
	GB	17.07.2020
	IE	17.07.2020
	LU	17.07.2020
	BE	31.07.2020
	CH	31.07.2020
	FR	31.07.2020
	LI	31.07.2020
	PT	05.08.2020
Former [2021/23]	AT	11.03.2020
	CZ	11.03.2020
	DK	11.03.2020
	EE	11.03.2020
	ES	11.03.2020
	FI	11.03.2020
	HR	11.03.2020
	IT	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	MC	11.03.2020
	NL	11.03.2020
	PL	11.03.2020
	RO	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	SI	11.03.2020
	SK	11.03.2020
	SM	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
	GB	17.07.2020
	LU	17.07.2020
	BE	31.07.2020
	CH	31.07.2020
	FR	31.07.2020
	LI	31.07.2020
	PT	05.08.2020
Former [2021/22]	AT	11.03.2020
	CZ	11.03.2020
	DK	11.03.2020
	EE	11.03.2020
	ES	11.03.2020
	FI	11.03.2020
	HR	11.03.2020
	IT	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	MC	11.03.2020
	NL	11.03.2020
	PL	11.03.2020
	RO	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	SI	11.03.2020
	SK	11.03.2020
	SM	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
	GB	17.07.2020
	LU	17.07.2020
	CH	31.07.2020
	LI	31.07.2020
	PT	05.08.2020
Former [2021/20]	AT	11.03.2020
	CZ	11.03.2020
	DK	11.03.2020
	EE	11.03.2020
	ES	11.03.2020
	FI	11.03.2020
	HR	11.03.2020
	IT	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	MC	11.03.2020
	NL	11.03.2020
	PL	11.03.2020
	RO	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	SI	11.03.2020
	SK	11.03.2020
	SM	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
	LU	17.07.2020
	CH	31.07.2020
	LI	31.07.2020
	PT	05.08.2020
Former [2021/13]	AT	11.03.2020
	CZ	11.03.2020
	DK	11.03.2020
	EE	11.03.2020
	ES	11.03.2020
	FI	11.03.2020
	HR	11.03.2020
	IT	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	MC	11.03.2020
	NL	11.03.2020
	PL	11.03.2020
	RO	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	SI	11.03.2020
	SK	11.03.2020
	SM	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
	PT	05.08.2020
Former [2021/10]	AT	11.03.2020
	CZ	11.03.2020
	DK	11.03.2020
	EE	11.03.2020
	ES	11.03.2020
	FI	11.03.2020
	HR	11.03.2020
	IT	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	NL	11.03.2020
	PL	11.03.2020
	RO	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	SI	11.03.2020
	SK	11.03.2020
	SM	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
	PT	05.08.2020
Former [2021/09]	AT	11.03.2020
	CZ	11.03.2020
	DK	11.03.2020
	EE	11.03.2020
	ES	11.03.2020
	FI	11.03.2020
	HR	11.03.2020
	IT	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	NL	11.03.2020
	RO	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	SK	11.03.2020
	SM	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
	PT	05.08.2020
Former [2021/08]	CZ	11.03.2020
	DK	11.03.2020
	EE	11.03.2020
	ES	11.03.2020
	FI	11.03.2020
	HR	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	NL	11.03.2020
	RO	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	SK	11.03.2020
	SM	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
	PT	05.08.2020
Former [2020/50]	CZ	11.03.2020
	EE	11.03.2020
	FI	11.03.2020
	HR	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	NL	11.03.2020
	RO	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	SK	11.03.2020
	SM	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
	PT	05.08.2020
Former [2020/49]	CZ	11.03.2020
	FI	11.03.2020
	HR	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	NL	11.03.2020
	RO	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	SK	11.03.2020
	SM	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
	PT	05.08.2020
Former [2020/48]	FI	11.03.2020
	HR	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	NL	11.03.2020
	RO	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	SM	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
	PT	05.08.2020
Former [2020/47]	FI	11.03.2020
	HR	11.03.2020
	LT	11.03.2020
	LV	11.03.2020
	NL	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
Former [2020/46]	FI	11.03.2020
	HR	11.03.2020
	LV	11.03.2020
	NL	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
	IS	11.07.2020
Former [2020/45]	FI	11.03.2020
	HR	11.03.2020
	LV	11.03.2020
	NL	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
Former [2020/39]	FI	11.03.2020
	HR	11.03.2020
	LV	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	BG	11.06.2020
	NO	11.06.2020
	GR	12.06.2020
Former [2020/38]	FI	11.03.2020
	HR	11.03.2020
	LV	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	NO	11.06.2020
	GR	12.06.2020
Former [2020/37]	FI	11.03.2020
	HR	11.03.2020
	LV	11.03.2020
	RS	11.03.2020
	SE	11.03.2020
	NO	11.06.2020
Former [2020/35]	FI	11.03.2020
	NO	11.06.2020
Documents cited:	Search	[I]JPH05121378 (SONY CORP) [I] 1,2,4-12 * abstract ** paragraphs [0015] - [0022]; figure 1 *;
		[I]WO2007044446 (ADVANCED TECH MATERIALS [US], et al) [I] 1-12 * paragraphs [0010] , [0034] , [0038] , [0042] , [0046] - [0050] - [0052] - [0063] - [0066] , [0071] - [0077]; figures 1A,1B *;
		[I]US2010203731 (KONG BOB [US], et al) [I] 1-12 * paragraphs [0001] , [0009] - [0012]; figures 1,2A-2C *
	International search	EP0000083 [ ] (SOLVAY [BE]);
		EP0000085 [ ] (EURATOM [LU]);
		EP0000087 [ ] (UNILEVER NV [NL], et al);
		EP0000092 [ ] (PFIZER [US]);
		EP0000095 [ ] (EVIN IND LTD [CA]);
		EP0000105 [ ] (REXNORD INC [US]);
		EP0000114 [ ] (IBM [US]);
		EP0000129 [ ] (SUED CHEMIE AG [DE]);
		EP0000137 [ ] (HOECHST AG [DE]);
		EP0000145 [ ] (COMP GENERALE ELECTRICITE [FR]);
		[A]JPH0364473 (VARIAN ASSOCIATES);
		[A]EP0711846 (APPLIED MATERIALS INC [US]);
		[A]US5965465 (RATH DAVID L [US], et al);
		[A]JP2006093453 (SILTRONIC JAPAN CORP);
		[A]WO2006110279 (SACHEM INC [US], et al);
		[A]JP2008285508 (MITSUBISHI GAS CHEMICAL CO);
		[A]EP2234145 (WAKO PURE CHEM IND LTD [JP]);
		[AP]JP2013033942 (FUJIFILM CORP)

The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.

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