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Extract from the Register of European Patents

EP About this file: EP2899756

EP2899756 - SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  17.03.2017
Database last updated on 25.09.2024
Most recent event   Tooltip17.03.2017Withdrawal of applicationpublished on 19.04.2017  [2017/16]
Applicant(s)For all designated states
Micro Module Technology Co., Ltd.
Leading venture plaza
75-1
Ono-cho
Tsurumi-ku
Yokohama-shi, Kanagawa 230-0046 / JP
[2015/31]
Inventor(s)01 / HARAZONO, Fumikazu
652-39, Sugeta-cho
Kanagawa-ku
Yokohama-shi, Kanagawa 221-0864 / JP
 [2016/07]
Former [2015/31]01 / HARAZONO, Fumikazu
652-39
Sugeta-cho
Kanagawa-ku
Yokohama-shi Kanagawa 221-0864 / JP
Representative(s)Strehl Schübel-Hopf & Partner
Maximilianstrasse 54
80538 München / DE
[2015/31]
Application number, filing date13823908.230.08.2013
WO2013JP73335
Priority number, dateJP2012020561819.09.2012         Original published format: JP 2012205618
[2015/31]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2014045842
Date:27.03.2014
Language:JA
[2014/13]
Type: A1 Application with search report 
No.:EP2899756
Date:29.07.2015
Language:EN
[2015/31]
Search report(s)International search report - published on:JP27.03.2014
(Supplementary) European search report - dispatched on:EP30.09.2016
ClassificationIPC:H01L25/07, H01L25/18, H01L23/433, H01L23/31, H01L23/495, H01L23/498, H01L23/00, H01L29/78
[2016/44]
CPC:
H01L25/18 (EP,US); H01L23/3107 (US); H01L23/3675 (US);
H01L23/4334 (EP,US); H01L23/49524 (EP,US); H01L23/49534 (EP,US);
H01L23/49562 (EP,US); H01L23/49575 (EP,US); H01L23/49844 (EP,US);
H01L23/528 (US); H01L24/40 (EP); H01L24/41 (EP);
H01L25/074 (EP); H01L29/7395 (US); H01L29/7802 (EP,US);
H01L29/7827 (EP,US); H01L29/861 (US); H01L2224/0603 (EP);
H01L2224/26175 (EP,US); H01L2224/291 (EP,US); H01L2224/29294 (EP,US);
H01L2224/29339 (EP,US); H01L2224/32245 (EP,US); H01L2224/33181 (EP,US);
H01L2224/37147 (EP); H01L2224/40095 (EP); H01L2224/8314 (EP,US);
H01L2224/83385 (EP,US); H01L2224/83801 (EP); H01L2224/8384 (EP);
H01L23/3128 (EP,US); H01L23/49816 (EP,US); H01L23/49838 (EP,US);
H01L24/29 (EP,US); H01L24/32 (EP,US); H01L24/37 (EP);
H01L24/83 (EP,US); H01L2924/00014 (EP); H01L2924/1305 (EP,US);
H01L2924/13055 (EP,US); H01L2924/13091 (EP,US); H01L2924/15153 (EP,US) (-)
C-Set:
H01L2224/291, H01L2924/014 (US,EP);
H01L2224/29294, H01L2924/00014 (US,EP);
H01L2224/29339, H01L2924/00014 (US,EP);
H01L2224/37147, H01L2924/00014 (EP);
H01L2924/00014, H01L2224/84 (EP);
H01L2924/13055, H01L2924/00 (EP,US);
H01L2924/1305, H01L2924/00 (EP,US);
H01L2924/13091, H01L2924/00 (US,EP)
(-)
Former IPC [2015/31]H01L25/07, H01L25/18
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2015/31]
TitleGerman:HALBLEITERBAUELEMENT[2015/31]
English:SEMICONDUCTOR DEVICE[2015/31]
French:DISPOSITIF SEMI-CONDUCTEUR[2015/31]
Entry into regional phase31.01.2014Translation filed 
25.03.2014National basic fee paid 
25.03.2014Search fee paid 
25.03.2014Designation fee(s) paid 
25.03.2014Examination fee paid 
Examination procedure25.03.2014Examination requested  [2015/31]
10.03.2017Application withdrawn by applicant  [2017/16]
Fees paidRenewal fee
25.08.2015Renewal fee patent year 03
31.08.2016Renewal fee patent year 04
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Documents cited:Search[A]US2007241393  (HAUENSTEIN HENNING [US]) [A] 1,3-7 * paragraphs [0062] , [0063]; figure 9 *;
 [A]WO2009020061  (ROHM CO LTD [JP], et al) [A] 1,3-7 * figures 8,9,10 *;
 [A]US2011096509  (YOSHIMOCHI KENICHI [JP]) [A] 1,3-7* paragraph [0061]; figures 8,9,10 *
International search[A]JP2005302951  (TOSHIBA CORP);
 [A]JP2006134990  (FUJI ELECTRIC HOLDINGS);
 [A]WO2009020061  (ROHM CO LTD [JP], et al);
 [A]JP2009295794  (MITSUBISHI ELECTRIC CORP)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.