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Extract from the Register of European Patents

EP About this file: EP2772948

EP2772948 - METHOD OF TRANSFERRING SEMICONDUCTOR ELEMENTS AND OF MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICES [Right-click to bookmark this link]
Former [2014/36]Method for transferring semiconductor elements and for manufacturing flexible semiconductor devices
[2017/41]
StatusNo opposition filed within time limit
Status updated on  15.02.2019
Database last updated on 25.09.2024
FormerThe patent has been granted
Status updated on  09.03.2018
FormerGrant of patent is intended
Status updated on  18.09.2017
FormerRequest for examination was made
Status updated on  31.03.2017
Most recent event   Tooltip01.07.2022Lapse of the patent in a contracting state
New state(s): MK		published on 03.08.2022  [2022/31]
Applicant(s)For all designated states
Samsung Electronics Co., Ltd.
129, Samsung-ro
Yeongtong-gu
Suwon-si Gyeonggi-do 443-742 / KR
[2014/36]
Inventor(s)01 / Cho, Eun-hyoung
c/o Samsung Advanced Insitute of Technology
San 14-1 Nongseo-dong, Giheung-gu, Yongin-si
Gyeonggi-do / KR
02 / Choi, Jun-hee
c/o Samsung Advanced Insitute of Technology
San 14-1 Nongseo-dong, Giheung-gu, Yongin-si
Gyeonggi-do / KR
03 / Sohn, Jin-seung
c/o Samsung Advanced Insitute of Technology
San 14-1 Nongseo-dong, Giheung-gu, Yongin-si
Gyeonggi-do / KR
04 / Moon, Chang-youl
c/o Samsung Advanced Insitute of Technology
San 14-1 Nongseo-dong, Giheung-gu, Yongin-si
Gyeonggi-do / KR
 [2014/36]
Representative(s)Elkington and Fife LLP
Prospect House
8 Pembroke Road
Sevenoaks, Kent TN13 1XR / GB
[N/P]
Former [2018/15]Portch, Daniel, et al
Elkington and Fife LLP Prospect House 8 Pembroke Road
Sevenoaks, Kent TN13 1XR / GB
Former [2014/36]Greene, Simon Kenneth
Elkington and Fife LLP
8 Pembroke Road
Sevenoaks Kent TN13 1XR / GB
Application number, filing date14156745.326.02.2014
[2014/36]
Priority number, dateKR2013002138327.02.2013         Original published format: KR 20130021383
[2014/36]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP2772948
Date:03.09.2014
Language:EN
[2014/36]
Type: A3 Search report 
No.:EP2772948
Date:28.09.2016
Language:EN
[2016/39]
Type: B1 Patent specification 
No.:EP2772948
Date:11.04.2018
Language:EN
[2018/15]
Search report(s)(Supplementary) European search report - dispatched on:EP30.08.2016
ClassificationIPC:H01L31/0352, H01L31/0392, H01L31/18, H01L33/00, H01L33/44, // H01L23/31, H01L27/15, H01L33/32, H01S5/02, H01S5/323
[2017/41]
CPC:
H01L23/3192 (EP,US); H01L31/04 (KR); H01L33/0093 (EP,CN,US);
H01L21/7806 (US); H01L21/02343 (US); H01L21/20 (KR);
H01L21/28 (US); H01L21/82 (US); H01L31/035281 (EP,US);
H01L31/03926 (EP,US); H01L31/1848 (EP,US); H01L31/1856 (EP,US);
H01L31/1892 (EP,US); H01L31/1896 (EP,US); H01L33/44 (EP,US);
H01L27/153 (EP,US); H01L2933/0016 (EP,US); H01L33/02 (CN,US);
H01L33/32 (EP,CN,US); H01S5/0217 (EP,US); H01S5/32341 (EP,US);
Y02E10/50 (EP); Y02E10/544 (US); Y02P70/50 (EP,US) (-)
Former IPC [2016/39]H01L33/00, H01L33/44, H01L31/0216, H01S5/028, // H01L21/56, H01L27/15, H01L33/32
Former IPC [2014/36]H01L33/00, // H01L33/32
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2017/18]
Former [2014/36]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:VERFAHREN ZUM TRANSFER VON HALBLEITERELEMENTEN UND ZUR HERSTELLUNG VON FLEXIBELN HALBLEITERVORRICHTUNGEN[2017/41]
English:METHOD OF TRANSFERRING SEMICONDUCTOR ELEMENTS AND OF MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICES[2017/41]
French:PROCÉDÉ DE TRANSFERT D'ÉLÉMENTS SEMI-CONDUCTEURS ET DE FABRICATION DE DISPOSITIFS SEMI-CONDUCTEURS FLEXIBLES[2017/41]
Former [2014/36]Verfahren zur Übermittlung von Halbleiterelementen und zur Herstellung von flexibeln Halbleitervorrichtungen
Former [2014/36]Method for transferring semiconductor elements and for manufacturing flexible semiconductor devices
Former [2014/36]Procédé de transfert d'éléments semi-conducteurs et de fabrication de dispositifs semi-conducteurs flexibles
Examination procedure28.03.2017Examination requested  [2017/18]
19.09.2017Communication of intention to grant the patent
26.01.2018Receipt of the translation of the claim(s)
29.01.2018Fee for grant paid
29.01.2018Fee for publishing/printing paid
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  19.09.2017
Opposition(s)14.01.2019No opposition filed within time limit [2019/12]
Fees paidRenewal fee
29.02.2016Renewal fee patent year 03
28.02.2017Renewal fee patent year 04
28.02.2018Renewal fee patent year 05
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU26.02.2014
AL11.04.2018
AT11.04.2018
CY11.04.2018
CZ11.04.2018
DK11.04.2018
EE11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
IT11.04.2018
LT11.04.2018
LV11.04.2018
MC11.04.2018
MK11.04.2018
NL11.04.2018
PL11.04.2018
RO11.04.2018
RS11.04.2018
SE11.04.2018
SI11.04.2018
SK11.04.2018
SM11.04.2018
TR11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
IS11.08.2018
PT13.08.2018
[2022/31]
Former [2021/32]HU26.02.2014
AL11.04.2018
AT11.04.2018
CY11.04.2018
CZ11.04.2018
DK11.04.2018
EE11.04.2018
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FI11.04.2018
HR11.04.2018
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MC11.04.2018
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RO11.04.2018
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SK11.04.2018
SM11.04.2018
TR11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
IS11.08.2018
PT13.08.2018
Former [2021/31]AL11.04.2018
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PL11.04.2018
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SK11.04.2018
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TR11.04.2018
BG11.07.2018
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GR12.07.2018
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PT13.08.2018
Former [2021/26]AL11.04.2018
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RO11.04.2018
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SI11.04.2018
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SM11.04.2018
TR11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2020/16]AL11.04.2018
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DK11.04.2018
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PL11.04.2018
RO11.04.2018
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SI11.04.2018
SK11.04.2018
SM11.04.2018
TR11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2019/45]AL11.04.2018
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BG11.07.2018
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GR12.07.2018
PT13.08.2018
Former [2019/26]AL11.04.2018
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SE11.04.2018
SI11.04.2018
SK11.04.2018
SM11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2019/11]AL11.04.2018
AT11.04.2018
CZ11.04.2018
DK11.04.2018
EE11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
IT11.04.2018
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PL11.04.2018
RO11.04.2018
RS11.04.2018
SE11.04.2018
SK11.04.2018
SM11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2019/10]AL11.04.2018
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EE11.04.2018
ES11.04.2018
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SE11.04.2018
SK11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2019/09]AL11.04.2018
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EE11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
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PL11.04.2018
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SE11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2019/08]AL11.04.2018
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ES11.04.2018
FI11.04.2018
HR11.04.2018
LT11.04.2018
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NL11.04.2018
PL11.04.2018
RS11.04.2018
SE11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2019/03]AL11.04.2018
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FI11.04.2018
HR11.04.2018
LT11.04.2018
LV11.04.2018
NL11.04.2018
PL11.04.2018
RS11.04.2018
SE11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2018/52]AL11.04.2018
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FI11.04.2018
HR11.04.2018
LT11.04.2018
LV11.04.2018
NL11.04.2018
PL11.04.2018
RS11.04.2018
SE11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
Former [2018/51]AL11.04.2018
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HR11.04.2018
LT11.04.2018
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NL11.04.2018
PL11.04.2018
RS11.04.2018
SE11.04.2018
BG11.07.2018
NO11.07.2018
Former [2018/50]AL11.04.2018
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FI11.04.2018
HR11.04.2018
LT11.04.2018
NL11.04.2018
PL11.04.2018
SE11.04.2018
BG11.07.2018
NO11.07.2018
Former [2018/49]AL11.04.2018
ES11.04.2018
FI11.04.2018
LT11.04.2018
NL11.04.2018
PL11.04.2018
SE11.04.2018
BG11.07.2018
NO11.07.2018
Former [2018/47]AL11.04.2018
ES11.04.2018
FI11.04.2018
LT11.04.2018
NL11.04.2018
NO11.07.2018
Former [2018/46]AL11.04.2018
LT11.04.2018
NL11.04.2018
NO11.07.2018
Former [2018/43]NL11.04.2018
Documents cited:Search[A]US4962985  (LEGRANGE JANE D [US]) [A] 1,6,7 * column 2, line 60 - column 3, line 19 * * column 3, lines 40-50; figure 2 * * column 4, lines 19-32; figure 4 * * column 4, line 49 - column 5, line 46 *;
 [A]US2004012337  (OOHATA TOYOHARU [JP], et al) [A] 1,3,8,9 * paragraphs [0001] , [0 33] - [0075]; figures 1-17 *;
 [A]US2009102028  (KRISHNAN SHUTESH [MY], et al) [A] 1,6,7 * paragraphs [0006] - [0013] - [0 29] - [0038]; figures 1-8 *;
 [A]FR2930839  (COMMISSARIAT ENERGIE ATOMIQUE [FR]) [A] 1-5,9,10,14,15 * page 1, lines 5-12 * * page 3, line 13 - page 4, line 13 * * page 5, lines 1-4 * * page 9, line 9 - page 13, line 3; figures 1A-G, 2 * * page 13, line 22 - page 16, line 6; figures 4A-C *;
 [A]US2010230711  (KUO CHESTER [TW], et al) [A] 1* paragraph [0048]; figures 6A-E *;
 [A]US2011297994  (SUGIZAKI YOSHIAKI [JP], et al) [A] 1,13-15 * paragraphs [0010] - [0016] - [0 22] - [0025] - [0 29] , [0 30] , [0 34] , [0 41] - [0064]; figures 1, 2A-9B *;
 [A]US2012222732  (CHOI JUN-HEE [KR]) [A] 1-4,9,10,14,15 * paragraphs [0003] , [0 50] - [0093]; figures 1-7I *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.