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Extract from the Register of European Patents

EP About this file: EP2819164

EP2819164 - Semiconductor device [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  08.07.2022
Database last updated on 14.09.2024
FormerThe patent has been granted
Status updated on  30.07.2021
FormerGrant of patent is intended
Status updated on  16.05.2021
FormerExamination is in progress
Status updated on  22.09.2017
Most recent event   Tooltip06.09.2024Lapse of the patent in a contracting state
New state(s): MT		published on 09.10.2024 [2024/41]
Applicant(s)For all designated states
Kabushiki Kaisha Toshiba
1-1, Shibaura 1-Chome Minato-Ku
Tokyo 105-8001 / JP
[2015/01]
Inventor(s)01 / Ikeda, Kentaro
c/o Intellectual Property Division
Toshiba Corporation
1-1, Shibaura 1-chome
Minato-ku, Tokyo 105-8001 / JP
 [2015/01]
Representative(s)Moreland, David, et al
Marks & Clerk LLP The Beacon
176 St Vincent Street
Glasgow G2 5SG / GB
[N/P]
Former [2021/35]Moreland, David, et al
Marks & Clerk LLP
Aurora
120 Bothwell Street
Glasgow G2 7JS / GB
Former [2015/01]Granleese, Rhian Jane
Marks & Clerk LLP
90 Long Acre
London WC2E 9RA / GB
Application number, filing date14158160.306.03.2014
[2015/01]
Priority number, dateJP2013013310725.06.2013         Original published format: JP 2013133107
[2015/01]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP2819164
Date:31.12.2014
Language:EN
[2015/01]
Type: A3 Search report 
No.:EP2819164
Date:06.05.2015
Language:EN
[2015/19]
Type: B1 Patent specification 
No.:EP2819164
Date:01.09.2021
Language:EN
[2021/35]
Search report(s)(Supplementary) European search report - dispatched on:EP10.04.2015
ClassificationIPC:H03K17/567, H03K17/10, H03K17/0416, H03K17/74, H01L25/18, // H01L27/088, H01L27/06, H03K17/687
[2021/22]
CPC:
H03K17/04163 (EP,US); H01L29/778 (KR); H01L25/072 (US);
H01L25/18 (EP,US); H01L29/78 (KR); H01L31/062 (KR);
H03K17/102 (EP,US); H03K17/567 (EP,US); H03K17/687 (KR);
H03K17/74 (EP,US); H01L2224/0603 (EP,US); H01L2224/48137 (EP,US);
H01L2224/48145 (EP,US); H01L2224/48247 (EP,US); H01L2224/48464 (EP,US);
H01L27/0629 (EP,US); H01L27/0883 (EP,US); H01L2924/12032 (EP,US);
H01L2924/13091 (EP,US); H03K2017/6875 (EP,US); H03K2217/0036 (EP,US);
Y02E10/50 (EP) (-)
C-Set:
H01L2224/48145, H01L2924/00012 (US,EP);
H01L2924/12032, H01L2924/00 (US,EP);
H01L2924/13091, H01L2924/00 (EP,US)
Former IPC [2015/19]H01L25/07, H03K17/567, H03K17/10, H03K17/0416, // H01L27/088, H01L27/06, H03K17/687
Former IPC [2015/01]H01L25/07, H03K17/567, // H01L27/088, H01L27/06
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2015/01]
TitleGerman:Halbleiterbauelement[2015/01]
English:Semiconductor device[2015/01]
French:Dispositif semi-conducteur[2015/01]
Examination procedure06.03.2014Examination requested  [2015/01]
29.10.2015Amendment by applicant (claims and/or description)
21.09.2017Despatch of a communication from the examining division (Time limit: M04)
31.01.2018Reply to a communication from the examining division
28.04.2021Cancellation of oral proceeding that was planned for 29.04.2021
29.04.2021Date of oral proceedings (cancelled)
17.05.2021Communication of intention to grant the patent
23.07.2021Fee for grant paid
23.07.2021Fee for publishing/printing paid
23.07.2021Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  21.09.2017
Opposition(s)02.06.2022No opposition filed within time limit [2022/32]
Fees paidRenewal fee
10.03.2016Renewal fee patent year 03
10.03.2017Renewal fee patent year 04
13.03.2018Renewal fee patent year 05
13.03.2019Renewal fee patent year 06
12.03.2020Renewal fee patent year 07
12.03.2021Renewal fee patent year 08
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU06.03.2014
AL01.09.2021
AT01.09.2021
CY01.09.2021
CZ01.09.2021
DK01.09.2021
EE01.09.2021
ES01.09.2021
FI01.09.2021
HR01.09.2021
IT01.09.2021
LT01.09.2021
LV01.09.2021
MC01.09.2021
MK01.09.2021
MT01.09.2021
NL01.09.2021
PL01.09.2021
RO01.09.2021
RS01.09.2021
SE01.09.2021
SI01.09.2021
SK01.09.2021
SM01.09.2021
BG01.12.2021
NO01.12.2021
GR02.12.2021
IS01.01.2022
PT03.01.2022
IE06.03.2022
LU06.03.2022
BE31.03.2022
CH31.03.2022
LI31.03.2022
[2024/41]
Former [2024/22]HU06.03.2014
AL01.09.2021
AT01.09.2021
CY01.09.2021
CZ01.09.2021
DK01.09.2021
EE01.09.2021
ES01.09.2021
FI01.09.2021
HR01.09.2021
IT01.09.2021
LT01.09.2021
LV01.09.2021
MC01.09.2021
MK01.09.2021
NL01.09.2021
PL01.09.2021
RO01.09.2021
RS01.09.2021
SE01.09.2021
SI01.09.2021
SK01.09.2021
SM01.09.2021
BG01.12.2021
NO01.12.2021
GR02.12.2021
IS01.01.2022
PT03.01.2022
IE06.03.2022
LU06.03.2022
BE31.03.2022
CH31.03.2022
LI31.03.2022
Former [2024/20]HU06.03.2014
AL01.09.2021
AT01.09.2021
CY01.09.2021
CZ01.09.2021
DK01.09.2021
EE01.09.2021
ES01.09.2021
FI01.09.2021
HR01.09.2021
IT01.09.2021
LT01.09.2021
LV01.09.2021
MC01.09.2021
NL01.09.2021
PL01.09.2021
RO01.09.2021
RS01.09.2021
SE01.09.2021
SI01.09.2021
SK01.09.2021
SM01.09.2021
BG01.12.2021
NO01.12.2021
GR02.12.2021
IS01.01.2022
PT03.01.2022
IE06.03.2022
LU06.03.2022
BE31.03.2022
CH31.03.2022
LI31.03.2022
Former [2024/18]HU06.03.2014
AL01.09.2021
AT01.09.2021
CZ01.09.2021
DK01.09.2021
EE01.09.2021
ES01.09.2021
FI01.09.2021
HR01.09.2021
IT01.09.2021
LT01.09.2021
LV01.09.2021
MC01.09.2021
NL01.09.2021
PL01.09.2021
RO01.09.2021
RS01.09.2021
SE01.09.2021
SI01.09.2021
SK01.09.2021
SM01.09.2021
BG01.12.2021
NO01.12.2021
GR02.12.2021
IS01.01.2022
PT03.01.2022
IE06.03.2022
LU06.03.2022
BE31.03.2022
CH31.03.2022
LI31.03.2022
Former [2023/10]AL01.09.2021
AT01.09.2021
CZ01.09.2021
DK01.09.2021
EE01.09.2021
ES01.09.2021
FI01.09.2021
HR01.09.2021
IT01.09.2021
LT01.09.2021
LV01.09.2021
MC01.09.2021
NL01.09.2021
PL01.09.2021
RO01.09.2021
RS01.09.2021
SE01.09.2021
SI01.09.2021
SK01.09.2021
SM01.09.2021
BG01.12.2021
NO01.12.2021
GR02.12.2021
IS01.01.2022
PT03.01.2022
IE06.03.2022
LU06.03.2022
BE31.03.2022
CH31.03.2022
LI31.03.2022
Former [2023/09]AL01.09.2021
AT01.09.2021
CZ01.09.2021
DK01.09.2021
EE01.09.2021
ES01.09.2021
FI01.09.2021
HR01.09.2021
IT01.09.2021
LT01.09.2021
LV01.09.2021
MC01.09.2021
NL01.09.2021
PL01.09.2021
RO01.09.2021
RS01.09.2021
SE01.09.2021
SI01.09.2021
SK01.09.2021
SM01.09.2021
BG01.12.2021
NO01.12.2021
GR02.12.2021
IS01.01.2022
PT03.01.2022
IE06.03.2022
LU06.03.2022
CH31.03.2022
LI31.03.2022
Former [2023/08]AL01.09.2021
AT01.09.2021
CZ01.09.2021
DK01.09.2021
EE01.09.2021
ES01.09.2021
FI01.09.2021
HR01.09.2021
IT01.09.2021
LT01.09.2021
LV01.09.2021
MC01.09.2021
NL01.09.2021
PL01.09.2021
RO01.09.2021
RS01.09.2021
SE01.09.2021
SI01.09.2021
SK01.09.2021
SM01.09.2021
BG01.12.2021
NO01.12.2021
GR02.12.2021
IS01.01.2022
PT03.01.2022
IE06.03.2022
LU06.03.2022
Former [2022/47]AL01.09.2021
AT01.09.2021
CZ01.09.2021
DK01.09.2021
EE01.09.2021
ES01.09.2021
FI01.09.2021
HR01.09.2021
IT01.09.2021
LT01.09.2021
LV01.09.2021
MC01.09.2021
NL01.09.2021
PL01.09.2021
RO01.09.2021
RS01.09.2021
SE01.09.2021
SI01.09.2021
SK01.09.2021
SM01.09.2021
BG01.12.2021
NO01.12.2021
GR02.12.2021
IS01.01.2022
PT03.01.2022
Former [2022/36]AL01.09.2021
AT01.09.2021
CZ01.09.2021
DK01.09.2021
EE01.09.2021
ES01.09.2021
FI01.09.2021
HR01.09.2021
IT01.09.2021
LT01.09.2021
LV01.09.2021
NL01.09.2021
PL01.09.2021
RO01.09.2021
RS01.09.2021
SE01.09.2021
SI01.09.2021
SK01.09.2021
SM01.09.2021
BG01.12.2021
NO01.12.2021
GR02.12.2021
IS01.01.2022
PT03.01.2022
Former [2022/29]AL01.09.2021
AT01.09.2021
CZ01.09.2021
EE01.09.2021
ES01.09.2021
FI01.09.2021
HR01.09.2021
LT01.09.2021
LV01.09.2021
NL01.09.2021
PL01.09.2021
RO01.09.2021
RS01.09.2021
SE01.09.2021
SK01.09.2021
SM01.09.2021
BG01.12.2021
NO01.12.2021
GR02.12.2021
IS01.01.2022
PT03.01.2022
Former [2022/25]AT01.09.2021
CZ01.09.2021
EE01.09.2021
ES01.09.2021
FI01.09.2021
HR01.09.2021
LT01.09.2021
LV01.09.2021
NL01.09.2021
PL01.09.2021
RO01.09.2021
RS01.09.2021
SE01.09.2021
SK01.09.2021
SM01.09.2021
BG01.12.2021
NO01.12.2021
GR02.12.2021
IS01.01.2022
PT03.01.2022
Former [2022/24]AT01.09.2021
CZ01.09.2021
EE01.09.2021
ES01.09.2021
FI01.09.2021
HR01.09.2021
LT01.09.2021
LV01.09.2021
NL01.09.2021
PL01.09.2021
RO01.09.2021
RS01.09.2021
SE01.09.2021
SK01.09.2021
BG01.12.2021
NO01.12.2021
GR02.12.2021
IS01.01.2022
PT03.01.2022
Former [2022/21]AT01.09.2021
ES01.09.2021
FI01.09.2021
HR01.09.2021
LT01.09.2021
LV01.09.2021
PL01.09.2021
RS01.09.2021
SE01.09.2021
BG01.12.2021
NO01.12.2021
GR02.12.2021
Former [2022/10]ES01.09.2021
FI01.09.2021
HR01.09.2021
LT01.09.2021
LV01.09.2021
PL01.09.2021
RS01.09.2021
SE01.09.2021
BG01.12.2021
NO01.12.2021
GR02.12.2021
Former [2022/09]ES01.09.2021
FI01.09.2021
LT01.09.2021
RS01.09.2021
SE01.09.2021
BG01.12.2021
NO01.12.2021
Former [2022/08]ES01.09.2021
FI01.09.2021
LT01.09.2021
SE01.09.2021
BG01.12.2021
NO01.12.2021
Former [2022/07]LT01.09.2021
NO01.12.2021
Documents cited:Search[XI]US4317110  (HSU SHENG T) [X] 1 * column 6, line 65 - column 7, line 10; figure 3A * [I] 10;
 [Y]GB2249226  (DASSAULT ELECTRONIQUE [FR]) [Y] 13 * figure 4 *;
 [Y]FR2678772  (DASSAULT ELECTRONIQUE [FR]) [Y] 13 * sentences 11-18; figure 1 *;
 [Y]WO03009455  (SIEMENS AG OESTERREICH [AT], et al) [Y] 16-20* page 2; figures 1,2 *;
 [Y]JP2006324839  (FUJI ELECTRIC HOLDINGS) [Y] 7,12,14,16-18,20 * paragraphs [0010] , [0011]; figures 1,3 *;
 [Y]US2007243668  (SANKIN IGOR [US], et al) [Y] 11 * paragraph [0167] *;
 [XY]US7348826  (KLEIN JONATHAN [US], et al) [X] 2-4,6 * column 2, line 13 - line 17; figure 1 * [Y] 5,15,17,18;
 [Y]US2009201072  (HONEA JAMES [US], et al) [Y] 14 * paragraph [0040]; figure 9 *;
 [XYI]US7719055  (MCNUTT TY R [US], et al) [X] 1-3,6 * column 1, line 34 - line 38; figure 1 * * column 3, line 65 - line 67; figure 2 * * column 5, line 64 - column 6, line 1; figure 8 * * column 6, line 27 - line 30 * [Y] 11 [I] 10;
 [Y]US2011169549  (WU YIFENG [US]) [Y] 15 * paragraphs [0043] , [0045]; figures 10,12 *;
 [XAY]US2012262220  (SPRINGETT NIGEL [DE]) [X] 2,3,6 * paragraphs [0034] , [0037] , [0038]; figures 1C,2A * [A] 10 [Y] 12,14,16-18,20;
 [A]US2012292635  (IKETANI NAOYASU [JP], et al) [A] 5,10,12 * paragraphs [0043] , [0051] , [0052] , [0062] , [0073] , [0103]; figures 3,6,15,16 *;
 [XAY]US2013020614  (LU BIN [US], et al) [X] 1,8 * paragraph [0019]; figures 1B, 2C, 2D, 3A-3C * [A] 10 [Y] 7,9,12-14,16,19,20;
 [Y]  - WON-KI PARK ET AL, "A Novel Level-Shifter Circuit Design For Display Panel Driver", CIRCUITS AND SYSTEMS, 2006. MWSCAS '06. 49TH IEEE INTERNATIONAL MIDWES T SYMPOSIUM ON, IEEE, PI, (200608), ISBN 978-1-4244-0172-7, pages 391 - 394, XP031113625 [Y] 5 * figures 5,6 *
 [Y]  - WATARU SAITO ET AL, "Switching controllability of high voltage GaN-HEMTs and the cascode connection", POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2012 24TH INTERNATIONAL SYMPOSIUM ON, IEEE, (20120603), doi:10.1109/ISPSD.2012.6229065, ISBN 978-1-4577-1594-5, pages 229 - 232, XP032452808 [Y] 9 * section II;; figure 1 *

DOI:   http://dx.doi.org/10.1109/ISPSD.2012.6229065
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.