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Extract from the Register of European Patents

EP About this file: EP2933824

EP2933824 - Substrate arrangement [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  24.06.2022
Database last updated on 25.09.2024
FormerThe patent has been granted
Status updated on  16.07.2021
FormerGrant of patent is intended
Status updated on  18.05.2021
FormerExamination is in progress
Status updated on  04.11.2016
Most recent event   Tooltip06.09.2024Lapse of the patent in a contracting state
New state(s): MT		published on 09.10.2024 [2024/41]
Applicant(s)For all designated states
NXP B.V.
High Tech Campus 60
5656 AG Eindhoven / NL
[2015/43]
Inventor(s)01 / Lander, Robert James Pascoe
Intellectual Property and Licensing
NXP Semiconductors
Red Central
60 High Street
Redhill, Surrey RH1 1SH / GB
 [2015/43]
Representative(s)Hardingham, Christopher Mark
NXP Semiconductors
Intellectual Property Group
Abbey House
25 Clarendon Road
Redhill, Surrey RH1 1QZ / GB
[2021/33]
Former [2015/43]Crawford, Andrew
NXP SEMICONDUCTORS UK LTD
Intellectual Property & Licensing
Red Central
60 High Street
Redhill, Surrey RH1 1SH / GB
Application number, filing date14164634.914.04.2014
[2015/43]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP2933824
Date:21.10.2015
Language:EN
[2015/43]
Type: B1 Patent specification 
No.:EP2933824
Date:18.08.2021
Language:EN
[2021/33]
Search report(s)(Supplementary) European search report - dispatched on:EP25.06.2014
ClassificationIPC:H01L21/02, H01L21/20, H01L21/762, H01L29/267, H01L29/20
[2021/23]
CPC:
H01L29/267 (EP,US); H01L21/02381 (EP,US); H01L21/02433 (EP,US);
H01L21/0245 (EP,US); H01L21/02488 (US); H01L21/02516 (EP,US);
H01L21/0254 (EP,US); H01L21/02609 (EP,US); H01L21/02658 (EP,US);
H01L21/76251 (EP); H01L29/2003 (EP,US); H01L21/7624 (EP,US) (-)
Former IPC [2015/43]H01L21/02, // H01L21/762
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2016/22]
Former [2015/43]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:Substratanordnung[2015/43]
English:Substrate arrangement[2015/43]
French:Arrangement d'un substrat[2015/43]
Examination procedure12.09.2014Amendment by applicant (claims and/or description)
21.04.2016Examination requested  [2016/22]
07.07.2016Despatch of a communication from the examining division (Time limit: M06)
09.12.2016Reply to a communication from the examining division
27.08.2019Despatch of a communication from the examining division (Time limit: M04)
18.11.2019Reply to a communication from the examining division
19.05.2021Communication of intention to grant the patent
12.07.2021Fee for grant paid
12.07.2021Fee for publishing/printing paid
12.07.2021Receipt of the translation of the claim(s)
Opposition(s)19.05.2022No opposition filed within time limit [2022/30]
Fees paidRenewal fee
02.05.2016Renewal fee patent year 03
02.05.2017Renewal fee patent year 04
30.04.2018Renewal fee patent year 05
30.04.2019Renewal fee patent year 06
30.04.2020Renewal fee patent year 07
30.04.2021Renewal fee patent year 08
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU14.04.2014
AL18.08.2021
AT18.08.2021
CY18.08.2021
CZ18.08.2021
DK18.08.2021
EE18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
IT18.08.2021
LT18.08.2021
LV18.08.2021
MC18.08.2021
MK18.08.2021
MT18.08.2021
NL18.08.2021
PL18.08.2021
RO18.08.2021
RS18.08.2021
SE18.08.2021
SI18.08.2021
SK18.08.2021
SM18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
IE14.04.2022
LU14.04.2022
BE30.04.2022
CH30.04.2022
LI30.04.2022
[2024/41]
Former [2024/22]HU14.04.2014
AL18.08.2021
AT18.08.2021
CY18.08.2021
CZ18.08.2021
DK18.08.2021
EE18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
IT18.08.2021
LT18.08.2021
LV18.08.2021
MC18.08.2021
MK18.08.2021
NL18.08.2021
PL18.08.2021
RO18.08.2021
RS18.08.2021
SE18.08.2021
SI18.08.2021
SK18.08.2021
SM18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
IE14.04.2022
LU14.04.2022
BE30.04.2022
CH30.04.2022
LI30.04.2022
Former [2024/20]HU14.04.2014
AL18.08.2021
AT18.08.2021
CY18.08.2021
CZ18.08.2021
DK18.08.2021
EE18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
IT18.08.2021
LT18.08.2021
LV18.08.2021
MC18.08.2021
NL18.08.2021
PL18.08.2021
RO18.08.2021
RS18.08.2021
SE18.08.2021
SI18.08.2021
SK18.08.2021
SM18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
IE14.04.2022
LU14.04.2022
BE30.04.2022
CH30.04.2022
LI30.04.2022
Former [2024/18]HU14.04.2014
AL18.08.2021
AT18.08.2021
CZ18.08.2021
DK18.08.2021
EE18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
IT18.08.2021
LT18.08.2021
LV18.08.2021
MC18.08.2021
NL18.08.2021
PL18.08.2021
RO18.08.2021
RS18.08.2021
SE18.08.2021
SI18.08.2021
SK18.08.2021
SM18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
IE14.04.2022
LU14.04.2022
BE30.04.2022
CH30.04.2022
LI30.04.2022
Former [2023/20]AL18.08.2021
AT18.08.2021
CZ18.08.2021
DK18.08.2021
EE18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
IT18.08.2021
LT18.08.2021
LV18.08.2021
MC18.08.2021
NL18.08.2021
PL18.08.2021
RO18.08.2021
RS18.08.2021
SE18.08.2021
SI18.08.2021
SK18.08.2021
SM18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
IE14.04.2022
LU14.04.2022
BE30.04.2022
CH30.04.2022
LI30.04.2022
Former [2023/10]AL18.08.2021
AT18.08.2021
CZ18.08.2021
DK18.08.2021
EE18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
IT18.08.2021
LT18.08.2021
LV18.08.2021
MC18.08.2021
NL18.08.2021
PL18.08.2021
RO18.08.2021
RS18.08.2021
SE18.08.2021
SI18.08.2021
SK18.08.2021
SM18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
LU14.04.2022
BE30.04.2022
CH30.04.2022
LI30.04.2022
Former [2023/09]AL18.08.2021
AT18.08.2021
CZ18.08.2021
DK18.08.2021
EE18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
IT18.08.2021
LT18.08.2021
LV18.08.2021
MC18.08.2021
NL18.08.2021
PL18.08.2021
RO18.08.2021
RS18.08.2021
SE18.08.2021
SI18.08.2021
SK18.08.2021
SM18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
LU14.04.2022
CH30.04.2022
LI30.04.2022
Former [2023/08]AL18.08.2021
AT18.08.2021
CZ18.08.2021
DK18.08.2021
EE18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
IT18.08.2021
LT18.08.2021
LV18.08.2021
MC18.08.2021
NL18.08.2021
PL18.08.2021
RO18.08.2021
RS18.08.2021
SE18.08.2021
SI18.08.2021
SK18.08.2021
SM18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
LU14.04.2022
Former [2023/06]AL18.08.2021
AT18.08.2021
CZ18.08.2021
DK18.08.2021
EE18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
IT18.08.2021
LT18.08.2021
LV18.08.2021
MC18.08.2021
NL18.08.2021
PL18.08.2021
RO18.08.2021
RS18.08.2021
SE18.08.2021
SI18.08.2021
SK18.08.2021
SM18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
Former [2022/36]AL18.08.2021
AT18.08.2021
CZ18.08.2021
DK18.08.2021
EE18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
IT18.08.2021
LT18.08.2021
LV18.08.2021
NL18.08.2021
PL18.08.2021
RO18.08.2021
RS18.08.2021
SE18.08.2021
SI18.08.2021
SK18.08.2021
SM18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
Former [2022/29]AL18.08.2021
AT18.08.2021
CZ18.08.2021
DK18.08.2021
EE18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
LT18.08.2021
LV18.08.2021
NL18.08.2021
PL18.08.2021
RO18.08.2021
RS18.08.2021
SE18.08.2021
SK18.08.2021
SM18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
Former [2022/26]AT18.08.2021
CZ18.08.2021
DK18.08.2021
EE18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
LT18.08.2021
LV18.08.2021
NL18.08.2021
PL18.08.2021
RO18.08.2021
RS18.08.2021
SE18.08.2021
SK18.08.2021
SM18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
Former [2022/24]AT18.08.2021
CZ18.08.2021
DK18.08.2021
EE18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
LT18.08.2021
LV18.08.2021
NL18.08.2021
PL18.08.2021
RO18.08.2021
RS18.08.2021
SE18.08.2021
SK18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
Former [2022/21]AT18.08.2021
DK18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
LT18.08.2021
LV18.08.2021
NL18.08.2021
PL18.08.2021
RS18.08.2021
SE18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
Former [2022/16]AT18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
LT18.08.2021
LV18.08.2021
NL18.08.2021
PL18.08.2021
RS18.08.2021
SE18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
Former [2022/10]AT18.08.2021
ES18.08.2021
FI18.08.2021
HR18.08.2021
LT18.08.2021
LV18.08.2021
PL18.08.2021
RS18.08.2021
SE18.08.2021
BG18.11.2021
NO18.11.2021
GR19.11.2021
IS18.12.2021
PT20.12.2021
Former [2022/09]AT18.08.2021
ES18.08.2021
FI18.08.2021
LT18.08.2021
RS18.08.2021
SE18.08.2021
BG18.11.2021
NO18.11.2021
PT20.12.2021
Former [2022/08]AT18.08.2021
ES18.08.2021
FI18.08.2021
LT18.08.2021
SE18.08.2021
BG18.11.2021
NO18.11.2021
Former [2022/07]AT18.08.2021
LT18.08.2021
NO18.11.2021
Documents cited:Search[XI]US2009173967  (HAMAGUCHI MASAFUMI [US], et al) [X] 1-7,11,14,15 * paragraph [0013] * * paragraph [0032] - paragraph [0034] * * paragraph [0043] * * figure 2 * [I] 9,10,13;
 [XI]US2007004222  (WEI QINGQIAO [US]) [X] 1-7,11,14 * paragraph [0031] - paragraph [0038] * [I] 9,10,13,15;
 [XI]US2010327395  (HAMAGUCHI MASAFUMI [US], et al) [X] 1-7,11,13-15 * paragraph [0018] - paragraph [0019] * * figure 1 * [I] 9,10;
 [XI]US2004217352  (FORBES LEONARD [US]) [X] 1-7,11,14 * paragraph [0027] * * paragraph [0036] - paragraph [0041] * * figures 4, 5 * [I] 9,10,13,15
 [XI]  - FUJIKAWA Y ET AL, "Silicon on insulator for symmetry-converted growth", APPLIED PHYSICS LETTERS, AMERICAN INSTITUTE OF PHYSICS, US, (20070612), vol. 90, no. 24, doi:10.1063/1.2748099, ISSN 0003-6951, pages 243107 - 243107, XP012095299 [X] 1-8,11,12,14 * the whole document * [I] 9,10,13,15

DOI:   http://dx.doi.org/10.1063/1.2748099
 [XI]  - MIN YANG ET AL, "Hybrid-orientation technology (HOT): opportunities and challenges", IEEE TRANSACTIONS ON ELECTRON DEVICES, IEEE SERVICE CENTER, PISACATAWAY, NJ, US, (200605), vol. 53, no. 5, doi:10.1109/TED.2006.872693, ISSN 0018-9383, pages 965 - 978, XP009095610 [X] 1-8,11,14,15 * pages 967-968, chapter 'V. HOT substrate preparation' * * pages 968-969, chapter 'VI. HOT CMOS device fabrication' * * figure 6 * [I] 9,10,12,13

DOI:   http://dx.doi.org/10.1109/TED.2006.872693
 [XI]  - BUTTARD D ET AL, "Grazing incidence X-ray studies of twist-bonded Si/Si and Si/SiO2 interfaces", PHYSICA B. CONDENSED MATTER, AMSTERDAM, NL, (200006), vol. 283, no. 1-3, doi:10.1016/S0921-4526(99)01900-6, ISSN 0921-4526, pages 103 - 107, XP009074050 [X] 1-7,11,14 * pages 104-106, chapter '2.1 Hydrophobic bonding Si/Si' * [I] 9,10,13,15

DOI:   http://dx.doi.org/10.1016/S0921-4526(99)01900-6
ExaminationDE102008009411
    - BOURRET A ED - YU JIAGUO ET AL, "Compliant substrates: a review on the concept, techniques and mechanisms", APPLIED SURFACE SCI, ELSEVIER, AMSTERDAM, NL, (20000901), vol. 164, doi:10.1016/S0169-4332(00)00326-3, ISSN 0169-4332, pages 3 - 14, XP009074047

DOI:   http://dx.doi.org/10.1016/S0169-4332(00)00326-3
    - MUHAMMAD JAMIL, "Development of large area dislocation defect reduced III-nitride layers on silicon (111) substrate", (20060101), pages 1 - 175, DISSERTATION, STATE UNIVERSITY OF NEW YORK AT ALBANY, US, URL: https://search.proquest.com/docview/304950417?pq-origsite=gscholar, (201908), XP009515256
    - TINGKAI LI ET AL, Chapter 2: Challenge of III-V Materials Integration with Si Microtelectronics, CRC press, (20110101), pages 51 - 96, XP009189029
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.