Deutsch English Français

Contact

EP2976784

European procedure

Quick help

Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability

2022.02.11

More...

News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...

Extract from the Register of European Patents

EP About this file: EP2976784

EP2976784 - FLIP-CHIP ASSEMBLY PROCESS COMPRISING PRE-COATING INTERCONNECT ELEMENTS [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 06.10.2023 Database last updated on 29.10.2024
Former	Grant of patent is intended Status updated on 18.01.2023
Former	Examination is in progress Status updated on 11.06.2019
Most recent event Tooltip	06.10.2023	Application deemed to be withdrawn	published on 08.11.2023 [2023/45]
Applicant(s)	For all designated states Commissariat à l'Énergie Atomique et aux Énergies Alternatives 25, Rue Leblanc Bâtiment "Le Ponant D" 75015 Paris / FR
	[N/P]
Former [2016/04]	For all designated states Commissariat à l'Énergie Atomique et aux Énergies Alternatives 25 Rue Leblanc Bâtiment "Le Ponant D" 75015 Paris / FR
Inventor(s)	01 / MARION, François 4480 Route de Clémencière 38950 Saint Martin Le Vinoux / FR
	02 / BEDOIN, Alexis Le Berland 42230 Saint Victor Sur Loire / FR
	03 / BERGER, Frédéric 4 Rue R. Guilland 38160 Saint Marcellin / FR
	04 / GUEUGNOT, Alain 27 G Chemin du Vinay La Résidence 38360 Sassenage / FR
	[N/P]
Former [2016/04]	01 / MARION, François 4480 Route de Clémencière F-38950 Saint Martin Le Vinoux / FR
	02 / BEDOIN, Alexis Le Berland F-42230 Saint Victor Sur Loire / FR
	03 / BERGER, Frédéric 4 Rue R. Guilland F-38160 Saint Marcellin / FR
	04 / GUEUGNOT, Alain 27 G Chemin du Vinay La Résidence F-38360 Sassenage / FR
Representative(s)	Cabinet Laurent & Charras Le Contemporain 50 Chemin de la Bruyère 69574 Dardilly Cedex / FR
	[2016/04]
Application number, filing date	14718658.9	21.03.2014
	[2016/04]
	WO2014FR50665
Priority number, date	FR20130052557	22.03.2013 Original published format: FR 1352557
	[2016/04]
Filing language	FR
Procedural language	FR
Publication	Type:	A1 Application with search report
	No.:	WO2014147355
	Date:	25.09.2014
	Language:	FR
	[2014/39]
	Type:	A1 Application with search report
	No.:	EP2976784
	Date:	27.01.2016
	Language:	FR
	The application published by WIPO in one of the EPO official languages on 25.09.2014 takes the place of the publication of the European patent application.
	[2016/04]
Search report(s)	International search report - published on:	EP	25.09.2014
Classification	IPC:	H01L23/485, H01L21/60, // H01L21/56, H01L27/146	[2023/04]
	CPC:	H01L24/13 (EP,US); H01L25/50 (US); H01L24/16 (EP,US); H01L24/27 (EP,US); H01L24/29 (EP,US); H01L24/81 (EP,US); (+) H01L24/83 (EP,US); H01L24/92 (EP,US); H01L27/1465 (EP,US); H01L21/561 (EP,US); H01L2224/13011 (EP,US); H01L2224/13015 (EP,US); H01L2224/13109 (EP,US); H01L2224/13111 (EP,US); H01L2224/13116 (EP,US); H01L2224/13118 (EP,US); H01L2224/13124 (EP,US); H01L2224/13139 (EP,US); H01L2224/13147 (EP,US); H01L2224/13155 (EP,US); H01L2224/13166 (EP,US); H01L2224/13169 (EP,US); H01L2224/1318 (EP,US); H01L2224/13184 (EP,US); H01L2224/13186 (EP,US); H01L2224/13562 (EP,US); H01L2224/1357 (EP,US); H01L2224/13609 (EP,US); H01L2224/13611 (EP,US); H01L2224/13616 (EP,US); H01L2224/13618 (EP,US); H01L2224/13624 (EP,US); H01L2224/13639 (EP,US); H01L2224/13644 (EP,US); H01L2224/13647 (EP,US); H01L2224/13669 (EP,US); H01L2224/16052 (EP,US); H01L2224/16148 (EP,US); H01L2224/16238 (EP,US); H01L2224/2741 (EP,US); H01L2224/27618 (EP,US); H01L2224/2919 (EP,US); H01L2224/73104 (EP,US); H01L2224/73204 (EP,US); H01L2224/81099 (EP,US); H01L2224/81193 (EP,US); H01L2224/81194 (EP,US); H01L2224/81355 (EP); H01L2224/83191 (EP,US); H01L2224/83859 (EP,US); H01L2224/83862 (EP,US); H01L2224/83868 (EP,US); H01L2224/83871 (EP,US); H01L2224/83874 (EP,US); H01L2224/83986 (EP,US); H01L2224/9211 (EP,US); H01L2224/92125 (EP,US); H01L2224/94 (EP,US); H01L2224/97 (EP,US); H01L24/32 (EP,US) (-)
	C-Set:	H01L2224/13109, H01L2924/00014 (EP,US); H01L2224/13111, H01L2924/00014 (EP,US); H01L2224/13116, H01L2924/00014 (EP,US); H01L2224/13118, H01L2924/00014 (US,EP); (+) H01L2224/13124, H01L2924/00014 (US,EP); H01L2224/13139, H01L2924/00014 (EP,US); H01L2224/13147, H01L2924/00014 (US,EP); H01L2224/13155, H01L2924/00014 (US,EP); H01L2224/13166, H01L2924/01074 (US,EP); H01L2224/13169, H01L2924/00014 (US,EP); H01L2224/13184, H01L2924/00014 (US,EP); H01L2224/13184, H01L2924/01014, H01L2924/00014 (US,EP); H01L2224/13186, H01L2924/04941 (US,EP); H01L2224/1318, H01L2924/00014 (US,EP); H01L2224/13609, H01L2924/00014 (US,EP); H01L2224/13611, H01L2924/00014 (US,EP); H01L2224/13616, H01L2924/00014 (US,EP); H01L2224/13618, H01L2924/00014 (EP,US); H01L2224/13624, H01L2924/00014 (US,EP); H01L2224/13639, H01L2924/00014 (US,EP); H01L2224/13644, H01L2924/00014 (US,EP); H01L2224/13647, H01L2924/00014 (US,EP); H01L2224/13669, H01L2924/00014 (EP,US); H01L2224/2741, H01L2924/00014 (US,EP); H01L2224/2919, H01L2924/0665 (US,EP); H01L2224/83862, H01L2924/00014 (US,EP); H01L2224/83868, H01L2924/00014 (EP,US); H01L2224/83871, H01L2924/00014 (US,EP); H01L2224/83874, H01L2924/00014 (US,EP); H01L2224/83986, H01L2224/274, H01L2224/83, H01L2224/276 (EP,US); H01L2224/9211, H01L2224/81, H01L2224/83 (EP,US); H01L2224/94, H01L2224/27 (EP,US); H01L2224/94, H01L2224/81 (US,EP); H01L2224/97, H01L2224/81 (EP,US) (-)
	Former IPC [2016/04]	H01L23/00, H01L31/02, H01L21/56
Designated contracting states	AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2016/04]
Title	German:	FLIP-CHIP-MONTAGEVERFAHREN MIT VORBESCHICHTETEN VERBINDUNGSELEMENTEN	[2016/04]
	English:	FLIP-CHIP ASSEMBLY PROCESS COMPRISING PRE-COATING INTERCONNECT ELEMENTS	[2016/04]
	French:	PROCEDE D'ASSEMBLAGE FLIP CHIP COMPORTANT LE PRE-ENROBAGE D'ELEMENTS D'INTERCONNEXION	[2016/04]
Entry into regional phase	30.07.2015	National basic fee paid
	30.07.2015	Designation fee(s) paid
	30.07.2015	Examination fee paid
Examination procedure	30.07.2015	Examination requested [2016/04]
	07.04.2016	Amendment by applicant (claims and/or description)
	14.06.2019	Despatch of a communication from the examining division (Time limit: M04)
	09.10.2019	Reply to a communication from the examining division
	19.01.2023	Communication of intention to grant the patent
	31.05.2023	Application deemed to be withdrawn, date of legal effect [2023/45]
	21.06.2023	Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time [2023/45]
Divisional application(s)	The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 14.06.2019
Fees paid	Renewal fee
	26.02.2016	Renewal fee patent year 03
	28.02.2017	Renewal fee patent year 04
	27.02.2018	Renewal fee patent year 05
	26.02.2019	Renewal fee patent year 06
	27.02.2020	Renewal fee patent year 07
	23.02.2021	Renewal fee patent year 08
	23.03.2022	Renewal fee patent year 09
	Penalty fee
	Additional fee for renewal fee
	31.03.2023	10 M06 Not yet paid
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited in	International search	[A]US2002016022 (SHINTANI SUSUMU [JP]) [A] 1-5 * paragraph [0001] - paragraph [0011] * * paragraph [0043] - paragraph [0053]; figure 1 * * paragraph [0067] - paragraph [0068]; figure 2b * * paragraph [0096] - paragraph [0097]; figures 5a,5b * * paragraph [0117] *;
		[A]US2003109077 (KIM TAE HOON [KR], et al) [A] 1,6 * paragraphs [0030] - [0035]; figures 2a-2e *;
		[I]JP2003249524 (SEIKO EPSON CORP) [I] 1-5 * the whole document *;
		[A]US2006281309 (TREZZA JOHN [US]) [A] 1-5 * paragraphs [0343] - [0356]; figures 120-122 * * paragraph [0397]; figures 140-141 * * paragraph [0399] - paragraph [0405]; figures 123O,P,Y * * paragraph [0409]; figures 146A,B *;
		[A]EP2287904 (COMMISSARIAT ENERGIE ATOMIQUE [FR]) [A] 1-5 * the whole document *;
		[A]US2012178218 (BAUER MICHAEL [DE], et al) [A] 1,6 * paragraphs [0001] - [0009] ** paragraphs [0053] - [0069]; figures 1-5 *
	Examination	JP2003249524
	by applicant	US6197560
		EP1621566
		JP2012077214
		- C.P. WONG ET AL., "Characterization of a No-Flow Underfill Encapsulant During the Solder Reflow Process", PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOY CONFERENCE, (1998), pages 1253 - 1259, XP000803705

The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.

Legal notice
Terms of use
24.2.25; 35p