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Extract from the Register of European Patents

EP About this file: EP2976784

EP2976784 - FLIP-CHIP ASSEMBLY PROCESS COMPRISING PRE-COATING INTERCONNECT ELEMENTS [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  06.10.2023
Database last updated on 29.10.2024
FormerGrant of patent is intended
Status updated on  18.01.2023
FormerExamination is in progress
Status updated on  11.06.2019
Most recent event   Tooltip06.10.2023Application deemed to be withdrawnpublished on 08.11.2023  [2023/45]
Applicant(s)For all designated states
Commissariat à l'Énergie Atomique et aux Énergies Alternatives
25, Rue Leblanc
Bâtiment "Le Ponant D"
75015 Paris / FR
[N/P]
Former [2016/04]For all designated states
Commissariat à l'Énergie Atomique et aux Énergies Alternatives
25 Rue Leblanc
Bâtiment "Le Ponant D"
75015 Paris / FR
Inventor(s)01 / MARION, François
4480 Route de Clémencière
38950 Saint Martin Le Vinoux / FR
02 / BEDOIN, Alexis
Le Berland
42230 Saint Victor Sur Loire / FR
03 / BERGER, Frédéric
4 Rue R. Guilland
38160 Saint Marcellin / FR
04 / GUEUGNOT, Alain
27 G Chemin du Vinay
La Résidence
38360 Sassenage / FR
[N/P]
Former [2016/04]01 / MARION, François
4480 Route de Clémencière
F-38950 Saint Martin Le Vinoux / FR
02 / BEDOIN, Alexis
Le Berland
F-42230 Saint Victor Sur Loire / FR
03 / BERGER, Frédéric
4 Rue R. Guilland
F-38160 Saint Marcellin / FR
04 / GUEUGNOT, Alain
27 G Chemin du Vinay
La Résidence
F-38360 Sassenage / FR
Representative(s)Cabinet Laurent & Charras
Le Contemporain
50 Chemin de la Bruyère
69574 Dardilly Cedex / FR
[2016/04]
Application number, filing date14718658.921.03.2014
[2016/04]
WO2014FR50665
Priority number, dateFR2013005255722.03.2013         Original published format: FR 1352557
[2016/04]
Filing languageFR
Procedural languageFR
PublicationType: A1 Application with search report
No.:WO2014147355
Date:25.09.2014
Language:FR
[2014/39]
Type: A1 Application with search report 
No.:EP2976784
Date:27.01.2016
Language:FR
The application published by WIPO in one of the EPO official languages on 25.09.2014 takes the place of the publication of the European patent application.
[2016/04]
Search report(s)International search report - published on:EP25.09.2014
ClassificationIPC:H01L23/485, H01L21/60, // H01L21/56, H01L27/146
[2023/04]
CPC:
H01L24/13 (EP,US); H01L25/50 (US); H01L24/16 (EP,US);
H01L24/27 (EP,US); H01L24/29 (EP,US); H01L24/81 (EP,US);
H01L24/83 (EP,US); H01L24/92 (EP,US); H01L27/1465 (EP,US);
H01L21/561 (EP,US); H01L2224/13011 (EP,US); H01L2224/13015 (EP,US);
H01L2224/13109 (EP,US); H01L2224/13111 (EP,US); H01L2224/13116 (EP,US);
H01L2224/13118 (EP,US); H01L2224/13124 (EP,US); H01L2224/13139 (EP,US);
H01L2224/13147 (EP,US); H01L2224/13155 (EP,US); H01L2224/13166 (EP,US);
H01L2224/13169 (EP,US); H01L2224/1318 (EP,US); H01L2224/13184 (EP,US);
H01L2224/13186 (EP,US); H01L2224/13562 (EP,US); H01L2224/1357 (EP,US);
H01L2224/13609 (EP,US); H01L2224/13611 (EP,US); H01L2224/13616 (EP,US);
H01L2224/13618 (EP,US); H01L2224/13624 (EP,US); H01L2224/13639 (EP,US);
H01L2224/13644 (EP,US); H01L2224/13647 (EP,US); H01L2224/13669 (EP,US);
H01L2224/16052 (EP,US); H01L2224/16148 (EP,US); H01L2224/16238 (EP,US);
H01L2224/2741 (EP,US); H01L2224/27618 (EP,US); H01L2224/2919 (EP,US);
H01L2224/73104 (EP,US); H01L2224/73204 (EP,US); H01L2224/81099 (EP,US);
H01L2224/81193 (EP,US); H01L2224/81194 (EP,US); H01L2224/81355 (EP);
H01L2224/83191 (EP,US); H01L2224/83859 (EP,US); H01L2224/83862 (EP,US);
H01L2224/83868 (EP,US); H01L2224/83871 (EP,US); H01L2224/83874 (EP,US);
H01L2224/83986 (EP,US); H01L2224/9211 (EP,US); H01L2224/92125 (EP,US);
H01L2224/94 (EP,US); H01L2224/97 (EP,US); H01L24/32 (EP,US) (-)
C-Set:
H01L2224/13109, H01L2924/00014 (EP,US);
H01L2224/13111, H01L2924/00014 (EP,US);
H01L2224/13116, H01L2924/00014 (EP,US);
H01L2224/13118, H01L2924/00014 (US,EP);
H01L2224/13124, H01L2924/00014 (US,EP);
H01L2224/13139, H01L2924/00014 (EP,US);
H01L2224/13147, H01L2924/00014 (US,EP);
H01L2224/13155, H01L2924/00014 (US,EP);
H01L2224/13166, H01L2924/01074 (US,EP);
H01L2224/13169, H01L2924/00014 (US,EP);
H01L2224/13184, H01L2924/00014 (US,EP);
H01L2224/13184, H01L2924/01014, H01L2924/00014 (US,EP);
H01L2224/13186, H01L2924/04941 (US,EP);
H01L2224/1318, H01L2924/00014 (US,EP);
H01L2224/13609, H01L2924/00014 (US,EP);
H01L2224/13611, H01L2924/00014 (US,EP);
H01L2224/13616, H01L2924/00014 (US,EP);
H01L2224/13618, H01L2924/00014 (EP,US);
H01L2224/13624, H01L2924/00014 (US,EP);
H01L2224/13639, H01L2924/00014 (US,EP);
H01L2224/13644, H01L2924/00014 (US,EP);
H01L2224/13647, H01L2924/00014 (US,EP);
H01L2224/13669, H01L2924/00014 (EP,US);
H01L2224/2741, H01L2924/00014 (US,EP);
H01L2224/2919, H01L2924/0665 (US,EP);
H01L2224/83862, H01L2924/00014 (US,EP);
H01L2224/83868, H01L2924/00014 (EP,US);
H01L2224/83871, H01L2924/00014 (US,EP);
H01L2224/83874, H01L2924/00014 (US,EP);
H01L2224/83986, H01L2224/274, H01L2224/83, H01L2224/276 (EP,US);
H01L2224/9211, H01L2224/81, H01L2224/83 (EP,US);
H01L2224/94, H01L2224/27 (EP,US);
H01L2224/94, H01L2224/81 (US,EP);
H01L2224/97, H01L2224/81 (EP,US)
(-)
Former IPC [2016/04]H01L23/00, H01L31/02, H01L21/56
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2016/04]
TitleGerman:FLIP-CHIP-MONTAGEVERFAHREN MIT VORBESCHICHTETEN VERBINDUNGSELEMENTEN[2016/04]
English:FLIP-CHIP ASSEMBLY PROCESS COMPRISING PRE-COATING INTERCONNECT ELEMENTS[2016/04]
French:PROCEDE D'ASSEMBLAGE FLIP CHIP COMPORTANT LE PRE-ENROBAGE D'ELEMENTS D'INTERCONNEXION[2016/04]
Entry into regional phase30.07.2015National basic fee paid 
30.07.2015Designation fee(s) paid 
30.07.2015Examination fee paid 
Examination procedure30.07.2015Examination requested  [2016/04]
07.04.2016Amendment by applicant (claims and/or description)
14.06.2019Despatch of a communication from the examining division (Time limit: M04)
09.10.2019Reply to a communication from the examining division
19.01.2023Communication of intention to grant the patent
31.05.2023Application deemed to be withdrawn, date of legal effect  [2023/45]
21.06.2023Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time  [2023/45]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  14.06.2019
Fees paidRenewal fee
26.02.2016Renewal fee patent year 03
28.02.2017Renewal fee patent year 04
27.02.2018Renewal fee patent year 05
26.02.2019Renewal fee patent year 06
27.02.2020Renewal fee patent year 07
23.02.2021Renewal fee patent year 08
23.03.2022Renewal fee patent year 09
Penalty fee
Additional fee for renewal fee
31.03.202310   M06   Not yet paid
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Cited inInternational search[A]US2002016022  (SHINTANI SUSUMU [JP]) [A] 1-5 * paragraph [0001] - paragraph [0011] * * paragraph [0043] - paragraph [0053]; figure 1 * * paragraph [0067] - paragraph [0068]; figure 2b * * paragraph [0096] - paragraph [0097]; figures 5a,5b * * paragraph [0117] *;
 [A]US2003109077  (KIM TAE HOON [KR], et al) [A] 1,6 * paragraphs [0030] - [0035]; figures 2a-2e *;
 [I]JP2003249524  (SEIKO EPSON CORP) [I] 1-5 * the whole document *;
 [A]US2006281309  (TREZZA JOHN [US]) [A] 1-5 * paragraphs [0343] - [0356]; figures 120-122 * * paragraph [0397]; figures 140-141 * * paragraph [0399] - paragraph [0405]; figures 123O,P,Y * * paragraph [0409]; figures 146A,B *;
 [A]EP2287904  (COMMISSARIAT ENERGIE ATOMIQUE [FR]) [A] 1-5 * the whole document *;
 [A]US2012178218  (BAUER MICHAEL [DE], et al) [A] 1,6 * paragraphs [0001] - [0009] ** paragraphs [0053] - [0069]; figures 1-5 *
ExaminationJP2003249524
by applicantUS6197560
 EP1621566
 JP2012077214
    - C.P. WONG ET AL., "Characterization of a No-Flow Underfill Encapsulant During the Solder Reflow Process", PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOY CONFERENCE, (1998), pages 1253 - 1259, XP000803705
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.