EP3020066 - DEVICE FOR REMOVING A RING-SHAPED REINFORCEMENT EDGE FROM A GROUND SEMICONDUCTOR WAFER [Right-click to bookmark this link] | |||
Former [2016/20] | APPARATUS FOR REMOVING A RING-SHAPED REINFORCEMENT EDGE FROM A GROUND SEMICONDUCTOR WAFER | ||
[2021/04] | Status | No opposition filed within time limit Status updated on 11.11.2022 Database last updated on 03.09.2024 | |
Former | The patent has been granted Status updated on 03.12.2021 | ||
Former | Grant of patent is intended Status updated on 10.07.2021 | ||
Former | Request for examination was made Status updated on 02.06.2021 | ||
Former | Grant of patent is intended Status updated on 21.01.2021 | Most recent event Tooltip | 27.04.2024 | Lapse of the patent in a contracting state New state(s): MK | published on 29.05.2024 [2024/22] | Applicant(s) | For all designated states mechatronic Systemtechnik GmbH Tiroler Straße 80 9500 Villach / AT | [2021/29] |
Former [2016/20] | For all designated states Mechatronic Systemtechnik GmbH Tiroler Strasse 80 9500 Villach / AT | Inventor(s) | 01 /
SCHOBER, Walter Sonnenweg 8 A-9232 St. Martin/Rosegg / AT | [2016/20] | Representative(s) | Jell, Friedrich Bismarckstrasse 9 4020 Linz / AT | [2016/20] | Application number, filing date | 14744291.7 | 10.07.2014 | [2016/20] | WO2014EP64877 | Priority number, date | EP20130175880 | 10.07.2013 Original published format: EP 13175880 | [2016/20] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | WO2015004262 | Date: | 15.01.2015 | Language: | DE | [2015/02] | Type: | A1 Application with search report | No.: | EP3020066 | Date: | 18.05.2016 | Language: | DE | The application published by WIPO in one of the EPO official languages on 15.01.2015 takes the place of the publication of the European patent application. | [2016/20] | Type: | B1 Patent specification | No.: | EP3020066 | Date: | 05.01.2022 | Language: | DE | [2022/01] | Search report(s) | International search report - published on: | EP | 15.01.2015 | Classification | IPC: | H01L21/67 | [2016/20] | CPC: |
H01L21/67132 (EP,US);
H01L21/67092 (EP,US);
H01L21/67115 (US);
H01L21/6836 (US);
B32B38/10 (US);
B32B43/006 (US);
H01L2221/68381 (US);
Y10T156/1132 (EP,US);
Y10T156/1158 (EP,US);
Y10T156/1184 (EP,US);
Y10T156/1917 (EP,US);
Y10T156/1944 (EP,US);
Y10T156/1967 (EP,US)
(-)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2016/20] | Extension states | BA | Not yet paid | ME | Not yet paid | Title | German: | VORRICHTUNG ZUM ENTFERNEN EINES RINGFÖRMIGEN VERSTÄRKUNGSRANDS VON EINEM GESCHLIFFENEN HALBLEITERWAFER | [2016/20] | English: | DEVICE FOR REMOVING A RING-SHAPED REINFORCEMENT EDGE FROM A GROUND SEMICONDUCTOR WAFER | [2021/04] | French: | DISPOSITIF D'ÉLIMINATION D'UNE COLLERETTE ANNULAIRE SUR UNE TRANCHE SEMI-CONDUCTRICE RECTIFIÉE | [2021/04] |
Former [2016/20] | APPARATUS FOR REMOVING A RING-SHAPED REINFORCEMENT EDGE FROM A GROUND SEMICONDUCTOR WAFER | ||
Former [2016/20] | DISPOSITIF PERMETTANT D'ÉLIMINER UN BORD DE RENFORT ANNULAIRE D'UNE TRANCHE À SEMI-CONDUCTEUR RECTIFIÉE | Entry into regional phase | 10.02.2016 | National basic fee paid | 10.02.2016 | Designation fee(s) paid | 10.02.2016 | Examination fee paid | Examination procedure | 10.02.2016 | Examination requested [2016/20] | 10.10.2016 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the Extended European Search Report/Written Opinion of the International Searching Authority/International Preliminary Examination Report/Supplementary international search report not received in time | 16.12.2016 | Amendment by applicant (claims and/or description) | 22.01.2021 | Communication of intention to grant the patent | 01.06.2021 | Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO | 01.06.2021 | Fee for grant paid | 01.06.2021 | Fee for publishing/printing paid | 19.07.2021 | Communication of intention to grant the patent | 26.11.2021 | Receipt of the translation of the claim(s) | Opposition(s) | 06.10.2022 | No opposition filed within time limit [2022/50] | Request for further processing for: | 16.12.2016 | Request for further processing filed | 16.12.2016 | Full payment received (date of receipt of payment) Request granted | 04.01.2017 | Decision despatched | 16.12.2016 | Request for further processing filed | 16.12.2016 | Full payment received (date of receipt of payment) Request granted | 04.01.2017 | Decision despatched | Fees paid | Renewal fee | 01.08.2016 | Renewal fee patent year 03 | 31.07.2017 | Renewal fee patent year 04 | 31.07.2018 | Renewal fee patent year 05 | 31.07.2019 | Renewal fee patent year 06 | 31.07.2020 | Renewal fee patent year 07 | 02.08.2021 | Renewal fee patent year 08 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 10.07.2014 | AL | 05.01.2022 | CY | 05.01.2022 | CZ | 05.01.2022 | DK | 05.01.2022 | EE | 05.01.2022 | ES | 05.01.2022 | FI | 05.01.2022 | HR | 05.01.2022 | LT | 05.01.2022 | LV | 05.01.2022 | MC | 05.01.2022 | MK | 05.01.2022 | NL | 05.01.2022 | PL | 05.01.2022 | RO | 05.01.2022 | RS | 05.01.2022 | SE | 05.01.2022 | SI | 05.01.2022 | SK | 05.01.2022 | SM | 05.01.2022 | BG | 05.04.2022 | NO | 05.04.2022 | GR | 06.04.2022 | IS | 05.05.2022 | PT | 05.05.2022 | GB | 10.07.2022 | IE | 10.07.2022 | LU | 10.07.2022 | BE | 31.07.2022 | CH | 31.07.2022 | LI | 31.07.2022 | [2024/22] |
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Former [2022/30] | NL | 05.01.2022 | Cited in | International search | [Y]US2010055877 (KAJIYAMA KEIICHI [JP], et al) [Y] 1-12 * paragraph [0039] - paragraph [0057] * * figures 13-15 *; | [Y]US2009165277 (ZUSSY MARC [FR], et al) [Y] 1-12 * paragraph [0184] - paragraph [0189] * * figures 30,31 *; | [A]US4403567 (DACOSTA HARRY [US], et al) [A] 1,12 * column 3, line 4 - line 20 * * figures 2,6 *; | [A]JP2007059829 (DISCO ABRASIVE SYSTEMS LTD) [A] 1 * the whole document *; | [A]DE102010039798 (DISCO CORP [JP]) [A] 1 * the whole document *; | [A]US2007077731 (MASUDA TAKATOSHI [JP]) [A] 1 * the whole document * |