| EP3029734 - IGBT DEVICE AND METHOD FOR PACKAGING WHOLE-WAFER IGBT CHIP [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 12.03.2021 Database last updated on 09.04.2026 | |
| Former | The patent has been granted Status updated on 03.04.2020 | ||
| Former | Grant of patent is intended Status updated on 26.11.2019 | Most recent event Tooltip | 24.06.2022 | Lapse of the patent in a contracting state New state(s): CY, HU, MT, TR | published on 27.07.2022 [2022/30] | Applicant(s) | For all designated states Zhuzhou CSR Times Electric Co., Ltd. No. 169 Shidai Road Shifeng District Zhuzhou Hunan 412001 / CN | [2016/23] | Inventor(s) | 01 /
LI, Jilu No.169 Shidai Road Shifeng District Zhuzhou, Hunan 412001 / CN | 02 /
WU, Yudong No.169 Shidai Road Shifeng District Zhuzhou, Hunan 412001 / CN | 03 /
PENG, Yongdian No.169 Shidai Road Shifeng District Zhuzhou, Hunan 412001 / CN | [2017/45] |
| Former [2016/23] | 01 /
LI, Jilu No.169 Shidai Road Shifeng District Zhuzhou Hunan 412001 / CN | ||
| 02 /
WU, Yudong No.169 Shidai Road Shifeng District Zhuzhou Hunan 412001 / CN | |||
| 03 /
PENG, Yongdian No.169 Shidai Road Shifeng District Zhuzhou Hunan 412001 / CN | Representative(s) | Eisenführ Speiser Patentanwälte Rechtsanwälte PartGmbB Postfach 31 02 60 80102 München / DE | [2016/23] | Application number, filing date | 14831797.7 | 16.06.2014 | [2016/23] | WO2014CN79932 | Priority number, date | CN201310331846 | 01.08.2013 Original published format: CN201310331846 | [2016/23] | Filing language | ZH | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2015014166 | Date: | 05.02.2015 | Language: | ZH | [2015/05] | Type: | A1 Application with search report | No.: | EP3029734 | Date: | 08.06.2016 | Language: | EN | [2016/23] | Type: | B1 Patent specification | No.: | EP3029734 | Date: | 06.05.2020 | Language: | EN | [2020/19] | Search report(s) | International search report - published on: | CN | 05.02.2015 | (Supplementary) European search report - dispatched on: | EP | 28.02.2017 | Classification | IPC: | H01L23/051, H01L29/739, H01L29/08, H01L29/417, H01L29/66, H01L29/06 | [2017/13] | CPC: |
H10W72/00 (EP,US);
H10D12/032 (EP,US);
H10D12/441 (EP,US);
H10D62/127 (US);
H10D64/252 (US);
H10W76/138 (EP,US);
|
| Former IPC [2016/23] | H01L29/739, H01L29/08 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2016/23] | Extension states | BA | Not yet paid | ME | Not yet paid | Title | German: | IGBT-VORRICHTUNG UND VERFAHREN ZUM VERKAPSELN VON GANZWAFER-IGBT-CHIPS | [2016/23] | English: | IGBT DEVICE AND METHOD FOR PACKAGING WHOLE-WAFER IGBT CHIP | [2016/23] | French: | DISPOSITIF IGBT ET PROCÉDÉ DE MISE SOUS BOÎTIER DE PUCE IGBT SUR PLAQUETTE ENTIÈRE | [2016/23] | Entry into regional phase | 25.02.2016 | Translation filed | 01.03.2016 | National basic fee paid | 01.03.2016 | Search fee paid | 01.03.2016 | Designation fee(s) paid | 01.03.2016 | Examination fee paid | Examination procedure | 01.03.2016 | Examination requested [2016/23] | 21.09.2017 | Amendment by applicant (claims and/or description) | 27.11.2019 | Communication of intention to grant the patent | 25.03.2020 | Fee for grant paid | 25.03.2020 | Fee for publishing/printing paid | 25.03.2020 | Receipt of the translation of the claim(s) | Opposition(s) | 09.02.2021 | No opposition filed within time limit [2021/15] | Fees paid | Renewal fee | 30.06.2016 | Renewal fee patent year 03 | 30.06.2017 | Renewal fee patent year 04 | 02.07.2018 | Renewal fee patent year 05 | 01.07.2019 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 16.06.2014 | AL | 06.05.2020 | AT | 06.05.2020 | CY | 06.05.2020 | CZ | 06.05.2020 | DK | 06.05.2020 | EE | 06.05.2020 | ES | 06.05.2020 | FI | 06.05.2020 | HR | 06.05.2020 | IT | 06.05.2020 | LT | 06.05.2020 | LV | 06.05.2020 | MC | 06.05.2020 | MT | 06.05.2020 | NL | 06.05.2020 | PL | 06.05.2020 | RO | 06.05.2020 | RS | 06.05.2020 | SE | 06.05.2020 | SI | 06.05.2020 | SK | 06.05.2020 | SM | 06.05.2020 | TR | 06.05.2020 | IE | 16.06.2020 | LU | 16.06.2020 | BE | 30.06.2020 | CH | 30.06.2020 | LI | 30.06.2020 | FR | 06.07.2020 | BG | 06.08.2020 | NO | 06.08.2020 | GR | 07.08.2020 | IS | 06.09.2020 | PT | 07.09.2020 | [2022/27] |
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| Former [2020/46] | IS | 06.09.2020 | Documents cited: | Search | [YA] JPH08186258 (HITACHI LTD et al.) [Y] 1,2,5-10,13-15 * abstract *[A] 3,4,11,12 | [Y] US4734755 (SCHIERZ WINFRIED et al.) [Y] 1,2,6-10,14,15 * column 5, line 7 - column 6, line 53; figures 1,4 * | [Y] JPH10107051 (HITACHI LTD et al.) [Y] 2,6-8,10,14 * abstract * | [Y] JPH0737914 (FUJI ELECTRIC CO LTD et al.) [Y] 1,2,5,6,9,10,13-15 * abstract * | [A] JPH0758235 (HITACHI LTD et al.) [A] 3,4,11,12 * abstract * | International search | [XP] CN103390642 (ZHUZHOU CSR TIMES ELEC CO LTD et al.) [XP] | [A] CN102270640 [A] | [A] CN1362744 (TOSHIBA KK et al.) [A] | [A] US2004256691 (NEMOTO MICHIO et al.) [A] | [A] US6649973 (TAKAISHI MASARU et al.) [A] | [A] EP0702406 (TOSHIBA KK et al.) [A] | [A] US6303974 (IRONS ROBERT CHARLES et al.) [A] |