Extract from the Register of European Patents

EP About this file: EP3029734

EP3029734 - IGBT DEVICE AND METHOD FOR PACKAGING WHOLE-WAFER IGBT CHIP [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  12.03.2021
Database last updated on 09.04.2026
FormerThe patent has been granted
Status updated on  03.04.2020
FormerGrant of patent is intended
Status updated on  26.11.2019
Most recent event   Tooltip24.06.2022Lapse of the patent in a contracting state
New state(s): CY, HU, MT, TR
published on 27.07.2022  [2022/30]
Applicant(s)For all designated states
Zhuzhou CSR Times Electric Co., Ltd.
No. 169 Shidai Road
Shifeng District
Zhuzhou
Hunan 412001 / CN
[2016/23]
Inventor(s)01 / LI, Jilu
No.169 Shidai Road
Shifeng District
Zhuzhou, Hunan 412001 / CN
02 / WU, Yudong
No.169 Shidai Road
Shifeng District
Zhuzhou, Hunan 412001 / CN
03 / PENG, Yongdian
No.169 Shidai Road
Shifeng District
Zhuzhou, Hunan 412001 / CN
 [2017/45]
Former [2016/23]01 / LI, Jilu
No.169 Shidai Road
Shifeng District
Zhuzhou Hunan 412001 / CN
02 / WU, Yudong
No.169 Shidai Road
Shifeng District
Zhuzhou Hunan 412001 / CN
03 / PENG, Yongdian
No.169 Shidai Road
Shifeng District
Zhuzhou Hunan 412001 / CN
Representative(s)Eisenführ Speiser
Patentanwälte Rechtsanwälte PartGmbB
Postfach 31 02 60
80102 München / DE
[2016/23]
Application number, filing date14831797.716.06.2014
[2016/23]
WO2014CN79932
Priority number, dateCN20131033184601.08.2013         Original published format: CN201310331846
[2016/23]
Filing languageZH
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2015014166
Date:05.02.2015
Language:ZH
[2015/05]
Type: A1 Application with search report 
No.:EP3029734
Date:08.06.2016
Language:EN
[2016/23]
Type: B1 Patent specification 
No.:EP3029734
Date:06.05.2020
Language:EN
[2020/19]
Search report(s)International search report - published on:CN05.02.2015
(Supplementary) European search report - dispatched on:EP28.02.2017
ClassificationIPC:H01L23/051, H01L29/739, H01L29/08, H01L29/417, H01L29/66, H01L29/06
[2017/13]
CPC:
H10W72/00 (EP,US); H10D12/032 (EP,US); H10D12/441 (EP,US);
H10D62/127 (US); H10D64/252 (US); H10W76/138 (EP,US);
H10D62/117 (EP,US); H10W72/932 (EP,US); H10W72/9445 (EP,US) (-)
Former IPC [2016/23]H01L29/739, H01L29/08
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2016/23]
Extension statesBANot yet paid
MENot yet paid
TitleGerman:IGBT-VORRICHTUNG UND VERFAHREN ZUM VERKAPSELN VON GANZWAFER-IGBT-CHIPS[2016/23]
English:IGBT DEVICE AND METHOD FOR PACKAGING WHOLE-WAFER IGBT CHIP[2016/23]
French:DISPOSITIF IGBT ET PROCÉDÉ DE MISE SOUS BOÎTIER DE PUCE IGBT SUR PLAQUETTE ENTIÈRE[2016/23]
Entry into regional phase25.02.2016Translation filed 
01.03.2016National basic fee paid 
01.03.2016Search fee paid 
01.03.2016Designation fee(s) paid 
01.03.2016Examination fee paid 
Examination procedure01.03.2016Examination requested  [2016/23]
21.09.2017Amendment by applicant (claims and/or description)
27.11.2019Communication of intention to grant the patent
25.03.2020Fee for grant paid
25.03.2020Fee for publishing/printing paid
25.03.2020Receipt of the translation of the claim(s)
Opposition(s)09.02.2021No opposition filed within time limit [2021/15]
Fees paidRenewal fee
30.06.2016Renewal fee patent year 03
30.06.2017Renewal fee patent year 04
02.07.2018Renewal fee patent year 05
01.07.2019Renewal fee patent year 06
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Lapses during opposition  TooltipHU16.06.2014
AL06.05.2020
AT06.05.2020
CY06.05.2020
CZ06.05.2020
DK06.05.2020
EE06.05.2020
ES06.05.2020
FI06.05.2020
HR06.05.2020
IT06.05.2020
LT06.05.2020
LV06.05.2020
MC06.05.2020
MT06.05.2020
NL06.05.2020
PL06.05.2020
RO06.05.2020
RS06.05.2020
SE06.05.2020
SI06.05.2020
SK06.05.2020
SM06.05.2020
TR06.05.2020
IE16.06.2020
LU16.06.2020
BE30.06.2020
CH30.06.2020
LI30.06.2020
FR06.07.2020
BG06.08.2020
NO06.08.2020
GR07.08.2020
IS06.09.2020
PT07.09.2020
[2022/27]
Former [2021/23]AL06.05.2020
AT06.05.2020
CZ06.05.2020
DK06.05.2020
EE06.05.2020
ES06.05.2020
FI06.05.2020
HR06.05.2020
IT06.05.2020
LT06.05.2020
LV06.05.2020
MC06.05.2020
NL06.05.2020
PL06.05.2020
RO06.05.2020
RS06.05.2020
SE06.05.2020
SI06.05.2020
SK06.05.2020
SM06.05.2020
IE16.06.2020
LU16.06.2020
BE30.06.2020
CH30.06.2020
LI30.06.2020
FR06.07.2020
BG06.08.2020
NO06.08.2020
GR07.08.2020
IS06.09.2020
PT07.09.2020
Former [2021/20]AL06.05.2020
AT06.05.2020
CZ06.05.2020
DK06.05.2020
EE06.05.2020
ES06.05.2020
FI06.05.2020
HR06.05.2020
IT06.05.2020
LT06.05.2020
LV06.05.2020
MC06.05.2020
NL06.05.2020
PL06.05.2020
RO06.05.2020
RS06.05.2020
SE06.05.2020
SK06.05.2020
SM06.05.2020
IE16.06.2020
LU16.06.2020
CH30.06.2020
LI30.06.2020
BG06.08.2020
NO06.08.2020
GR07.08.2020
IS06.09.2020
PT07.09.2020
Former [2021/15]AL06.05.2020
AT06.05.2020
CZ06.05.2020
DK06.05.2020
EE06.05.2020
ES06.05.2020
FI06.05.2020
HR06.05.2020
IT06.05.2020
LT06.05.2020
LV06.05.2020
MC06.05.2020
NL06.05.2020
PL06.05.2020
RO06.05.2020
RS06.05.2020
SE06.05.2020
SK06.05.2020
SM06.05.2020
LU16.06.2020
BG06.08.2020
NO06.08.2020
GR07.08.2020
IS06.09.2020
PT07.09.2020
Former [2021/13]AL06.05.2020
AT06.05.2020
CZ06.05.2020
DK06.05.2020
EE06.05.2020
ES06.05.2020
FI06.05.2020
HR06.05.2020
IT06.05.2020
LT06.05.2020
LV06.05.2020
MC06.05.2020
NL06.05.2020
PL06.05.2020
RO06.05.2020
RS06.05.2020
SE06.05.2020
SK06.05.2020
SM06.05.2020
BG06.08.2020
NO06.08.2020
GR07.08.2020
IS06.09.2020
PT07.09.2020
Former [2021/10]AL06.05.2020
AT06.05.2020
CZ06.05.2020
DK06.05.2020
EE06.05.2020
ES06.05.2020
FI06.05.2020
HR06.05.2020
IT06.05.2020
LT06.05.2020
LV06.05.2020
NL06.05.2020
PL06.05.2020
RO06.05.2020
RS06.05.2020
SE06.05.2020
SK06.05.2020
SM06.05.2020
BG06.08.2020
NO06.08.2020
GR07.08.2020
IS06.09.2020
PT07.09.2020
Former [2021/09]AL06.05.2020
AT06.05.2020
CZ06.05.2020
DK06.05.2020
EE06.05.2020
ES06.05.2020
FI06.05.2020
HR06.05.2020
IT06.05.2020
LT06.05.2020
LV06.05.2020
NL06.05.2020
RO06.05.2020
RS06.05.2020
SE06.05.2020
SM06.05.2020
BG06.08.2020
NO06.08.2020
GR07.08.2020
IS06.09.2020
PT07.09.2020
Former [2021/08]AL06.05.2020
DK06.05.2020
ES06.05.2020
FI06.05.2020
HR06.05.2020
LT06.05.2020
LV06.05.2020
NL06.05.2020
RO06.05.2020
RS06.05.2020
SE06.05.2020
SM06.05.2020
BG06.08.2020
NO06.08.2020
GR07.08.2020
IS06.09.2020
PT07.09.2020
Former [2021/04]AL06.05.2020
FI06.05.2020
HR06.05.2020
LT06.05.2020
LV06.05.2020
NL06.05.2020
RS06.05.2020
SE06.05.2020
BG06.08.2020
NO06.08.2020
GR07.08.2020
IS06.09.2020
PT07.09.2020
Former [2021/01]FI06.05.2020
HR06.05.2020
LT06.05.2020
LV06.05.2020
RS06.05.2020
SE06.05.2020
BG06.08.2020
NO06.08.2020
GR07.08.2020
IS06.09.2020
PT07.09.2020
Former [2020/51]FI06.05.2020
HR06.05.2020
LT06.05.2020
LV06.05.2020
RS06.05.2020
SE06.05.2020
NO06.08.2020
GR07.08.2020
IS06.09.2020
PT07.09.2020
Former [2020/50]FI06.05.2020
HR06.05.2020
LT06.05.2020
LV06.05.2020
SE06.05.2020
NO06.08.2020
GR07.08.2020
IS06.09.2020
PT07.09.2020
Former [2020/48]FI06.05.2020
LT06.05.2020
SE06.05.2020
NO06.08.2020
IS06.09.2020
PT07.09.2020
Former [2020/47]LT06.05.2020
NO06.08.2020
IS06.09.2020
Former [2020/46]IS06.09.2020
Documents cited:Search[YA] JPH08186258  (HITACHI LTD et al.) [Y] 1,2,5-10,13-15 * abstract *[A] 3,4,11,12
 [Y] US4734755  (SCHIERZ WINFRIED et al.) [Y] 1,2,6-10,14,15 * column 5, line 7 - column 6, line 53; figures 1,4 *
 [Y] JPH10107051  (HITACHI LTD et al.) [Y] 2,6-8,10,14 * abstract *
 [Y] JPH0737914  (FUJI ELECTRIC CO LTD et al.) [Y] 1,2,5,6,9,10,13-15 * abstract *
 [A] JPH0758235  (HITACHI LTD et al.) [A] 3,4,11,12 * abstract *
International search[XP] CN103390642  (ZHUZHOU CSR TIMES ELEC CO LTD et al.) [XP]
 [A] CN102270640   [A]
 [A] CN1362744  (TOSHIBA KK et al.) [A]
 [A] US2004256691  (NEMOTO MICHIO et al.) [A]
 [A] US6649973  (TAKAISHI MASARU et al.) [A]
 [A] EP0702406  (TOSHIBA KK et al.) [A]
 [A] US6303974  (IRONS ROBERT CHARLES et al.) [A]
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