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Extract from the Register of European Patents

EP About this file: EP3054477

EP3054477 - SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  22.06.2018
Database last updated on 24.08.2024
Most recent event   Tooltip22.06.2018Withdrawal of applicationpublished on 25.07.2018  [2018/30]
Applicant(s)For all designated states
TOYOTA JIDOSHA KABUSHIKI KAISHA
1, Toyota-cho
Toyota-shi, Aichi-ken, 471-8571 / JP
[2016/32]
Inventor(s)01 / KANECHIKA Masakazu
c/o KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
41-1 Yokomichi
Nagakute-shi Aichi 480-1192 / JP
02 / KUWAHARA Makoto
c/o KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
41-1 Yokomichi
Nagakute-shi Aichi 480-1192 / JP
03 / UEDA Hiroyuki
c/o KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
41-1 Yokomichi
Nagakute-shi Aichi 480-1192 / JP
04 / TOMITA Hidemoto
c/o TOYOTA JIDOSHA KABUSHIKI KAISHA
1 Toyota-cho
Toyota-shi Aichi 471-8571 / JP
 [2016/32]
Representative(s)Kuhnen & Wacker Patent- und Rechtsanwaltsbüro PartG mbB
Prinz-Ludwig-Straße 40A
85354 Freising / DE
[N/P]
Former [2016/32]Kuhnen & Wacker
Patent- und Rechtsanwaltsbüro
Prinz-Ludwig-Straße 40A
85354 Freising / DE
Application number, filing date14848960.208.09.2014
[2016/32]
WO2014JP73677
Priority number, dateJP2013020416230.09.2013         Original published format: JP 2013204162
[2016/32]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2015045833
Date:02.04.2015
Language:JA
[2015/13]
Type: A1 Application with search report 
No.:EP3054477
Date:10.08.2016
Language:EN
[2016/32]
Search report(s)International search report - published on:JP02.04.2015
(Supplementary) European search report - dispatched on:EP04.10.2016
ClassificationIPC:H01L21/337, H01L29/778, H01L27/098, H01L29/10, H01L29/34, // H01L29/06, H01L29/20
[2016/44]
CPC:
H01L29/66462 (EP,US); H01L29/7783 (US); H01L29/0684 (US);
H01L29/1066 (EP,US); H01L29/205 (US); H01L29/34 (EP,US);
H01L29/7786 (EP,US); H01L29/7788 (EP,US); H01L21/0242 (EP,US);
H01L21/02458 (EP,US); H01L21/02502 (EP,US); H01L21/0254 (EP,US);
H01L21/02579 (EP,US); H01L29/0646 (EP,US); H01L29/2003 (EP,US) (-)
Former IPC [2016/32]H01L21/337, H01L21/338, H01L27/098, H01L29/778, H01L29/808, H01L29/812
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2016/32]
TitleGerman:HALBLEITERBAUELEMENT UND VERFAHREN ZUR HERSTELLUNG DAVON[2016/32]
English:SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME[2016/32]
French:DISPOSITIF À SEMI-CONDUCTEUR ET SON PROCÉDÉ DE FABRICATION[2016/32]
Entry into regional phase10.03.2016Translation filed 
10.03.2016National basic fee paid 
10.03.2016Search fee paid 
10.03.2016Designation fee(s) paid 
10.03.2016Examination fee paid 
Examination procedure10.03.2016Examination requested  [2016/32]
13.04.2017Amendment by applicant (claims and/or description)
14.06.2018Application withdrawn by applicant  [2018/30]
Fees paidRenewal fee
08.09.2016Renewal fee patent year 03
12.09.2017Renewal fee patent year 04
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Documents cited:Search[X]US2010258841  (LIDOW ALEXANDER [US], et al) [X] 1,2,4-6 * figures 10, 11 and associated text *;
 [XI]US2011284928  (SHIBATA DAISUKE [JP], et al) [X] 1,2,4-6 * figure 1 and associated text *[I] 3,7
International search[X]JP2011233751  (PANASONIC CORP);
 [X]JP2012523700  (EFFICIENT POWER CONVERSION CORP.)
by applicantJP2011029507
 JP2013204162
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.