| EP3059635 - METHOD FOR ALIGNING QUADRATE WAFER IN FIRST PHOTOLITHOGRAPHIC PROCESS [Right-click to bookmark this link] | |||
| Former [2016/34] | METHOD FOR ALIGNING SQUARE WAFER IN FIRST PHOTOLITHOGRAPHIC PROCESS | ||
| [2019/02] | Status | No opposition filed within time limit Status updated on 13.03.2020 Database last updated on 20.03.2026 | |
| Former | The patent has been granted Status updated on 05.04.2019 | ||
| Former | Grant of patent is intended Status updated on 19.12.2018 | Most recent event Tooltip | 08.07.2022 | Lapse of the patent in a contracting state New state(s): MK | published on 10.08.2022 [2022/32] | Applicant(s) | For all designated states Institute of Semiconductors, Chinese Academy Of Sciences No. 35A Qinghua Dong Lu Haidian District Beijing 100083 / CN | [2016/34] | Inventor(s) | 01 /
LI, Jinmin No. 35A Qinghua Dong Lu Haidian District Beijing 100083 / CN | 02 /
WANG, Junxi No. 35A Qinghua Dong Lu Haidian District Beijing 100083 / CN | 03 /
KONG, Qingfeng No. 35A Qinghua Dong Lu Haidian District Beijing 100083 / CN | 04 /
GUO, Jinxia No. 35A Qinghua Dong Lu Haidian District Beijing 100083 / CN | 05 /
YI, Xiaoyan No. 35A Qinghua Dong Lu Haidian District Beijing 100083 / CN | [2016/34] | Representative(s) | Patentanwälte Geyer, Fehners & Partner mbB Perhamerstrasse 31 80687 München / DE | [2016/34] | Application number, filing date | 14853966.1 | 03.01.2014 | [2016/34] | WO2014CN70051 | Priority number, date | CN201310485162 | 16.10.2013 Original published format: CN201310485162 | [2016/34] | Filing language | ZH | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2015054977 | Date: | 23.04.2015 | Language: | ZH | [2015/16] | Type: | A1 Application with search report | No.: | EP3059635 | Date: | 24.08.2016 | Language: | EN | [2016/34] | Type: | B1 Patent specification | No.: | EP3059635 | Date: | 08.05.2019 | Language: | EN | [2019/19] | Search report(s) | International search report - published on: | CN | 23.04.2015 | (Supplementary) European search report - dispatched on: | EP | 08.05.2017 | Classification | IPC: | G03F9/00, G03F1/42 | [2017/23] | CPC: |
G03F9/7084 (EP,US);
G03F1/42 (EP,US)
|
| Former IPC [2016/34] | G03F9/00 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2016/34] | Extension states | BA | Not yet paid | ME | Not yet paid | Title | German: | VERFAHREN ZUM AUSRICHTEN EINES RECHTECKIGEN WAFERS IN EINEM ERSTEN PHOTOLITHOGRAFISCHEN PROZESS | [2019/02] | English: | METHOD FOR ALIGNING QUADRATE WAFER IN FIRST PHOTOLITHOGRAPHIC PROCESS | [2019/02] | French: | MÉTHODE D'ALIGNEMENT D'UNE PLAQUETTE CARRÉE DANS UN PREMIER PROCESSUS PHOTOLITHOGRAPHIQUE | [2019/02] |
| Former [2016/34] | VERFAHREN ZUM AUSRICHTEN RECHTECKIGER HALBLEITERSCHEIBEN IN EINEM ERSTEN PHOTOLITHOGRAFISCHEN PROZESS | ||
| Former [2016/34] | METHOD FOR ALIGNING SQUARE WAFER IN FIRST PHOTOLITHOGRAPHIC PROCESS | ||
| Former [2016/34] | MÉTHODE D'ALIGNEMENT D'UNE TRANCHE CARRÉE DANS UN PREMIER PROCESSUS PHOTOLITHOGRAPHIQUE | Entry into regional phase | 12.04.2016 | Translation filed | 15.04.2016 | National basic fee paid | 15.04.2016 | Search fee paid | 15.04.2016 | Designation fee(s) paid | 15.04.2016 | Examination fee paid | Examination procedure | 15.04.2016 | Examination requested [2016/34] | 27.11.2017 | Amendment by applicant (claims and/or description) | 20.12.2018 | Communication of intention to grant the patent | 27.03.2019 | Fee for grant paid | 27.03.2019 | Fee for publishing/printing paid | 27.03.2019 | Receipt of the translation of the claim(s) | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 20.12.2018 | Opposition(s) | 11.02.2020 | No opposition filed within time limit [2020/16] | Fees paid | Renewal fee | 15.04.2016 | Renewal fee patent year 03 | 20.01.2017 | Renewal fee patent year 04 | 26.01.2018 | Renewal fee patent year 05 | 22.01.2019 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 03.01.2014 | AL | 08.05.2019 | AT | 08.05.2019 | CY | 08.05.2019 | CZ | 08.05.2019 | DK | 08.05.2019 | EE | 08.05.2019 | ES | 08.05.2019 | FI | 08.05.2019 | HR | 08.05.2019 | IT | 08.05.2019 | LT | 08.05.2019 | LV | 08.05.2019 | MC | 08.05.2019 | MK | 08.05.2019 | MT | 08.05.2019 | PL | 08.05.2019 | RO | 08.05.2019 | RS | 08.05.2019 | SE | 08.05.2019 | SI | 08.05.2019 | SK | 08.05.2019 | SM | 08.05.2019 | TR | 08.05.2019 | BG | 08.08.2019 | NO | 08.08.2019 | GR | 09.08.2019 | IS | 08.09.2019 | PT | 08.09.2019 | IE | 03.01.2020 | LU | 03.01.2020 | BE | 31.01.2020 | CH | 31.01.2020 | LI | 31.01.2020 | [2022/31] |
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| NO | 08.08.2019 | Documents cited: | Search | [XI] JPH07169673 (MITSUBISHI ELECTRIC CORP et al.) [X] 1-4 * paragraphs [0005] , [0025] - [0027] * * figures 1,2,7,11,12,15 *[I] 5-12 | [X] US2005250291 (BALUSWAMY PARY et al.) [X] 1,4 * figure 1 * | [X] US6929888 (KIM JUNG-YOUNG et al.) [X] 1 * abstract * * column 1, line 44 - column 2, line 38 * * figure 1 * | [I] JPH09171610 (NIKON CORP et al.) [I] 1-12 * paragraphs [0010] , [0011] , [0024] , [0030] * * figures 1,2a,2b,7b * | International search | [X] CN101458443 (SEMICONDUCTOR MFG INT SHANGHAI et al.) [X] | [A] CN101369571 (SEMICONDUCTOR MFG INT SHANGHAI et al.) [A] | [A] US5532091 (MIZUTANI SHINJI et al.) [A] | [A] US2012058581 (TSUJI YUKIHIRO et al.) [A] | [A] CN103296031 (MITSUBISHI ELECTRIC CORP et al.) [A] |