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EP3203510
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EP About this file: EP3203510
| EP3203510 - SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR PACKAGE [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 10.05.2021 Database last updated on 18.11.2024 | |
| Former | Examination is in progress Status updated on 05.03.2021 | ||
| Former | Request for examination was made Status updated on 07.07.2017 | Most recent event Tooltip | 10.05.2021 | Withdrawal of application | published on 09.06.2021 [2021/23] | Applicant(s) | For all designated states Shindengen Electric Manufacturing Co., Ltd. 2-1 Ohtemachi 2-chome Chiyoda-ku Tokyo 100-0004 / JP | [2017/32] | Inventor(s) | 01 /
MIZAWA, Yuichi c/o SHINDENGEN ELECTRIC MANUFACTURING CO. LTD. Factory 10-13 Minami-cho Hanno-shi Saitama 357-8585 / JP | 02 /
NAGASE, Takeo c/o Higashine Shindengen Co. Ltd. 5600-1 Ooaza Higashine Kou Higashine-shi Yamagata 999-3701 / JP | [2017/32] | Representative(s) | Dr. Weitzel & Partner Patent- und Rechtsanwälte mbB Friedenstrasse 10 89522 Heidenheim / DE | [2017/32] | Application number, filing date | 14863035.3 | 29.09.2014 | [2017/32] | WO2014JP75819 | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2016051449 | Date: | 07.04.2016 | Language: | JA | [2016/14] | Type: | A1 Application with search report | No.: | EP3203510 | Date: | 09.08.2017 | Language: | EN | [2017/32] | Search report(s) | International search report - published on: | JP | 07.04.2016 | (Supplementary) European search report - dispatched on: | EP | 10.04.2018 | Classification | IPC: | H01L23/29, H01L23/31, H01L23/48 | [2017/32] | CPC: |
H01L23/49513 (EP,US);
H01L21/56 (EP,US);
H01L23/29 (US);
H01L23/293 (US);
H01L23/31 (US);
H01L23/3107 (EP,US);
H01L23/3142 (EP,US);
H01L23/4952 (EP,US);
H01L23/49524 (EP,US);
H01L23/49541 (US);
H01L23/49562 (EP,US);
H01L24/32 (EP,US);
H01L24/34 (US);
H01L24/48 (EP,US);
H01L24/73 (EP,US);
H01L24/83 (EP,US);
H01L24/85 (EP,US);
H01L24/92 (EP,US);
H01L2224/05553 (EP,US);
H01L2224/05624 (EP,US);
H01L2224/0603 (EP,US);
H01L2224/29101 (EP,US);
H01L2224/29139 (US);
H01L2224/29339 (EP,US);
H01L2224/32245 (EP,US);
H01L2224/40095 (EP,US);
H01L2224/45124 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48106 (US);
H01L2224/48245 (US);
H01L2224/48247 (EP,US);
H01L2224/48472 (EP,US);
H01L2224/4903 (EP,US);
H01L2224/49171 (EP,US);
H01L2224/73263 (EP,US);
H01L2224/73265 (EP,US);
H01L2224/8302 (US);
H01L2224/83048 (US);
H01L2224/83815 (EP,US);
H01L2224/8385 (EP,US);
H01L2224/8392 (EP,US);
H01L2224/83948 (EP,US);
H01L2224/8485 (EP,US);
H01L2224/8592 (EP,US);
H01L2224/92247 (EP,US);
H01L23/562 (EP,US);
H01L24/06 (EP,US);
H01L24/29 (EP,US);
H01L24/40 (EP,US);
H01L24/45 (EP,US);
H01L24/49 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01028 (US);
H01L2924/1305 (EP,US);
H01L2924/13055 (US);
H01L2924/181 (EP,US);
H01L2924/20102 (US);
| C-Set: |
H01L2224/05624, H01L2924/00014 (US,EP);
H01L2224/29101, H01L2924/014, H01L2924/00014 (EP,US);
H01L2224/29339, H01L2924/00014 (EP,US);
H01L2224/45124, H01L2924/00014 (US,EP);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/48472, H01L2224/48247, H01L2924/00 (US,EP);
H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00 (US);
H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00012 (US,EP);
H01L2224/83815, H01L2924/00014 (EP,US);
H01L2224/92247, H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00012 (US,EP);
H01L2924/00014, H01L2224/37099 (US,EP);
H01L2924/00014, H01L2224/45015, H01L2924/207 (US,EP); | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2017/32] | Title | German: | HALBLEITERGEHÄUSEHERSTELLUNGSVERFAHREN UND HALBLEITERGEHÄUSE | [2017/32] | English: | SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR PACKAGE | [2017/32] | French: | PROCÉDÉ DE FABRICATION DE BOÎTIER DE SEMI-CONDUCTEUR ET BOÎTIER DE SEMI-CONDUCTEUR | [2017/32] | Entry into regional phase | 22.05.2015 | Translation filed | 22.05.2015 | National basic fee paid | 22.05.2015 | Search fee paid | 22.05.2015 | Designation fee(s) paid | 22.05.2015 | Examination fee paid | Examination procedure | 22.05.2015 | Examination requested [2017/32] | 22.05.2015 | Date on which the examining division has become responsible | 24.08.2018 | Amendment by applicant (claims and/or description) | 04.03.2021 | Despatch of a communication from the examining division (Time limit: M04) | 30.04.2021 | Application withdrawn by applicant [2021/23] | Fees paid | Renewal fee | 29.09.2016 | Renewal fee patent year 03 | 25.09.2017 | Renewal fee patent year 04 | 25.09.2018 | Renewal fee patent year 05 | 17.09.2019 | Renewal fee patent year 06 | 29.09.2020 | Renewal fee patent year 07 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JPH1154747 (TOSHIBA CORP); | [Y]JP2005142258 (DENSO CORP); | [A]JP2005203548 (HONDA MOTOR CO LTD); | [Y]EP2472584 (RENESAS ELECTRONICS CORP [JP]) | International search | [A]JPH11297730 (DENSO CORP) [A] 1-11* , paragraphs [0031] to [0036]; fig. 7 (Family: none) *; | [A]JP2001118885 (MATSUSHITA ELECTRIC IND CO LTD) [A] 1-11 * , paragraphs [0034] to [0035], [0045], [0053] to [0056]; fig. 1, 3 (Family: none) *; | [A]JP2006319109 (MATSUSHITA ELECTRIC IND CO LTD) [A] 1-11 * , paragraphs [0014] to [0017]; fig. 1 (Family: none) *; | [A]JP2012023233 (MITSUBISHI ELECTRIC CORP) [A] 1-11 * , paragraphs [0011] to [0022]; fig. 1 to 3 (Family: none) * | Examination | JP2005226096 | JP2005340474 | by applicant | JP2005072306 | JP2005226096 | JP2005340474 | JP2011082389 |