EP3113222 - CHIP PACKAGING MODULE [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 04.10.2019 Database last updated on 31.08.2024 | |
Former | Examination is in progress Status updated on 21.12.2018 | ||
Former | Request for examination was made Status updated on 02.12.2016 | Most recent event Tooltip | 04.10.2019 | Withdrawal of application | published on 06.11.2019 [2019/45] | Applicant(s) | For all designated states Shenzhen Goodix Technology Co., Ltd. Floor 13, Phase B, Tengfei Industrial Building Futian Free Trade Zone Shenzhen, Guangdong 518045 / CN | [N/P] |
Former [2017/36] | For all designated states Shenzhen Goodix Technology Co., Ltd. Floor 13, Phase B, Tengfei Industrial Building Futian Free Trade Zone Shenzhen, Guangdong, 518045 / CN | ||
Former [2017/01] | For all designated states Shenzhen Huiding Technology Co., Ltd. Floor 13 Phase B Tengfei Industrial Building Futian Free Trade Zone Shenzhen, Guangdong 518000 / CN | Inventor(s) | 01 /
WU, Baoquan Floor 13 Phase B Tengfei Industrial Building Futian Free Trade Zone Shenzhen Guangdong 518000 / CN | 02 /
LONG, Wei Floor 13 Phase B Tengfei Industrial Building Futian Free Trade Zone Shenzhen Guangdong 518000 / CN | [2017/01] | Representative(s) | Würmser, Julian Meissner Bolte Patentanwälte Rechtsanwälte Partnerschaft mbB Postfach 86 06 24 81633 München / DE | [2017/01] | Application number, filing date | 14900185.1 | 10.10.2014 | [2017/01] | WO2014CN88300 | Priority number, date | CN201410414557 | 20.08.2014 Original published format: CN201410414557 | [2017/01] | Filing language | ZH | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2016026199 | Date: | 25.02.2016 | Language: | ZH | [2016/08] | Type: | A1 Application with search report | No.: | EP3113222 | Date: | 04.01.2017 | Language: | EN | [2017/01] | Search report(s) | International search report - published on: | CN | 25.02.2016 | (Supplementary) European search report - dispatched on: | EP | 20.02.2018 | Classification | IPC: | H01L25/065, G06K9/00, H01L21/60, // H01L23/48 | [2018/12] | CPC: |
H01L24/24 (EP,KR,US);
H01L23/488 (KR);
H01L25/0657 (US);
G06F18/00 (KR);
H01L23/13 (US);
H01L23/3128 (US);
H01L23/481 (US);
H01L23/485 (KR);
H01L24/82 (EP,KR,US);
H01L25/00 (KR);
H01L25/0652 (EP,US);
G06F2218/10 (EP,US);
G06V40/1306 (EP,US);
H01L2224/04042 (EP,KR,US);
H01L2224/05548 (EP,US);
H01L2224/05556 (EP,US);
H01L2224/05567 (EP,US);
H01L2224/05568 (EP,US);
H01L2224/0557 (EP,US);
H01L2224/24137 (EP,KR,US);
H01L2224/24146 (EP,US);
H01L2224/24147 (EP,KR,US);
H01L2224/32145 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48137 (EP,US);
H01L2224/48145 (EP,US);
H01L2224/48227 (EP,US);
H01L2224/73265 (EP,US);
H01L2224/73267 (EP,US);
H01L2225/06506 (EP,US);
H01L2225/0651 (EP,US);
H01L2225/06524 (EP,US);
H01L2225/06541 (EP,US);
H01L2225/06555 (US);
H01L2225/06558 (EP,US);
H01L24/73 (EP,US);
H01L24/94 (US);
H01L24/97 (US);
H01L25/0655 (US);
H01L25/071 (US);
H01L25/105 (US);
H01L25/112 (US);
| C-Set: |
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2224/73265, H01L2224/32145, H01L2224/48145, H01L2924/00012 (US,EP);
H01L2224/73265, H01L2224/32145, H01L2224/48227, H01L2924/00 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (US,EP) |
Former IPC [2017/01] | H01L23/488, H01L23/485, H01L25/00, G06K9/00 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2017/01] | Title | German: | CHIPGEHÄUSUNGSMODUL | [2017/01] | English: | CHIP PACKAGING MODULE | [2017/01] | French: | MODULE DE MISE EN BOÎTIER DE PUCE | [2017/01] | Entry into regional phase | 27.09.2016 | Translation filed | 27.09.2016 | National basic fee paid | 27.09.2016 | Search fee paid | 27.09.2016 | Designation fee(s) paid | 27.09.2016 | Examination fee paid | Examination procedure | 27.09.2016 | Examination requested [2017/01] | 27.09.2016 | Date on which the examining division has become responsible | 29.08.2018 | Amendment by applicant (claims and/or description) | 21.12.2018 | Despatch of a communication from the examining division (Time limit: M04) | 29.04.2019 | Reply to a communication from the examining division | 26.09.2019 | Application withdrawn by applicant [2019/45] | 27.09.2019 | Cancellation of oral proceeding that was planned for 22.11.2019 | 22.11.2019 | Date of oral proceedings (cancelled) | Fees paid | Renewal fee | 27.09.2016 | Renewal fee patent year 03 | 27.10.2017 | Renewal fee patent year 04 | 30.10.2018 | Renewal fee patent year 05 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XAI]KR20110036249 (AMKOR TECHNOLOGY INC [KR]) [X] 1-4,6,7 * paragraphs [0030] - [0035] - [0039] - paragraph [0049]; figures 3-5 * [A] 5 [I] 8; | [XI]DE102010041129 (BOSCH GMBH ROBERT [DE]) [X] 1-3,7 * paragraphs [0007] , [0008] , [0079] , [0080]; figures 5a,5b *[I] 8; | [XA]US2012315726 (BYUN HAK-KYOON [KR], et al) [X] 1,2,5 * paragraphs [0047] - [0050] - [0062] - [0065]; figures 6,7,10 * [A] 3,4,6 | International search | [X]CN1893565 (CAIYU SCIENCE TECHNOLOGY CO LT [CN]) [X] 1-3 * description, pages 3 and 4, and figures 1 and 2 *; | [X]CN101207101 (ADVANCED CHIP ENG TECH INC [CN]) [X] 1-3* the whole description *; | [X]JP2008235478 (NIKON CORP) [X] 1-3, 7, 8 * description, paragraphs [0023]-[0026] and figure 4 *; | [X]CN101578703 (TESSERA TECH HUNGARY KFT [HU]) [X] 1-3 * the whole description *; | [XA]US2010019338 (KWON WOON-SEONG [KR], et al) [X] 1-3, 5-8 * description, paragraphs [0025]-[0031] and figure 3the whole description * [A] 4, 9-11; | [X]CN102723306 (SHANGHAI INST MICROSYS & INF) [X] 1-3 * description, paragraphs [0012]-[0017] and figure 2 *; | [X]CN102881666 (HK APPLIED SCIENCE AND TECHNOLOGY RES INST CO LTD) [X] 1-3 * the whole description *; | [X]CN103337486 (ADVANCED SEMICONDUCTOR ENG) [X] 1-3 * description, paragraphs [0028], [0029] and figure 5 *; | [X]CN103887279 (NAT CT FOR ADVANCED PACKAGING) [X] 1-3, 7, 8 * description, paragraphs [0035], [0036] and figure 18 * |