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Extract from the Register of European Patents

EP About this file: EP3113222

EP3113222 - CHIP PACKAGING MODULE [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  04.10.2019
Database last updated on 31.08.2024
FormerExamination is in progress
Status updated on  21.12.2018
FormerRequest for examination was made
Status updated on  02.12.2016
Most recent event   Tooltip04.10.2019Withdrawal of applicationpublished on 06.11.2019  [2019/45]
Applicant(s)For all designated states
Shenzhen Goodix Technology Co., Ltd.
Floor 13, Phase B, Tengfei Industrial Building
Futian Free Trade Zone
Shenzhen, Guangdong 518045 / CN
[N/P]
Former [2017/36]For all designated states
Shenzhen Goodix Technology Co., Ltd.
Floor 13, Phase B, Tengfei Industrial Building
Futian Free Trade Zone
Shenzhen, Guangdong, 518045 / CN
Former [2017/01]For all designated states
Shenzhen Huiding Technology Co., Ltd.
Floor 13 Phase B
Tengfei Industrial Building
Futian Free Trade Zone
Shenzhen, Guangdong 518000 / CN
Inventor(s)01 / WU, Baoquan
Floor 13 Phase B
Tengfei Industrial Building
Futian Free Trade Zone
Shenzhen Guangdong 518000 / CN
02 / LONG, Wei
Floor 13 Phase B
Tengfei Industrial Building
Futian Free Trade Zone
Shenzhen Guangdong 518000 / CN
 [2017/01]
Representative(s)Würmser, Julian
Meissner Bolte Patentanwälte
Rechtsanwälte Partnerschaft mbB
Postfach 86 06 24
81633 München / DE
[2017/01]
Application number, filing date14900185.110.10.2014
[2017/01]
WO2014CN88300
Priority number, dateCN20141041455720.08.2014         Original published format: CN201410414557
[2017/01]
Filing languageZH
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2016026199
Date:25.02.2016
Language:ZH
[2016/08]
Type: A1 Application with search report 
No.:EP3113222
Date:04.01.2017
Language:EN
[2017/01]
Search report(s)International search report - published on:CN25.02.2016
(Supplementary) European search report - dispatched on:EP20.02.2018
ClassificationIPC:H01L25/065, G06K9/00, H01L21/60, // H01L23/48
[2018/12]
CPC:
H01L24/24 (EP,KR,US); H01L23/488 (KR); H01L25/0657 (US);
G06F18/00 (KR); H01L23/13 (US); H01L23/3128 (US);
H01L23/481 (US); H01L23/485 (KR); H01L24/82 (EP,KR,US);
H01L25/00 (KR); H01L25/0652 (EP,US); G06F2218/10 (EP,US);
G06V40/1306 (EP,US); H01L2224/04042 (EP,KR,US); H01L2224/05548 (EP,US);
H01L2224/05556 (EP,US); H01L2224/05567 (EP,US); H01L2224/05568 (EP,US);
H01L2224/0557 (EP,US); H01L2224/24137 (EP,KR,US); H01L2224/24146 (EP,US);
H01L2224/24147 (EP,KR,US); H01L2224/32145 (EP,US); H01L2224/48091 (EP,US);
H01L2224/48137 (EP,US); H01L2224/48145 (EP,US); H01L2224/48227 (EP,US);
H01L2224/73265 (EP,US); H01L2224/73267 (EP,US); H01L2225/06506 (EP,US);
H01L2225/0651 (EP,US); H01L2225/06524 (EP,US); H01L2225/06541 (EP,US);
H01L2225/06555 (US); H01L2225/06558 (EP,US); H01L24/73 (EP,US);
H01L24/94 (US); H01L24/97 (US); H01L25/0655 (US);
H01L25/071 (US); H01L25/105 (US); H01L25/112 (US);
H01L25/16 (US); H01L2924/15153 (EP,KR,US); H01L2924/19107 (EP,KR,US) (-)
C-Set:
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2224/73265, H01L2224/32145, H01L2224/48145, H01L2924/00012 (US,EP);
H01L2224/73265, H01L2224/32145, H01L2224/48227, H01L2924/00 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (US,EP)
Former IPC [2017/01]H01L23/488, H01L23/485, H01L25/00, G06K9/00
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2017/01]
TitleGerman:CHIPGEHÄUSUNGSMODUL[2017/01]
English:CHIP PACKAGING MODULE[2017/01]
French:MODULE DE MISE EN BOÎTIER DE PUCE[2017/01]
Entry into regional phase27.09.2016Translation filed 
27.09.2016National basic fee paid 
27.09.2016Search fee paid 
27.09.2016Designation fee(s) paid 
27.09.2016Examination fee paid 
Examination procedure27.09.2016Examination requested  [2017/01]
27.09.2016Date on which the examining division has become responsible
29.08.2018Amendment by applicant (claims and/or description)
21.12.2018Despatch of a communication from the examining division (Time limit: M04)
29.04.2019Reply to a communication from the examining division
26.09.2019Application withdrawn by applicant  [2019/45]
27.09.2019Cancellation of oral proceeding that was planned for 22.11.2019
22.11.2019Date of oral proceedings (cancelled)
Fees paidRenewal fee
27.09.2016Renewal fee patent year 03
27.10.2017Renewal fee patent year 04
30.10.2018Renewal fee patent year 05
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XAI]KR20110036249  (AMKOR TECHNOLOGY INC [KR]) [X] 1-4,6,7 * paragraphs [0030] - [0035] - [0039] - paragraph [0049]; figures 3-5 * [A] 5 [I] 8;
 [XI]DE102010041129  (BOSCH GMBH ROBERT [DE]) [X] 1-3,7 * paragraphs [0007] , [0008] , [0079] , [0080]; figures 5a,5b *[I] 8;
 [XA]US2012315726  (BYUN HAK-KYOON [KR], et al) [X] 1,2,5 * paragraphs [0047] - [0050] - [0062] - [0065]; figures 6,7,10 * [A] 3,4,6
International search[X]CN1893565  (CAIYU SCIENCE TECHNOLOGY CO LT [CN]) [X] 1-3 * description, pages 3 and 4, and figures 1 and 2 *;
 [X]CN101207101  (ADVANCED CHIP ENG TECH INC [CN]) [X] 1-3* the whole description *;
 [X]JP2008235478  (NIKON CORP) [X] 1-3, 7, 8 * description, paragraphs [0023]-[0026] and figure 4 *;
 [X]CN101578703  (TESSERA TECH HUNGARY KFT [HU]) [X] 1-3 * the whole description *;
 [XA]US2010019338  (KWON WOON-SEONG [KR], et al) [X] 1-3, 5-8 * description, paragraphs [0025]-[0031] and figure 3the whole description * [A] 4, 9-11;
 [X]CN102723306  (SHANGHAI INST MICROSYS & INF) [X] 1-3 * description, paragraphs [0012]-[0017] and figure 2 *;
 [X]CN102881666  (HK APPLIED SCIENCE AND TECHNOLOGY RES INST CO LTD) [X] 1-3 * the whole description *;
 [X]CN103337486  (ADVANCED SEMICONDUCTOR ENG) [X] 1-3 * description, paragraphs [0028], [0029] and figure 5 *;
 [X]CN103887279  (NAT CT FOR ADVANCED PACKAGING) [X] 1-3, 7, 8 * description, paragraphs [0035], [0036] and figure 18 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.