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Extract from the Register of European Patents

EP About this file: EP3195355

EP3195355 - SEMICONDUCTOR PACKAGES WITH EMBEDDED BRIDGE INTERCONNECTS [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  01.10.2021
Database last updated on 24.08.2024
FormerThe patent has been granted
Status updated on  23.10.2020
FormerGrant of patent is intended
Status updated on  17.06.2020
FormerRequest for examination was made
Status updated on  23.06.2017
FormerThe international publication has been made
Status updated on  07.02.2017
Most recent event   Tooltip27.04.2024Lapse of the patent in a contracting state
New state(s): MK		published on 29.05.2024  [2024/22]
Applicant(s)For all designated states
Intel Corporation
2200 Mission College Boulevard
Santa Clara, CA 95054 / US
[2017/30]
Inventor(s)01 / LEE, Kyu-Oh
2331 W. Toledo Pl.
Chandler, Arizona 85224 / US
 [2017/30]
Representative(s)Rummler, Felix, et al
Maucher Jenkins
Seventh Floor Offices
Artillery House
11-19 Artillery Row
London SW1P 1RT / GB
[N/P]
Former [2017/30]Rummler, Felix, et al
Maucher Jenkins
26 Caxton Street
London SW1H 0RJ / GB
Application number, filing date14902138.819.09.2014
[2017/30]
WO2014US56662
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2016043779
Date:24.03.2016
Language:EN
[2016/12]
Type: A1 Application with search report 
No.:EP3195355
Date:26.07.2017
Language:EN
The application published by WIPO in one of the EPO official languages on 24.03.2016 takes the place of the publication of the European patent application.
[2017/30]
Type: B1 Patent specification 
No.:EP3195355
Date:25.11.2020
Language:EN
[2020/48]
Search report(s)International search report - published on:KR24.03.2016
(Supplementary) European search report - dispatched on:EP26.03.2018
ClassificationIPC:H01L23/48, H01L23/498, H01L21/48
[2018/17]
CPC:
H01L21/4857 (EP,US); H01L23/49827 (EP,KR,US); H01L23/5386 (US);
H01L21/4853 (US); H01L21/486 (EP,KR,US); H01L21/6835 (US);
H01L23/49816 (EP,US); H01L23/49822 (EP,US); H01L23/49894 (US);
H01L23/5389 (EP,KR,US); H01L24/16 (EP,US); H01L24/75 (EP,US);
H01L24/78 (KR); H01L24/81 (EP,KR,US); H01L24/97 (EP,KR,US);
H01L2221/68359 (US); H01L2224/04105 (KR); H01L2224/12105 (KR);
H01L2224/13082 (EP,KR,US); H01L2224/131 (EP,KR,US); H01L2224/16145 (KR);
H01L2224/16227 (EP,US); H01L2224/16235 (EP,US); H01L2224/75743 (EP,US);
H01L2224/81193 (EP,US); H01L2224/81203 (EP,US); H01L2224/97 (EP,US);
H01L25/0655 (EP,US); H01L2924/1432 (EP,US); H01L2924/1434 (EP,US);
H01L2924/15311 (EP,US); H01L2924/15313 (EP,US); H05K2201/10674 (EP,US);
H05K3/4682 (EP,US) (-)
C-Set:
H01L2224/131, H01L2924/014 (US,EP);
H01L2224/75743, H01L2924/00012 (US,EP);
H01L2224/81203, H01L2924/00014 (EP,US);
H01L2224/97, H01L2224/81 (US,EP)
Former IPC [2017/30]H01L23/48
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2017/30]
Extension statesBANot yet paid
MENot yet paid
TitleGerman:HALBLEITERGEHÄUSE MIT EINGEBETTETEN BRÜCKENVERBINDUNGEN[2017/30]
English:SEMICONDUCTOR PACKAGES WITH EMBEDDED BRIDGE INTERCONNECTS[2017/30]
French:BOÎTIERS DE SEMICONDUCTEUR AVEC INTERCONNEXIONS EN PONT INTÉGRÉES[2017/30]
Entry into regional phase07.02.2017National basic fee paid 
07.02.2017Search fee paid 
07.02.2017Designation fee(s) paid 
07.02.2017Examination fee paid 
Examination procedure07.02.2017Examination requested  [2017/30]
07.02.2017Date on which the examining division has become responsible
22.10.2018Amendment by applicant (claims and/or description)
18.06.2020Communication of intention to grant the patent
16.10.2020Fee for grant paid
16.10.2020Fee for publishing/printing paid
16.10.2020Receipt of the translation of the claim(s)
Opposition(s)26.08.2021No opposition filed within time limit [2021/44]
Fees paidRenewal fee
07.02.2017Renewal fee patent year 03
12.09.2017Renewal fee patent year 04
11.09.2018Renewal fee patent year 05
13.09.2019Renewal fee patent year 06
14.09.2020Renewal fee patent year 07
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU19.09.2014
AL25.11.2020
AT25.11.2020
CY25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
ES25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
MC25.11.2020
MK25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
[2024/22]
Former [2023/30]HU19.09.2014
AL25.11.2020
AT25.11.2020
CY25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
ES25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
MC25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2023/27]HU19.09.2014
AL25.11.2020
AT25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
ES25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
MC25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2022/25]AL25.11.2020
AT25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
ES25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
MC25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2022/23]AL25.11.2020
AT25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
ES25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2022/10]AL25.11.2020
AT25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
ES25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
PT25.03.2021
Former [2022/08]AL25.11.2020
AT25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
ES25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/50]AL25.11.2020
AT25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SI25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/48]AL25.11.2020
AT25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
FI25.11.2020
HR25.11.2020
IT25.11.2020
LT25.11.2020
LV25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/45]AL25.11.2020
AT25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
FI25.11.2020
HR25.11.2020
LT25.11.2020
LV25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/37]AT25.11.2020
CZ25.11.2020
DK25.11.2020
EE25.11.2020
FI25.11.2020
HR25.11.2020
LT25.11.2020
LV25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/36]AT25.11.2020
CZ25.11.2020
EE25.11.2020
FI25.11.2020
HR25.11.2020
LT25.11.2020
LV25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/35]AT25.11.2020
CZ25.11.2020
FI25.11.2020
HR25.11.2020
LT25.11.2020
LV25.11.2020
PL25.11.2020
RO25.11.2020
RS25.11.2020
SE25.11.2020
SK25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/34]AT25.11.2020
CZ25.11.2020
FI25.11.2020
HR25.11.2020
LT25.11.2020
LV25.11.2020
PL25.11.2020
RS25.11.2020
SE25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/33]AT25.11.2020
FI25.11.2020
HR25.11.2020
LT25.11.2020
LV25.11.2020
PL25.11.2020
RS25.11.2020
SE25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/32]AT25.11.2020
FI25.11.2020
HR25.11.2020
LV25.11.2020
PL25.11.2020
RS25.11.2020
SE25.11.2020
SM25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/28]AT25.11.2020
FI25.11.2020
HR25.11.2020
LV25.11.2020
PL25.11.2020
RS25.11.2020
SE25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/25]AT25.11.2020
FI25.11.2020
LV25.11.2020
PL25.11.2020
RS25.11.2020
SE25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
IS25.03.2021
PT25.03.2021
Former [2021/23]AT25.11.2020
FI25.11.2020
LV25.11.2020
RS25.11.2020
SE25.11.2020
BG25.02.2021
NO25.02.2021
GR26.02.2021
PT25.03.2021
Former [2021/22]FI25.11.2020
RS25.11.2020
NO25.02.2021
PT25.03.2021
Former [2021/21]FI25.11.2020
PT25.03.2021
Former [2021/20]FI25.11.2020
Documents cited:Search[XAY]US2004183187  (YAMASAKI TOMOO [JP], et al) [X] 1,3,5,6,9-11 * figure 1 * [A] 13-15 [Y] 12;
 [Y]US2010288549  (CHIANG JEN-HUNG [TW], et al) [Y] 12 * figure 2 *;
 [XAY]US2012234589  (FURUICHI JUN [JP], et al) [X] 1,2,4-11 * figure 1 * [A] 13-15 [Y] 12;
 [A]US2014264791  (MANUSHAROW MATHEW J [US], et al) [A] 1-15* figure 1 *
International search[A]US2011215472  (CHANDRASEKARAN ARVIND [US]) [A] 1-25* See abstract, paragraphs [0008]-[0011] and figures 3-6. *;
 [A]US2013214432  (WU EPHREM C [US], et al) [A] 1-25 * See abstract, paragraphs [0004]-[0007] and figures 10A-11. *;
 [A]US2014070380  (CHIU CHIA-PIN [US], et al) [A] 1-25 * See abstract, paragraphs [0024]-[0058] and figures 1-3. *;
 [A]US2014159850  (ROY MIHIR K [US], et al) [A] 1-25 * See abstract, paragraph [0018] and figure 2. *;
 [A]US2014175636  (ROY MIHIR K [US], et al) [A] 1-25 * See abstract, claim 1 and figure 2. *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.