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EP3010045
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EP About this file: EP3010045
| EP3010045 - SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING SAME [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 04.01.2019 Database last updated on 26.03.2026 | |
| Former | Examination is in progress Status updated on 19.10.2018 | Most recent event Tooltip | 04.01.2019 | Withdrawal of application | published on 06.02.2019 [2019/06] | Applicant(s) | For all designated states Hitachi, Ltd. 6-6 Marunouchi 1-chome Chiyoda-ku Tokyo 100-8280 / JP | For all designated states Hitachi Power Semiconductor Device, Ltd. 2-2 Omika-cho 5-chome Hitachi-shi, Ibaraki 319-1221 / JP | [2016/16] | Inventor(s) | 01 /
HASEGAWA, Jiro c/o Hitachi Power Semiconductor Device, Ltd. 2-2, Omika-cho 5-chome, Hitachi-shi Ibaraki, 319-1221 / JP | 02 /
TOYOTA, Yoshiaki c/o Hitachi, Ltd. 6-6, Marunouchi 1-chome, Chiyoda-ku Tokyo, 100-8280 / JP | [2016/16] | Representative(s) | MERH-IP Matias Erny Reichl Hoffmann Patentanwälte PartG mbB Paul-Heyse-Straße 29 80336 München / DE | [N/P] |
| Former [2016/16] | MERH-IP Matias Erny Reichl Hoffmann Patentanwälte PartG mbB Paul-Heyse-Strasse 29 80336 München / DE | Application number, filing date | 15189734.5 | 14.10.2015 | [2016/16] | Priority number, date | JP20140209618 | 14.10.2014 Original published format: JP 2014209618 | [2016/16] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP3010045 | Date: | 20.04.2016 | Language: | EN | [2016/16] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 11.03.2016 | Classification | IPC: | H01L29/861, H01L21/329, H01L29/06, H01L29/24 | [2016/16] | CPC: |
H10D62/105 (EP,US);
H10P14/3408 (US);
H10D62/106 (EP,US);
H10D62/112 (EP,US);
H10D62/8325 (EP,US);
H10D8/043 (EP);
H10D8/051 (US);
H10D8/411 (EP,US);
H10P14/6308 (US);
H10P14/6322 (US);
H10P14/6334 (US);
H10P14/69215 (US);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2016/16] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | MA | Not yet paid | Title | German: | HALBLEITERBAUELEMENT UND VERFAHREN ZUR HERSTELLUNG DAVON | [2016/16] | English: | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING SAME | [2016/16] | French: | DISPOSITIF SEMI-CONDUCTEUR ET SON PROCÉDÉ DE FABRICATION | [2016/16] | Examination procedure | 15.01.2016 | Examination requested [2016/16] | 20.10.2016 | Amendment by applicant (claims and/or description) | 17.10.2018 | Despatch of a communication from the examining division (Time limit: M04) | 03.01.2019 | Application withdrawn by applicant [2019/06] | Fees paid | Renewal fee | 02.11.2017 | Renewal fee patent year 03 | 31.10.2018 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XI] US2013149850 (WADA KEIJI et al.) | [X] US2010163888 (SAGGIO MARIO GIUSEPPE et al.) | [XI] EP1873839 (TOSHIBA KK et al.) [X] 1-4,6,7 * paragraphs [0035] - [0049]; figures 1-8 *[I] 5 | [X] US2011193101 (YANASE NAOKO et al.) [X] 1,5,7 * paragraphs [0035] - [0046] * | [X] US2007001176 (WARD ALLAN III et al.) [X] 1-7 * paragraphs [0021] - [0031] * | by applicant | JPH11330496 | JP2013042054 |