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Extract from the Register of European Patents

EP About this file: EP3174643

EP3174643 - INTRAVASCULAR ULTRASOUND IMAGING APPARATUS, INTERFACE ARCHITECTURE, AND METHOD OF MANUFACTURING [Right-click to bookmark this link]
StatusThe patent has been granted
Status updated on  15.03.2024
Database last updated on 11.09.2024
FormerGrant of patent is intended
Status updated on  16.11.2023
FormerExamination is in progress
Status updated on  25.02.2020
FormerRequest for examination was made
Status updated on  15.06.2017
FormerThe international publication has been made
Status updated on  11.01.2017
Most recent event   Tooltip15.03.2024(Expected) grantpublished on 17.04.2024  [2024/16]
Applicant(s)For all designated states
Koninklijke Philips N.V.
High Tech Campus 52
5656 AG Eindhoven / NL
For all designated states
Philips Image Guided Therapy Corporation
3721 Valley Centre Drive, Suite 500
San Diego CA 92130 / US
[2021/04]
Former [2020/12]For all designated states
Koninklijke Philips N.V.
High Tech Campus 52
5656 AG Eindhoven / NL
For all designated states
Volcano Corporation
3721 Valley Center Drive
Suite 500
San Diego, CA 92130 / US
Former [2017/23]For all designated states
Koninklijke Philips N.V.
High Tech Campus 5
5656 AE Eindhoven / NL
For all designated states
Volcano Corporation
3721 Valley Center Drive
Suite 500
San Diego, CA 92130 / US
Inventor(s)01 / CORL, Paul Douglas
c/o High Tech Campus
Building 5
NL-5656 AE Eindhoven / NL
 [2017/23]
Representative(s)Philips Intellectual Property & Standards
High Tech Campus 52
5656 AG Eindhoven / NL
[2024/16]
Former [2017/23]Steffen, Thomas
Philips Intellectual Property & Standards
High Tech Campus 5
5656 AE Eindhoven / NL
Application number, filing date15760268.129.07.2015
[2017/23]
WO2015IB55704
Priority number, dateUS201462032368P01.08.2014         Original published format: US 201462032368 P
[2017/23]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2016016810
Date:04.02.2016
Language:EN
[2016/05]
Type: A1 Application with search report 
No.:EP3174643
Date:07.06.2017
Language:EN
The application published by WIPO in one of the EPO official languages on 04.02.2016 takes the place of the publication of the European patent application.
[2017/23]
Type: B1 Patent specification 
No.:EP3174643
Date:17.04.2024
Language:EN
[2024/16]
Search report(s)International search report - published on:EP04.02.2016
ClassificationIPC:A61B8/08, A61B8/00, A61B8/12, B06B1/06
[2023/50]
CPC:
A61B8/12 (EP,US); A61B8/445 (EP,US); A61B8/4494 (EP,US);
A61B8/5207 (EP,US); B06B1/0633 (EP,US); A61B8/56 (EP,US)
Former IPC [2017/23]B06B1/06, A61B8/00, A61B8/12
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2017/23]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
TitleGerman:INTRAVASKULÄRE ULTRASCHALLBILDGEBUNGSVORRICHTUNG, SCHNITTSTELLENARCHITEKTUR UND VERFAHREN ZUR HERSTELLUNG[2017/23]
English:INTRAVASCULAR ULTRASOUND IMAGING APPARATUS, INTERFACE ARCHITECTURE, AND METHOD OF MANUFACTURING[2017/23]
French:APPAREIL D'IMAGERIE ÉCHOGRAPHIQUE INTRAVASCULAIRE, ARCHITECTURE D'INTERFACE, ET PROCÉDÉ DE FABRICATION[2017/23]
Entry into regional phase01.03.2017National basic fee paid 
01.03.2017Designation fee(s) paid 
01.03.2017Examination fee paid 
Examination procedure11.01.2017Amendment by applicant (claims and/or description)
11.01.2017Date on which the examining division has become responsible
01.03.2017Examination requested  [2017/23]
28.02.2020Despatch of a communication from the examining division (Time limit: M04)
12.06.2020Reply to a communication from the examining division
12.04.2021Despatch of a communication from the examining division (Time limit: M04)
21.07.2021Reply to a communication from the examining division
17.11.2021Despatch of a communication from the examining division (Time limit: M04)
21.03.2022Reply to a communication from the examining division
02.08.2022Despatch of a communication from the examining division (Time limit: M04)
28.11.2022Reply to a communication from the examining division
12.04.2023Despatch of a communication from the examining division (Time limit: M06)
06.10.2023Reply to a communication from the examining division
17.11.2023Communication of intention to grant the patent
06.03.2024Fee for grant paid
06.03.2024Fee for publishing/printing paid
06.03.2024Receipt of the translation of the claim(s)
Fees paidRenewal fee
31.07.2017Renewal fee patent year 03
31.07.2018Renewal fee patent year 04
31.07.2019Renewal fee patent year 05
31.07.2020Renewal fee patent year 06
02.08.2021Renewal fee patent year 07
01.08.2022Renewal fee patent year 08
31.07.2023Renewal fee patent year 09
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Cited inInternational search[A]US2005146247  (FISHER RAYETTE A [US], et al) [A] 1,13,23 * paragraph [0034] - paragraph [0050] * * paragraph [0062] *;
 [YA]US2007264732  (CHEN JINGKUANG [US]) [Y] 8,15 * paragraph [0025] * [A] 27;
 [XYI]US2010262014  (HUANG YONGLI [US]) [X] 1-4,7,9,10,13,14,16-19,22-26,29-31 * paragraph [0031] - paragraph [0060] * * figures 1-4, 13-16 * [Y] 5,6,8,11,12,15,20,21,32 [I] 27,28;
 [Y]US2010280388  (HUANG YONGLI [US]) [Y] 6 * figure 9 *;
 [YD]US7846101  (EBERLE MICHAEL J [US], et al) [YD] 5,11,12,20,32 * column 7, line 12 - line 27 * * figure 2 * * column 10, line 5 - line 33 *;
 [A]US2013310679  (NATARAJAN SHYAM [US], et al) [A] 1,5,13,20,23* paragraph [0066] - paragraph [0067] *;
 [Y]  - Don Isarakorn, "POUR L'OBTENTION DU GRADE DE DOCTEUR ÈS SCIENCES acceptée sur proposition du jury: Epitaxial Piezoelectric MEMS on Silicon", Thèse N. 4939(2011) - Faculté sciences at techniques de l'ingénieur - Ecole Polytechnique Fédérale de Lausanne, (20110126), URL: http://infoscience.epfl.ch/record/155040/files/EPFL_TH4939.pdf, (20151023), XP055223303 [Y] 21 * page 94, line 19 - line 21 *
 [A]  - XUEFENG ZHUANG ET AL, "Fabrication of Flexible Transducer Arrays With Through-Wafer Electrical Interconnects Based on Trench Refilling With PDMS", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, IEEE SERVICE CENTER, US, (20080401), vol. 17, no. 2, ISSN 1057-7157, pages 446 - 452, XP011206589 [A] 25 * paragraph [0001] *
 [A]  - WONG K A ET AL, "Curved micromachined ultrasonic transducers", 2003 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS. HONOLULU, HAWAII, OCT. 5 - 8, 2003; [IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS], NEW YORK, NY : IEEE, US, (20031005), vol. 1, doi:10.1109/ULTSYM.2003.1293468, ISBN 978-0-7803-7922-0, pages 572 - 576, XP010702127 [A] 25,26 * paragraph [0003] - paragraph [0004] *

DOI:   http://dx.doi.org/10.1109/ULTSYM.2003.1293468
by applicantUS6641540
 US6776763
 US7226417
 US7846101
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.