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Extract from the Register of European Patents

EP About this file: EP3198634

EP3198634 - MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND METHOD OF WAFER TRANSFER FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) INTEGRATION [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  02.10.2020
Database last updated on 18.09.2024
FormerRequest for examination was made
Status updated on  30.06.2017
FormerThe international publication has been made
Status updated on  17.02.2017
Most recent event   Tooltip02.10.2020Application deemed to be withdrawnpublished on 04.11.2020  [2020/45]
Applicant(s)For all designated states
Qualcomm Incorporated
5775 Morehouse Drive
San Diego, CA 92121-1714 / US
[2017/31]
Inventor(s)01 / LAN, Je-Hsiung Jeffrey
QUALCOMM Incorporated
5775 Morehouse Drive
San Diego, California 92121-1714 / US
02 / ZHANG, Wenyue
QUALCOMM Incorporated
5775 Morehouse Drive
San Diego, California 92121-1714 / US
03 / DU, Yang
QUALCOMM Incorporated
5775 Morehouse Drive
San Diego, California 92121-1714 / US
04 / LEE, Yong Ju
QUALCOMM Incorporated
5775 Morehouse Drive
San Diego, California 92121-1714 / US
05 / GU, Shiqun
QUALCOMM Incorporated
5775 Morehouse Drive
San Diego, California 92121-1714 / US
06 / XIE, Jing
QUALCOMM Incorporated
5775 Morehouse Drive
San Diego, California 92121-1714 / US
 [2017/31]
Representative(s)Dunlop, Hugh Christopher, et al
Maucher Jenkins
Seventh Floor Offices
Artillery House
11-19 Artillery Row
London SW1P 1RT / GB
[N/P]
Former [2017/31]Dunlop, Hugh Christopher, et al
Maucher Jenkins
26 Caxton Street
London SW1H 0RJ / GB
Application number, filing date15767645.308.09.2015
[2017/31]
WO2015US48930
Priority number, dateUS20141449896526.09.2014         Original published format: US201414498965
[2017/31]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2016048649
Date:31.03.2016
Language:EN
[2016/13]
Type: A1 Application with search report 
No.:EP3198634
Date:02.08.2017
Language:EN
The application published by WIPO in one of the EPO official languages on 31.03.2016 takes the place of the publication of the European patent application.
[2017/31]
Search report(s)International search report - published on:EP31.03.2016
ClassificationIPC:H01L21/822, H01L21/683, H01L27/06
[2017/31]
CPC:
H01L21/6835 (EP,CN,KR,US); H01L21/8221 (EP,CN,KR,US); H01L25/0657 (CN,KR,US);
H01L21/02164 (CN,KR,US); H01L21/265 (CN,KR,US); H01L21/76254 (CN,KR,US);
H01L21/76802 (CN,KR,US); H01L21/76877 (CN,KR,US); H01L23/5226 (CN,KR,US);
H01L23/528 (CN,KR,US); H01L25/50 (CN,KR,US); H01L27/0688 (EP,CN,US);
H01L2221/68318 (EP,CN,US); H01L2221/68363 (EP,CN,US); H01L2221/68381 (EP,CN,US);
H01L2225/06541 (CN,US); H01L2924/00 (CN); H01L2924/0002 (EP,CN,US) (-)
C-Set:
H01L2924/0002, H01L2924/00 (CN,EP,US)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2017/31]
TitleGerman:BINDUNGSFREIGABESTRUKTUR EINES MIKROELEKTROMECHANISCHEN SYSTEMS UND VERFAHREN FÜR WAFERTRANSFER ZUR INTEGRATION EINER DREIDIMENSIONALEN INTEGRIERTEN SCHALTUNG[2017/31]
English:MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND METHOD OF WAFER TRANSFER FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) INTEGRATION[2017/31]
French:STRUCTURE DE LIBÉRATION DE LIAISON DE MICROSYSTÈME ÉLECTROMÉCANIQUE (MEMS) ET PROCÉDÉ DE TRANSFERT DE TRANCHE DE TRANCHE POUR INTÉGRATION DE CIRCUIT INTÉGRÉ TRIDIMENSIONNEL (CI 3D)[2017/31]
Entry into regional phase16.02.2017National basic fee paid 
16.02.2017Designation fee(s) paid 
16.02.2017Examination fee paid 
Examination procedure26.07.2016Request for preliminary examination filed
International Preliminary Examining Authority: EP
16.02.2017Examination requested  [2017/31]
16.02.2017Date on which the examining division has become responsible
20.11.2017Amendment by applicant (claims and/or description)
03.06.2020Application deemed to be withdrawn, date of legal effect  [2020/45]
25.06.2020Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2020/45]
Fees paidRenewal fee
11.07.2017Renewal fee patent year 03
11.09.2018Renewal fee patent year 04
Penalty fee
Additional fee for renewal fee
30.09.201905   M06   Not yet paid
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited inInternational search[XI]US2007135013  (FARIS SADEG M [US]) [X] 1,4-6,8-12,14 * paragraphs [0183] , [0184] , [0199] - [0201] - [0203] - [0205] - [0208] , [0211] , [0301]; figures 8,121 * [I] 2,3,7,13,15-20;
 [XYI]US2014264770  (OKANDAN MURAT [US], et al) [X] 1-3,9-11 * paragraphs [0022] , [0025] , [0039] , [0040]; figure 2A * [Y] 4-8,16-20 [I] 12,13,15;
 [XYI]US2007254455  (YAMAGUCHI MAYUMI [JP], et al) [X] 1-3,9-13,15,21,22,25,27,31,34,35,37-40 * paragraphs [0081] - [0089] - [0 92] , [ 114] , [ 117] , [ 130]; figures 4, 5C, 6A, 8B, 9B * [Y] 4-8 [I] 14,23,24,36;
 [X]US8729673  (OKANDAN MURAT [US], et al) [X] 1-3,9-11,16 * column 4, line 52 - column 5, line 57; figures 2A-2C * * column 6, line 13 - line 16 *;
 [A]US2002171080  (FARIS SADEG M [US]) [A] 4-8 * paragraph [0050]; figures 8, 14-17 *;
 [Y]US2013214423  (SADAKA MARIAM [US]) [Y] 4-8,16-20 * paragraphs [0033] , [0037] , [0038]; figure 1 *;
 [XI]US2009294814  (ASSEFA SOLOMON [US], et al) [X] 21,22,29-31 * paragraphs [0019] , [0039] - [0046]; figures 3, 5D * [I] 23,24;
 [XI]US2008291767  (BARNES JOSEPH S [US], et al) [X] 21,22,25,27,29,31,37,38 * paragraphs [0070] , [0074] , [0075] , [0079] , [0080]; figures 8C, 8D * [I] 23,24;
 [X]US2012193752  (PURUSHOTHAMAN SAMPATH [US], et al) [X] 21-33,37,38 * paragraphs [0010] , [0028] , [0035] , [0043] , [0046] , [0049]; figures 1, 2, 6, 8, 9, 12, 13 *;
 [X]US2001005059  (KOYANAGI MITSUMASA [JP], et al) [X] 21,22,27,28,30,31,37,38 * paragraphs [0084] , [0093] , [0096]; figures 6, 10 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.