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Extract from the Register of European Patents

EP About this file: EP3241075

EP3241075 - STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES [Right-click to bookmark this link]
StatusGrant of patent is intended
Status updated on  22.05.2024
Database last updated on 29.06.2024
FormerExamination is in progress
Status updated on  05.11.2021
FormerRequest for examination was made
Status updated on  06.10.2017
FormerThe international publication has been made
Status updated on  14.07.2017
Most recent event   Tooltip22.05.2024New entry: Communication of intention to grant a patent 
Applicant(s)For all designated states
FUJIFILM Electronic Materials U.S.A., Inc.
80 Circuit Drive
North Kingstown, RI 02852 / US
[2024/25]
Former [2017/45]For all designated states
FujiFilm Electronic Materials USA, Inc.
80 Circuit Drive
North Kingstown, RI 02852 / US
Inventor(s)01 / DU, Bing
1212 East Canyon Creek Drive
Gilbert, Arizona 85295 / US
02 / DORY, Thomas
832 W. Rawhide Ave.
Gilbert, Arizona 85233 / US
03 / WOJTCZAK, William A.
6803 Rio Bravo Lane
Austin, Texas 78737 / US
 [2017/45]
Representative(s)Fish & Richardson P.C.
Highlight Business Towers
Mies-van-der-Rohe-Straße 8
80807 München / DE
[N/P]
Former [2017/45]Conroy, John
Fish & Richardson P.C.
Highlight Business Towers
Mies-van-der-Rohe-Straße 8
80807 München / DE
Application number, filing date15876079.328.12.2015
[2017/45]
WO2015US67592
Priority number, dateUS201462097747P30.12.2014         Original published format: US 201462097747 P
[2017/45]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2016109387
Date:07.07.2016
Language:EN
[2016/27]
Type: A1 Application with search report 
No.:EP3241075
Date:08.11.2017
Language:EN
The application published by WIPO in one of the EPO official languages on 07.07.2016 takes the place of the publication of the European patent application.
[2017/45]
Search report(s)International search report - published on:US07.07.2016
(Supplementary) European search report - dispatched on:EP12.06.2018
ClassificationIPC:G03F7/42, H01L21/311, C11D3/00, C11D3/28, C11D3/30, C11D7/26, C11D7/32, C11D3/20, C11D3/43
[2024/23]
CPC:
H01L21/31133 (EP,US); G03F7/42 (KR); G03F7/423 (EP,US);
C11D3/0026 (EP,KR,US); C11D3/2006 (EP,KR,US); C11D3/28 (EP,US);
C11D3/30 (EP,KR,US); C11D3/43 (EP,KR,US); C11D7/261 (EP,US);
C11D7/3209 (EP,US); C11D7/3281 (EP,US); C11D7/5009 (US);
C11D7/5013 (US); C11D7/5022 (US); G03F7/425 (EP,US);
G03F7/426 (EP,US); C11D2111/22 (EP,KR,US) (-)
Former IPC [2018/28]G03F7/32, C11D3/00, C11D3/20, C11D3/43, G03F7/42
Former IPC [2017/45]G03F7/32
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2017/45]
TitleGerman:ABLÖSEZUSAMMENSETZUNGEN ZUR FOTOLACKENTFERNUNG VON HALBLEITERSUBSTRATEN[2017/45]
English:STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES[2017/45]
French:COMPOSITIONS DE DÉCAPAGE POUR DÉTACHER DES PHOTORÉSINES DE SUBSTRATS SEMI-CONDUCTEURS[2017/45]
Entry into regional phase14.07.2017National basic fee paid 
14.07.2017Search fee paid 
14.07.2017Designation fee(s) paid 
14.07.2017Examination fee paid 
Examination procedure14.07.2016Date on which the examining division has become responsible
14.07.2017Examination requested  [2017/45]
04.01.2019Amendment by applicant (claims and/or description)
09.11.2021Despatch of a communication from the examining division (Time limit: M04)
08.03.2022Reply to a communication from the examining division
23.05.2024Communication of intention to grant the patent
Fees paidRenewal fee
27.12.2017Renewal fee patent year 03
31.12.2018Renewal fee patent year 04
27.12.2019Renewal fee patent year 05
28.12.2020Renewal fee patent year 06
27.12.2021Renewal fee patent year 07
27.12.2022Renewal fee patent year 08
27.12.2023Renewal fee patent year 09
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[Y]EP0742493  (OCG MICROELECTRONIC MATERIALS [US]) [Y] 8-10 * page § 14 *;
 [XYI]WO2006074316  (ADVANCED TECH MATERIALS [US], et al) [X] 1-6,11-15 * Formulation G; paragraphs [0031] , [0032]; claims 1-20 * [Y] 8-10 [I] 1,7;
 [Y]WO2007053363  (DYNALOY LLC [US], et al) [Y] 8-10 * page 7, line 31 - page 8, line 20 *;
 [I]EP2199379  (AIR PROD & CHEM [US]) [I] 1-15 * paragraphs [0002] , [0005] - [0009] - [0015] - [0017] - [0048] - [0051] - [0064]; claims 1-15 *;
 [Y]WO2012166902  (AVANTOR PERFORMANCE MAT INC [US], et al) [Y] 8-10 * paragraph [0018] *;
 [Y]US2013334679  (ATKINSON JOHN [US], et al) [Y] 8-10 * paragraphs [0002] , [0007] , [0009] , [0012] , [0021]; example 4; claims 1-24; tables I-VI *;
 [Y]US2014142017  (PETERS RICHARD DALTON [US], et al) [Y] 8-10* paragraphs [0026] , [0027] *
International search[A]US5139607  (WARD IRL E [US], et al) [A] 1-27* entire document *;
 [Y]US2005153059  (WAKIZAKA YASUHIRO [JP]) [Y] 17-21, (24-27)/(17-21) * para [0002], [0004], [0093], [0136], [0144] *;
 [Y]US2005287480  (TAKASHIMA MASAYUKI [JP]) [Y] 14-22, (24-27)/(14-22) * para [0005], [0017] *;
 [A]US2006063687  (MINSEK DAVID W [US], et al) [A] 1-27 * entire document *;
 [A]WO2010091045  (ADVANCED TECH MATERIALS [US], et al) [A] 1-27 * entire document *;
 [XY]US2012042898  (VISINTIN PAMELA M [US], et al) [X] 1-13, 23, (24-27)/(1-13, 23) * para [0005], [0008], [0009], [0015], [0023], [0043], [0051] * [Y] 14-22, (24-27)/(14-22);
 [A]US2013334679  (ATKINSON JOHN [US], et al) [A] 1-27 * entire document *
by applicantEP0742493
 US6717019
 US2005153059
 US2005287480
 WO2006074316
 WO2007053363
 EP2199379
 WO2012166902
 US2013334679
 US2014142017
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.