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Extract from the Register of European Patents

EP About this file: EP3306656

EP3306656 - SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  12.02.2021
Database last updated on 03.10.2024
FormerThe patent has been granted
Status updated on  28.02.2020
FormerGrant of patent is intended
Status updated on  02.01.2020
FormerExamination is in progress
Status updated on  15.05.2019
FormerRequest for examination was made
Status updated on  09.03.2018
FormerThe international publication has been made
Status updated on  09.12.2016
Most recent event   Tooltip08.07.2022Lapse of the patent in a contracting state
New state(s): MK		published on 10.08.2022  [2022/32]
Applicant(s)For all designated states
Shindengen Electric Manufacturing Co., Ltd.
2-1 Ohtemachi 2-chome Chiyoda-ku
Tokyo 100-0004 / JP
[2018/15]
Inventor(s)01 / SASAKI, Mitsumasa
c/o SHINDENGEN ELECTRIC MANUFACTURING CO. LTD.
Factory
10-13 Minami-cho
Hanno-shi Saitama 357-8585 / JP
 [2018/15]
Representative(s)Dr. Weitzel & Partner
Patent- und Rechtsanwälte mbB
Friedenstrasse 10
89522 Heidenheim / DE
[2018/15]
Application number, filing date15894083.329.05.2015
[2018/15]
WO2015JP65584
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2016194048
Date:08.12.2016
Language:JA
[2016/49]
Type: A1 Application with search report 
No.:EP3306656
Date:11.04.2018
Language:EN
[2018/15]
Type: B1 Patent specification 
No.:EP3306656
Date:01.04.2020
Language:EN
[2020/14]
Search report(s)International search report - published on:JP08.12.2016
(Supplementary) European search report - dispatched on:EP04.10.2018
ClassificationIPC:H02M7/00, H01L23/04, H01L23/495, H01L25/11, H02K11/04, H02K11/33, H02K11/38
[2018/44]
CPC:
H01L23/10 (EP); H02K11/30 (US); H01L23/04 (US);
H01L23/12 (US); H01L23/13 (EP); H01L23/28 (US);
H01L23/49541 (US); H01L25/07 (US); H01L25/115 (US);
H01L25/18 (EP,US); H02K11/00 (US); H02K11/33 (US);
H02K11/38 (US); H02K5/225 (US); H02M7/003 (EP,US);
H01L25/10 (EP); H01L25/16 (EP) (-)
Former IPC [2018/15]H01L23/28, H01L25/07, H01L25/18, H02K11/00
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2018/15]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
TitleGerman:HALBLEITERBAUELEMENT UND VERFAHREN ZUR MONTAGE DES HALBLEITERBAUELEMENTS[2018/15]
English:SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE[2018/15]
French:DISPOSITIF À SEMI-CONDUCTEUR ET PROCÉDÉ DE MONTAGE DE DISPOSITIF À SEMI-CONDUCTEUR[2018/15]
Entry into regional phase21.11.2017Translation filed 
21.11.2017National basic fee paid 
21.11.2017Search fee paid 
21.11.2017Designation fee(s) paid 
21.11.2017Examination fee paid 
Examination procedure20.10.2015Request for preliminary examination filed
International Preliminary Examining Authority: JP
21.11.2017Examination requested  [2018/15]
21.11.2017Date on which the examining division has become responsible
08.01.2019Amendment by applicant (claims and/or description)
20.05.2019Despatch of a communication from the examining division (Time limit: M04)
05.07.2019Reply to a communication from the examining division
03.01.2020Communication of intention to grant the patent
19.02.2020Fee for grant paid
19.02.2020Fee for publishing/printing paid
19.02.2020Receipt of the translation of the claim(s)
Opposition(s)12.01.2021No opposition filed within time limit [2021/11]
Fees paidRenewal fee
21.11.2017Renewal fee patent year 03
28.05.2018Renewal fee patent year 04
29.05.2019Renewal fee patent year 05
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU29.05.2015
AL01.04.2020
AT01.04.2020
CY01.04.2020
CZ01.04.2020
DK01.04.2020
EE01.04.2020
ES01.04.2020
FI01.04.2020
HR01.04.2020
IT01.04.2020
LT01.04.2020
LV01.04.2020
MC01.04.2020
MK01.04.2020
MT01.04.2020
NL01.04.2020
PL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SI01.04.2020
SK01.04.2020
SM01.04.2020
TR01.04.2020
IE29.05.2020
LU29.05.2020
BE31.05.2020
CH31.05.2020
LI31.05.2020
FR01.06.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
PT17.08.2020
[2022/32]
Former [2022/27]HU29.05.2015
AL01.04.2020
AT01.04.2020
CY01.04.2020
CZ01.04.2020
DK01.04.2020
EE01.04.2020
ES01.04.2020
FI01.04.2020
HR01.04.2020
IT01.04.2020
LT01.04.2020
LV01.04.2020
MC01.04.2020
MT01.04.2020
NL01.04.2020
PL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SI01.04.2020
SK01.04.2020
SM01.04.2020
TR01.04.2020
IE29.05.2020
LU29.05.2020
BE31.05.2020
CH31.05.2020
LI31.05.2020
FR01.06.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
PT17.08.2020
Former [2021/23]AL01.04.2020
AT01.04.2020
CZ01.04.2020
DK01.04.2020
EE01.04.2020
ES01.04.2020
FI01.04.2020
HR01.04.2020
IT01.04.2020
LT01.04.2020
LV01.04.2020
MC01.04.2020
NL01.04.2020
PL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SI01.04.2020
SK01.04.2020
SM01.04.2020
IE29.05.2020
LU29.05.2020
BE31.05.2020
CH31.05.2020
LI31.05.2020
FR01.06.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
PT17.08.2020
Former [2021/20]AL01.04.2020
AT01.04.2020
CZ01.04.2020
DK01.04.2020
EE01.04.2020
ES01.04.2020
FI01.04.2020
HR01.04.2020
IT01.04.2020
LT01.04.2020
LV01.04.2020
MC01.04.2020
NL01.04.2020
PL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SK01.04.2020
SM01.04.2020
IE29.05.2020
LU29.05.2020
CH31.05.2020
LI31.05.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
PT17.08.2020
Former [2021/15]AL01.04.2020
AT01.04.2020
CZ01.04.2020
DK01.04.2020
EE01.04.2020
ES01.04.2020
FI01.04.2020
HR01.04.2020
IT01.04.2020
LT01.04.2020
LV01.04.2020
MC01.04.2020
NL01.04.2020
PL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SK01.04.2020
SM01.04.2020
LU29.05.2020
CH31.05.2020
LI31.05.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
PT17.08.2020
Former [2021/10]AL01.04.2020
AT01.04.2020
CZ01.04.2020
DK01.04.2020
EE01.04.2020
ES01.04.2020
FI01.04.2020
HR01.04.2020
IT01.04.2020
LT01.04.2020
LV01.04.2020
MC01.04.2020
NL01.04.2020
PL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SK01.04.2020
SM01.04.2020
CH31.05.2020
LI31.05.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
PT17.08.2020
Former [2021/09]AL01.04.2020
AT01.04.2020
CZ01.04.2020
DK01.04.2020
EE01.04.2020
ES01.04.2020
FI01.04.2020
HR01.04.2020
IT01.04.2020
LT01.04.2020
LV01.04.2020
MC01.04.2020
NL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SM01.04.2020
CH31.05.2020
LI31.05.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
PT17.08.2020
Former [2021/08]AL01.04.2020
CZ01.04.2020
DK01.04.2020
ES01.04.2020
FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
NL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SM01.04.2020
CH31.05.2020
LI31.05.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
PT17.08.2020
Former [2021/04]AL01.04.2020
CZ01.04.2020
FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
NL01.04.2020
RS01.04.2020
SE01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
PT17.08.2020
Former [2020/51]CZ01.04.2020
FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
NL01.04.2020
RS01.04.2020
SE01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
PT17.08.2020
Former [2020/50]CZ01.04.2020
FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
NL01.04.2020
SE01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
PT17.08.2020
Former [2020/49]CZ01.04.2020
FI01.04.2020
LT01.04.2020
NL01.04.2020
SE01.04.2020
BG01.07.2020
NO01.07.2020
IS01.08.2020
PT17.08.2020
Former [2020/48]FI01.04.2020
LT01.04.2020
NL01.04.2020
SE01.04.2020
BG01.07.2020
NO01.07.2020
IS01.08.2020
PT17.08.2020
Former [2020/47]LT01.04.2020
BG01.07.2020
NO01.07.2020
IS01.08.2020
Former [2020/46]BG01.07.2020
IS01.08.2020
Former [2020/39]BG01.07.2020
Documents cited:Search[Y]US5737210  (BARAHIA MANOJ M [US]) [Y] 5,7,8 * column 4, lines 8-14; figures 2,3,5 *;
 [XY]EP1234761  (YAMAHA MOTOR CO LTD [JP]) [X] 1-4,6 * paragraph [0075]; figure 4 * [Y] 5,7,8;
 [Y]EP1758165  (SEMIKRON ELEKTRONIK GMBH [DE]) [Y] 5,7,8* paragraph [0019]; figures 1,2 *;
 [Y]US7190070  (MANZ YVONE [DE], et al) [Y] 5,7,8 * column 3, lines 58-67; figures 2-7 * * column 4, lines 20-29,40-50 *;
 [Y]CN102207269  (PANASONIC ELECTRIC WORKS TATSUNO CO LTD) [Y] 5,7,8 * abstract *
International search[YA]JPS5961090  (FUJITSU LTD, et al) [Y] 1-4, 6, 7 * , page 2, upper left column, line 4 to lower left column, line 4; fig. 3 to 5 (Family: none) * [A] 5;
 [A]JP2013188027  (NISSAN MOTOR) [A] 1-7* , entire text; all drawings & US 2015/0097470 A1 & WO 2013/133014 A1 & EP 2824820 A & CN 104205599 A *;
 [YA]JP2014183615  (DENSO CORP) [Y] 1-4, 6, 7 * , paragraphs [0017] to [0023]; fig. 3 (Family: none) * [A] 5
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.