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Extract from the Register of European Patents

EP About this file: EP3226282

EP3226282 - NON-EUTECTIC BONDING METHOD WITH FORMATION OF A SOLID SOLUTION WITH A POROUS STRUCTURE WITH A SECOND PHASE DISPERSED THEREIN AND CORRESPONDING JOINT [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  28.01.2022
Database last updated on 24.08.2024
FormerRequest for examination was made
Status updated on  01.09.2017
Most recent event   Tooltip28.01.2022Application deemed to be withdrawnpublished on 02.03.2022  [2022/09]
Applicant(s)For all designated states
Techni Holding AS
Ynglevn. 42
3184 Borre / NO
[2017/40]
Inventor(s)01 / LARSSON, Andreas
Flåtansvingen 22A
N-3413 Lier / NO
02 / TOLLEFSEN, Torleif A.
Grevlingveien 7A
N-3029 Drammen / NO
 [2017/40]
Representative(s)Onsagers AS
P.O. Box 1813 Vika
0123 Oslo / NO
[N/P]
Former [2017/40]Onsagers AS
Munkedamsveien 35
P.O. Box 1813 Vika
0123 Oslo / NO
Application number, filing date16163263.331.03.2016
[2017/40]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP3226282
Date:04.10.2017
Language:EN
[2017/40]
Search report(s)(Supplementary) European search report - dispatched on:EP01.12.2016
ClassificationIPC:H01L21/58, H05K3/34, B23K20/02, B23K20/233, B23K35/26, B23K35/30
[2017/40]
CPC:
B23K35/26 (EP,GB,KR,NO,US); B23K20/02 (NO,US); H01L24/29 (EP,GB,KR,NO,US);
B23K20/026 (EP,GB,KR,NO,US); B23K20/233 (EP,GB,KR,NO,US); B23K35/3013 (EP,GB,KR,NO,US);
C22C19/00 (EP,GB,NO,US); C22C5/00 (EP,GB,NO,US); H01L23/4924 (KR);
H01L24/32 (EP,GB,KR,NO,US); H01L24/83 (EP,GB,KR,NO,US); H05K3/34 (KR,NO);
H01L2224/0345 (EP,GB,NO,US); H01L2224/03462 (EP,GB,NO,US); H01L2224/04026 (EP,GB,NO,US);
H01L2224/05082 (EP,GB,NO,US); H01L2224/05083 (EP,GB,NO,US); H01L2224/05155 (EP,GB,NO,US);
H01L2224/05187 (EP,GB,NO,US); H01L2224/05644 (EP,GB,NO,US); H01L2224/27462 (EP,GB,NO,US);
H01L2224/29109 (EP,GB,NO,US); H01L2224/29144 (EP,GB,NO,US); H01L2224/3201 (EP,GB,NO,US);
H01L2224/32503 (EP,GB,NO,US); H01L2224/83075 (EP,GB,NO,US); H01L2224/8309 (EP,GB,NO,US);
H01L2224/83101 (EP,GB,NO,US); H01L2224/83203 (EP,GB,NO,US); H01L2224/83444 (EP,GB,NO,US);
H01L2224/83455 (EP,GB,NO,US); H01L2224/8381 (EP,GB,NO,US); H01L2224/83825 (EP,GB,NO,US);
H01L2224/8383 (EP,GB,NO,US); H01L2224/83948 (EP,GB,NO,US); H01L2224/92 (EP,GB,NO,US);
H01L2224/94 (EP,GB,NO,US) (-)
C-Set:
H01L2224/0345, H01L2924/00014 (US,EP);
H01L2224/03462, H01L2924/00012 (EP,US);
H01L2224/05082, H01L2224/05644, H01L2224/05155, H01L2224/05187, H01L2924/048, H01L2924/01028 (US,EP);
H01L2224/05083, H01L2224/05644, H01L2224/05144, H01L2224/05155, H01L2224/05187, H01L2924/048, H01L2924/01028 (US,EP);
H01L2224/05155, H01L2924/01014 (US,EP);
H01L2224/05187, H01L2924/048, H01L2924/01028 (US,EP);
H01L2224/05644, H01L2924/00014 (US,EP);
H01L2224/27462, H01L2924/00012 (US,EP);
H01L2224/29109, H01L2924/00014 (EP,US);
H01L2224/29144, H01L2924/01032 (US,EP);
H01L2224/3201, H01L2924/00012 (EP,US);
H01L2224/83075, H01L2924/00014 (US,EP);
H01L2224/8309, H01L2924/00014 (EP,US);
H01L2224/83203, H01L2924/00012 (US,EP);
H01L2224/83444, H01L2924/00014 (US,EP);
H01L2224/83455, H01L2924/01015 (US,EP);
H01L2224/92, H01L2224/03, H01L2224/27, H01L21/78, H01L2224/83 (EP,US);
H01L2224/94, H01L2224/03 (EP,US);
H01L2224/94, H01L2224/27 (EP,US)
(-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2017/40]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TitleGerman:NICHT EUTEKTISCHES VERBINDUNGSVERFAHREN MIT BILDUNG EINES MISCHKRISTALLS MIT PORÖSER STRUKTUR MIT DARIN DISPERGIERTER ZWEITER PHASE UND ENTSPRECHENDE VERBINDUNG[2017/40]
English:NON-EUTECTIC BONDING METHOD WITH FORMATION OF A SOLID SOLUTION WITH A POROUS STRUCTURE WITH A SECOND PHASE DISPERSED THEREIN AND CORRESPONDING JOINT[2017/40]
French:PROCÉDÉ DE CONNEXION NON-EUTECTIQUE AVEC FORMATION D'UNE SOLUTION SOLIDE À STRUCTURE POREUSE AVEC UNE SECONDE PHASE Y DISPERSÉE ET JOINT CORRESPONDANT[2017/40]
Examination procedure31.03.2016Examination requested  [2017/40]
31.03.2016Date on which the examining division has become responsible
02.07.2018Amendment by applicant (claims and/or description)
01.10.2021Application deemed to be withdrawn, date of legal effect  [2022/09]
21.10.2021Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2022/09]
Request for further processing for:The application is deemed to be withdrawn due to failure to reply to the Extended European Search Report/Written Opinion of the International Searching Authority/International Preliminary Examination Report/Supplementary international search report/Supplementary European search report
02.07.2018Request for further processing filed
02.07.2018Full payment received (date of receipt of payment)
Request granted
25.07.2018Decision despatched
The application is deemed to be withdrawn due to failure to indicate the wish to proceed further with the application
02.07.2018Request for further processing filed
02.07.2018Full payment received (date of receipt of payment)
Request granted
25.07.2018Decision despatched
Fees paidRenewal fee
23.03.2018Renewal fee patent year 03
26.03.2019Renewal fee patent year 04
23.09.2020Renewal fee patent year 05
Penalty fee
Additional fee for renewal fee
31.03.202005   M06   Fee paid on   23.09.2020
31.03.202106   M06   Not yet paid
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 [Y]US2016027759  (PLÖSSL ANDREAS [DE]) [Y] 9 * paragraph [0028] - paragraph [0029] * * paragraph [0031] * * paragraph [0060] * * figure 6 *;
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DOI:   http://dx.doi.org/10.1007/s10853-013-7526-z
 [IY]  - WEYRICH N P, "Joining of metals and ceramics using Au-(Ge, Si)-based solder alloys, DISS. ETH NO. 22995", Zürich, doi:10.3929/ethz-a-010603255, (2015), URL: http://e-collection.library.ethz.ch/eserv/eth:48707/eth-48707-02.pdf, (20161115), XP055319566 [I] 2-8,11-17 * chapter 2.1, second paragraph; figure 2.1 * * chapter 2.1.3, first and eighth paragraph * * chapter 3.2, fourth paragraph; figure 3.1 * * chapter 3.3 * * chapter 3.4, first to fifth paragraph; figure 3.8 * * chapter 5.1, first paragraph * * chapters 5.4.1-5.4.3 * * chapter 5.4.4, second to fifth paragraph * * chapter 5.5, second paragraph * * chapters 6.2-6.3 * [Y] 9

DOI:   http://dx.doi.org/10.3929/ethz-a-010603255
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DOI:   http://dx.doi.org/10.1111/j.1744-7402.2012.02769.x
 [XY]  - ATTAL J ET AL, "Imaging interior planes by acoustic microscopy", TENTH INTERNATIONAL SYMPOSIUM ON ACOUSTICAL IMAGING, 12-16 OCTOBER 1980, CANNES, FRANCE, (1982), pages 803 - 815, XP009192457 [X] 2-8,11-16 * chapter 6 * * figures 4-5 * [Y] 17
 [XY]  - AKINS D ET AL, "Thermal Conductivity of Indium Bonded Silicon", (20150812), URL: http://www.phys.ufl.edu/ireu/IREU2015/pdf_reports/Dallas_Akins_Roma_Paola_Puppo_Paper.pdf, (20161115), XP055319586 [X] 2-8,11-17 * chapter 2.2 * [Y] 17
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DOI:   http://dx.doi.org/10.1007/s10853-011-5561-1
 [A]  - -, "Fazovaya diagramma sistemy Au-Ge", (20111108), URL: https://web.archive.org/web/20111108224601/http://www.himikatus.ru/art/phase-diagr1/Au-Ge.php, (20160826), XP055297887 [A] 2-9,11-17 * the whole document *
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DOI:   http://dx.doi.org/10.1007/BF02651369
by applicantUS3025439
 US3200490
 US5038996
 US5623127
 US6854636
 US7628309
 US2013152990
    - A. A. AHKUBEKOV; S. N. AHKUBEKOVA; O. L. ENALDIEVA; T. A. ORKVASOV; V. A. SOZAEV, "The influence of small impurity additions and direct electric current on the kinetics of contact melting in metals", JOURNAL OF PHYSICS: CONFERENCE SERIES,, (2008), vol. 98, no. 062031
    - T. A. TOLLEFSEN; A. LARSSON; O. M. LOVVIK; K.AASMUNDTVEIT, "Au-Sn SLID Bonding-Properties and Possibilities", METALLURGICAL AND MATERIALS TRANSACTIONS B, (201204), vol. 43, no. 2, doi:doi:10.1007/s11663-011-9609-z, pages 397 - 405, XP035031877

DOI:   http://dx.doi.org/10.1007/s11663-011-9609-z
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.