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EP3116022
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EP About this file: EP3116022
| EP3116022 - METHOD FOR PRODUCING AN INTEGRATED CIRCUIT DEVICE WITH ENHANCED MECHANICAL PROPERTIES [Right-click to bookmark this link] | Status | The application has been published Status updated on 09.12.2016 Database last updated on 31.08.2024 | Most recent event Tooltip | 17.10.2017 | New entry: Application deemed to be withdrawn: despatch of communication + time limit | Applicant(s) | For all designated states IMEC VZW Kapeldreef 75 3001 Leuven / BE | [2017/02] | Inventor(s) | 01 /
DE WOLF, Ingrid IMEC VZW, Patent department Kapeldreef 75 3001 Leuven / BE | 02 /
BÖMMELS, Jürgen IMEC VZW, Patent department Kapeldreef 75 3001 Leuven / BE | [2017/02] | Representative(s) | Patent Department IMEC IMEC vzw Patent Department Kapeldreef 75 3001 Leuven / BE | [2017/02] | Application number, filing date | 16175260.5 | 20.06.2016 | [2017/02] | Priority number, date | EP20150175863 | 08.07.2015 Original published format: EP 15175863 | [2017/02] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP3116022 | Date: | 11.01.2017 | Language: | EN | [2017/02] | Type: | A3 Search report | No.: | EP3116022 | Date: | 08.03.2017 | Language: | EN | [2017/10] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 02.02.2017 | Classification | IPC: | H01L23/532, H01L21/768 | [2017/02] | CPC: |
H01L21/76825 (EP,US);
H01L21/76802 (US);
H01L21/76826 (EP,US);
H01L21/76877 (US);
H01L23/53295 (EP,US);
H01L24/02 (US);
H01L2224/02372 (US)
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| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2017/02] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | MA | Not yet paid | MD | Not yet paid | Title | German: | VERFAHREN ZUR HERSTELLUNG EINER INTEGRIERTEN SCHALTVORRICHTUNG MIT VERBESSERTEN MECHANISCHEN EIGENSCHAFTEN | [2017/02] | English: | METHOD FOR PRODUCING AN INTEGRATED CIRCUIT DEVICE WITH ENHANCED MECHANICAL PROPERTIES | [2017/02] | French: | PROCÉDÉ DE FABRICATION D'UN DISPOSITIF À CIRCUIT INTÉGRÉ PRÉSENTANT DES PROPRIÉTÉS MÉCANIQUES AMÉLIORÉES | [2017/02] | Examination procedure | 18.10.2017 | Despatch of communication that the application is deemed to be withdrawn, reason: filing fee / search fee not paid in time | Divisional application(s) | EP17189518.8 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XAI]US2008122121 (SUDA SHOICHI [JP], et al) [X] 1,2,4,5,10,14,15 * paragraphs [0033] - [0041] - [0 57] , [0 84] - [0106] - [ 138] - [0142] - [ 146] - [0150]; figures 1-16 * [A] 12 [I] 3,6; | [XAI]US2007032094 (TSUI TING Y [US], et al) [X] 1-6,11,13,15 * paragraphs [0007] , [0 17] - [0032]; figures 1, 2 * [A] 12 [I] 7,10 | by applicant | - G. STAN ET AL., "Mechanical property changes in porous low-k dielectric thin films during processing", APPLIED PHYSICS LETTERS, (2014), vol. 105, page 152906 |