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Extract from the Register of European Patents

EP About this file: EP3151272

EP3151272 - SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  19.07.2019
Database last updated on 03.09.2024
FormerRequest for examination was made
Status updated on  13.10.2017
FormerThe application has been published
Status updated on  03.03.2017
Most recent event   Tooltip19.07.2019Withdrawal of applicationpublished on 21.08.2019  [2019/34]
Applicant(s)For all designated states
Renesas Electronics Corporation
2-24, Toyosu 3-chome
Koutou-ku
Tokyo 135-0061 / JP
[2017/14]
Inventor(s)01 / TONEGAWA, Takashi
c/o Renesas Semiconductor Manufacturing Co., Ltd.
751, Horiguchi, Hitachinaka-shi
Ibaraki, 312-8504 / JP
 [2017/14]
Representative(s)Betten & Resch
Patent- und Rechtsanwälte PartGmbB
Maximiliansplatz 14
80333 München / DE
[2017/14]
Application number, filing date16189368.018.09.2016
[2017/14]
Priority number, dateJP2015019317230.09.2015         Original published format: JP 2015193172
[2017/14]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP3151272
Date:05.04.2017
Language:EN
[2017/14]
Search report(s)(Supplementary) European search report - dispatched on:EP27.02.2017
ClassificationIPC:H01L23/485, H01L21/3105, H01L23/528, H01L23/532
[2017/14]
CPC:
H01L23/5283 (EP,US); H01L21/76879 (KR); H01L24/02 (CN);
H01L21/02123 (KR); H01L21/02532 (KR); H01L21/31 (US);
H01L21/31056 (US); H01L21/311 (US); H01L21/31116 (EP,KR,US);
H01L21/44 (US); H01L21/76838 (KR); H01L21/76873 (KR);
H01L23/528 (US); H01L23/53295 (EP,US); H01L24/03 (EP,CN,US);
H01L24/05 (EP,CN,US); H01L24/08 (US); H01L24/48 (EP,US);
H01L24/85 (EP,US); H01L29/1095 (EP,US); H01L29/417 (EP,US);
H01L29/66348 (EP,US); H01L29/7397 (EP,US); H01L29/7802 (US);
H01L29/7813 (EP,US); H01L2224/02125 (CN); H01L2224/02126 (EP,US);
H01L2224/02145 (EP,US); H01L2224/0215 (EP,US); H01L2224/02206 (US);
H01L2224/02215 (US); H01L2224/03013 (CN); H01L2224/03019 (CN);
H01L2224/031 (EP,US); H01L2224/0345 (EP,US); H01L2224/03464 (EP,US);
H01L2224/03522 (EP,US); H01L2224/04 (CN); H01L2224/04034 (EP,US);
H01L2224/04042 (EP,CN,US); H01L2224/05007 (EP,US); H01L2224/05017 (EP,US);
H01L2224/05023 (EP,US); H01L2224/05025 (US); H01L2224/05027 (EP,US);
H01L2224/05083 (EP,US); H01L2224/05124 (EP,US); H01L2224/05155 (EP,US);
H01L2224/05164 (EP,US); H01L2224/05558 (EP,US); H01L2224/05562 (US);
H01L2224/05568 (EP,US); H01L2224/05582 (US); H01L2224/05644 (EP,US);
H01L2224/05655 (US); H01L2224/05664 (US); H01L2224/29339 (EP,US);
H01L2224/32245 (EP,US); H01L2224/37147 (EP,US); H01L2224/45147 (EP,US);
H01L2224/48247 (EP,US); H01L2224/48463 (EP,US); H01L2224/48799 (US);
H01L2224/48844 (EP,US); H01L2224/73265 (EP,US); H01L2224/8385 (EP,US);
H01L2224/84801 (EP,US); H01L2224/85045 (EP,US); H01L2224/85181 (EP,US);
H01L2224/85203 (EP,US); H01L23/3171 (EP,US); H01L23/481 (US);
H01L23/4827 (US); H01L23/522 (US); H01L23/53223 (EP,US);
H01L24/29 (EP,US); H01L24/32 (EP,US); H01L24/37 (EP,US);
H01L24/45 (EP,US); H01L24/73 (EP,US); H01L24/84 (EP,US);
H01L2924/00014 (EP); H01L2924/05042 (US); H01L2924/0509 (US);
H01L2924/05442 (US); H01L2924/07025 (US); H01L2924/1203 (EP,US);
H01L2924/1206 (US); H01L2924/13055 (EP,US); H01L2924/1306 (EP,US);
H01L2924/13091 (EP,US); H01L2924/15747 (US); H01L2924/35121 (EP,US) (-)
C-Set:
H01L2224/0215, H01L2924/05042 (US,EP);
H01L2224/0215, H01L2924/05442 (US,EP);
H01L2224/0215, H01L2924/059 (US,EP);
H01L2224/031, H01L2924/0103 (EP,US);
H01L2224/0345, H01L2924/00014 (US,EP);
H01L2224/03464, H01L2924/00014 (EP,US);
H01L2224/03522, H01L2924/0103 (US,EP);
H01L2224/05083, H01L2224/05644, H01L2224/05164, H01L2224/05155, H01L2224/05124 (US,EP);
H01L2224/05124, H01L2924/013, H01L2924/00013 (US,EP);
H01L2224/05124, H01L2924/013, H01L2924/01014 (US,EP);
H01L2224/05124, H01L2924/013, H01L2924/01014, H01L2924/01029 (US,EP);
H01L2224/05124, H01L2924/013, H01L2924/01029 (US,EP);
H01L2224/05155, H01L2924/00014 (US,EP);
H01L2224/05164, H01L2924/00014 (US,EP);
H01L2224/05644, H01L2924/00014 (US,EP);
H01L2224/29339, H01L2924/00014 (US,EP);
H01L2224/37147, H01L2924/00014 (US,EP);
H01L2224/45147, H01L2924/00014 (EP,US);
H01L2224/48844, H01L2924/00014 (EP,US);
H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00 (US,EP);
H01L2224/84801, H01L2924/00014 (US,EP);
H01L2224/85045, H01L2924/00014 (EP,US);
H01L2224/85181, H01L2924/00014 (US,EP);
H01L2224/85203, H01L2924/00014 (EP,US);
H01L2924/00014, H01L2224/73221 (EP)
(-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2017/46]
Former [2017/14]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TitleGerman:HALBLEITERBAUELEMENT UND VERFAHREN ZUR HERSTELLUNG DES HALBLEITERBAUELEMENTS[2017/14]
English:SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE[2017/14]
French:DISPOSITIF À SEMI-CONDUCTEURS ET PROCÉDÉ DE FABRICATION ASSOCIÉ[2017/14]
Examination procedure18.09.2016Date on which the examining division has become responsible
04.10.2017Amendment by applicant (claims and/or description)
05.10.2017Examination requested  [2017/46]
17.07.2019Application withdrawn by applicant  [2019/34]
Fees paidRenewal fee
01.10.2018Renewal fee patent year 03
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Documents cited:Search[Y]JPS59232424  (HITACHI LTD) [Y] 6,8,11,12,14 * cf. text disclosed in conjunction with figures 4-7;; figures 4-7 * * abstract *;
 [Y]WO2011100021  (FREESCALE SEMICONDUCTOR INC [US], et al) [Y] 4,13 * paragraphs [0008] - [0012]; figures 4-6 *;
 [A]US2012032338  (KOMORI KENJI [JP]) [A] 1 * paragraphs [0005] , [0006]; figures 1a,1b *;
 [IY]JP2012146720  (RENESAS ELECTRONICS CORP) [I] 1-3,5,7,10,13 * paragraphs [0052] , [0053] , [0057] , [0089] - [0097] - [0125]; figures 1,6,8,16-19, 29 * [Y] 4,6,8,11-14;
 [XP]US2015364420  (LIN LING MEI [TW], et al) [XP] 1,5,7,10-12,14* paragraphs [0013] , [0 26] , [0027] , [0 44] - [0057]; figures 1,2,3,4,7A-7I, 8A,8B *
by applicantJP2003338516
 JP2011204886
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.