EP3151272 - SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 19.07.2019 Database last updated on 03.09.2024 | |
Former | Request for examination was made Status updated on 13.10.2017 | ||
Former | The application has been published Status updated on 03.03.2017 | Most recent event Tooltip | 19.07.2019 | Withdrawal of application | published on 21.08.2019 [2019/34] | Applicant(s) | For all designated states Renesas Electronics Corporation 2-24, Toyosu 3-chome Koutou-ku Tokyo 135-0061 / JP | [2017/14] | Inventor(s) | 01 /
TONEGAWA, Takashi c/o Renesas Semiconductor Manufacturing Co., Ltd. 751, Horiguchi, Hitachinaka-shi Ibaraki, 312-8504 / JP | [2017/14] | Representative(s) | Betten & Resch Patent- und Rechtsanwälte PartGmbB Maximiliansplatz 14 80333 München / DE | [2017/14] | Application number, filing date | 16189368.0 | 18.09.2016 | [2017/14] | Priority number, date | JP20150193172 | 30.09.2015 Original published format: JP 2015193172 | [2017/14] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP3151272 | Date: | 05.04.2017 | Language: | EN | [2017/14] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 27.02.2017 | Classification | IPC: | H01L23/485, H01L21/3105, H01L23/528, H01L23/532 | [2017/14] | CPC: |
H01L23/5283 (EP,US);
H01L21/76879 (KR);
H01L24/02 (CN);
H01L21/02123 (KR);
H01L21/02532 (KR);
H01L21/31 (US);
H01L21/31056 (US);
H01L21/311 (US);
H01L21/31116 (EP,KR,US);
H01L21/44 (US);
H01L21/76838 (KR);
H01L21/76873 (KR);
H01L23/528 (US);
H01L23/53295 (EP,US);
H01L24/03 (EP,CN,US);
H01L24/05 (EP,CN,US);
H01L24/08 (US);
H01L24/48 (EP,US);
H01L24/85 (EP,US);
H01L29/1095 (EP,US);
H01L29/417 (EP,US);
H01L29/66348 (EP,US);
H01L29/7397 (EP,US);
H01L29/7802 (US);
H01L29/7813 (EP,US);
H01L2224/02125 (CN);
H01L2224/02126 (EP,US);
H01L2224/02145 (EP,US);
H01L2224/0215 (EP,US);
H01L2224/02206 (US);
H01L2224/02215 (US);
H01L2224/03013 (CN);
H01L2224/03019 (CN);
H01L2224/031 (EP,US);
H01L2224/0345 (EP,US);
H01L2224/03464 (EP,US);
H01L2224/03522 (EP,US);
H01L2224/04 (CN);
H01L2224/04034 (EP,US);
H01L2224/04042 (EP,CN,US);
H01L2224/05007 (EP,US);
H01L2224/05017 (EP,US);
H01L2224/05023 (EP,US);
H01L2224/05025 (US);
H01L2224/05027 (EP,US);
H01L2224/05083 (EP,US);
H01L2224/05124 (EP,US);
H01L2224/05155 (EP,US);
H01L2224/05164 (EP,US);
H01L2224/05558 (EP,US);
H01L2224/05562 (US);
H01L2224/05568 (EP,US);
H01L2224/05582 (US);
H01L2224/05644 (EP,US);
H01L2224/05655 (US);
H01L2224/05664 (US);
H01L2224/29339 (EP,US);
H01L2224/32245 (EP,US);
H01L2224/37147 (EP,US);
H01L2224/45147 (EP,US);
H01L2224/48247 (EP,US);
H01L2224/48463 (EP,US);
H01L2224/48799 (US);
H01L2224/48844 (EP,US);
H01L2224/73265 (EP,US);
H01L2224/8385 (EP,US);
H01L2224/84801 (EP,US);
H01L2224/85045 (EP,US);
H01L2224/85181 (EP,US);
H01L2224/85203 (EP,US);
H01L23/3171 (EP,US);
H01L23/481 (US);
H01L23/4827 (US);
H01L23/522 (US);
H01L23/53223 (EP,US);
H01L24/29 (EP,US);
H01L24/32 (EP,US);
H01L24/37 (EP,US);
H01L24/45 (EP,US);
H01L24/73 (EP,US);
H01L24/84 (EP,US);
H01L2924/00014 (EP);
H01L2924/05042 (US);
H01L2924/0509 (US);
H01L2924/05442 (US);
H01L2924/07025 (US);
H01L2924/1203 (EP,US);
H01L2924/1206 (US);
H01L2924/13055 (EP,US);
H01L2924/1306 (EP,US);
| C-Set: |
H01L2224/0215, H01L2924/05042 (US,EP);
H01L2224/0215, H01L2924/05442 (US,EP);
H01L2224/0215, H01L2924/059 (US,EP);
H01L2224/031, H01L2924/0103 (EP,US);
H01L2224/0345, H01L2924/00014 (US,EP);
H01L2224/03464, H01L2924/00014 (EP,US);
H01L2224/03522, H01L2924/0103 (US,EP);
H01L2224/05083, H01L2224/05644, H01L2224/05164, H01L2224/05155, H01L2224/05124 (US,EP);
H01L2224/05124, H01L2924/013, H01L2924/00013 (US,EP);
H01L2224/05124, H01L2924/013, H01L2924/01014 (US,EP);
H01L2224/05124, H01L2924/013, H01L2924/01014, H01L2924/01029 (US,EP);
H01L2224/05124, H01L2924/013, H01L2924/01029 (US,EP);
H01L2224/05155, H01L2924/00014 (US,EP);
H01L2224/05164, H01L2924/00014 (US,EP);
H01L2224/05644, H01L2924/00014 (US,EP);
H01L2224/29339, H01L2924/00014 (US,EP);
H01L2224/37147, H01L2924/00014 (US,EP);
H01L2224/45147, H01L2924/00014 (EP,US);
H01L2224/48844, H01L2924/00014 (EP,US);
H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00 (US,EP);
H01L2224/84801, H01L2924/00014 (US,EP);
H01L2224/85045, H01L2924/00014 (EP,US);
H01L2224/85181, H01L2924/00014 (US,EP);
H01L2224/85203, H01L2924/00014 (EP,US); | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2017/46] |
Former [2017/14] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | MA | Not yet paid | MD | Not yet paid | Title | German: | HALBLEITERBAUELEMENT UND VERFAHREN ZUR HERSTELLUNG DES HALBLEITERBAUELEMENTS | [2017/14] | English: | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | [2017/14] | French: | DISPOSITIF À SEMI-CONDUCTEURS ET PROCÉDÉ DE FABRICATION ASSOCIÉ | [2017/14] | Examination procedure | 18.09.2016 | Date on which the examining division has become responsible | 04.10.2017 | Amendment by applicant (claims and/or description) | 05.10.2017 | Examination requested [2017/46] | 17.07.2019 | Application withdrawn by applicant [2019/34] | Fees paid | Renewal fee | 01.10.2018 | Renewal fee patent year 03 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]JPS59232424 (HITACHI LTD) [Y] 6,8,11,12,14 * cf. text disclosed in conjunction with figures 4-7;; figures 4-7 * * abstract *; | [Y]WO2011100021 (FREESCALE SEMICONDUCTOR INC [US], et al) [Y] 4,13 * paragraphs [0008] - [0012]; figures 4-6 *; | [A]US2012032338 (KOMORI KENJI [JP]) [A] 1 * paragraphs [0005] , [0006]; figures 1a,1b *; | [IY]JP2012146720 (RENESAS ELECTRONICS CORP) [I] 1-3,5,7,10,13 * paragraphs [0052] , [0053] , [0057] , [0089] - [0097] - [0125]; figures 1,6,8,16-19, 29 * [Y] 4,6,8,11-14; | [XP]US2015364420 (LIN LING MEI [TW], et al) [XP] 1,5,7,10-12,14* paragraphs [0013] , [0 26] , [0027] , [0 44] - [0057]; figures 1,2,3,4,7A-7I, 8A,8B * | by applicant | JP2003338516 | JP2011204886 |