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EP3185280
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EP About this file: EP3185280
| EP3185280 - SEMICONDUCTOR DEVICE AND RELATED MANUFACTURING METHOD [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 28.08.2020 Database last updated on 26.04.2025 | |
| Former | Examination is in progress Status updated on 08.05.2020 | ||
| Former | Request for examination was made Status updated on 08.09.2017 | ||
| Former | The application has been published Status updated on 26.05.2017 | Most recent event Tooltip | 28.08.2020 | Withdrawal of application | published on 30.09.2020 [2020/40] | Applicant(s) | For all designated states Semiconductor Manufacturing International (Beijing) Corporation No. 18, Wenchang Road Beijing Economic and Technological Development Area, Daxing Area Beijing 100176 / CN | For all designated states Semiconductor Manufacturing International (Shanghai) Corporation No. 18, Zhangjiang Road Pudong New Area Shanghai 201203 / CN | [2018/45] |
| Former [2017/31] | For all designated states Semiconductor Manufacturing International Corporation (Beijing) No. 18, Wenchang Road Beijing Economic and Technological Development Area, Daxing Area Beijing 100176 / CN | ||
| For all designated states Semiconductor Manufacturing International Corporation (Shanghai) No. 18, Zhangjiang Road Pudong New Area Shanghai 201203 / CN | |||
| Former [2017/26] | For all designated states Semiconductor Manufacturing International Corporation (Beijing) No. 18, Wenchang Road Economic and Technological Development Area, Daxing Area Beijing 1000176 / CN | ||
| For all designated states Semiconductor Manufacturing International Corporation (Shanghai) No. 18, Zhangjiang Road Pudong New Area Shanghai 201203 / CN | Inventor(s) | 01 /
ZHANG, Yiying c/o Semiconductor Manufacturing International Corporation (Shanghai) Mr. Wentian ZHANG No. 18, Zhangjiang Road, Pudong New Area Shanghai 201203 / CN | 02 /
ZHENG, Erhu c/o Semiconductor Manufacturing International Corporation (Shanghai) Mr. Wentian ZHANG No. 18, Zhangjiang Road, Pudong New Area Shanghai 201203 / CN | [2017/26] | Representative(s) | Klunker IP Patentanwälte PartG mbB Destouchesstraße 68 80796 München / DE | [2017/26] | Application number, filing date | 16204233.7 | 15.12.2016 | [2017/26] | Priority number, date | CN201510968184 | 22.12.2015 Original published format: CN201510968184 | [2017/26] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP3185280 | Date: | 28.06.2017 | Language: | EN | [2017/26] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 12.05.2017 | Classification | IPC: | H01L21/28, H01L27/11521 | [2017/26] | CPC: |
H10D64/035 (EP,US);
H10B41/00 (CN);
H10B41/35 (US);
H01L21/3065 (US);
H01L21/3085 (US);
H10B41/30 (EP,US);
H10D30/0411 (CN,US);
H10D30/689 (US);
H10D64/018 (US);
H10D64/021 (CN)
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| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2017/41] |
| Former [2017/26] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | MA | Not yet paid | MD | Not yet paid | Title | German: | HALBLEITERBAUELEMENT UND ZUGEHÖRIGES HERSTELLUNGSVERFAHREN | [2017/26] | English: | SEMICONDUCTOR DEVICE AND RELATED MANUFACTURING METHOD | [2017/26] | French: | DISPOSITIF À SEMI-CONDUCTEURS ET SON PROCÉDÉ DE FABRICATION | [2017/26] | Examination procedure | 15.12.2016 | Date on which the examining division has become responsible | 31.08.2017 | Amendment by applicant (claims and/or description) | 31.08.2017 | Examination requested [2017/41] | 12.05.2020 | Despatch of a communication from the examining division (Time limit: M04) | 24.08.2020 | Application withdrawn by applicant [2020/40] | Fees paid | Renewal fee | 19.12.2018 | Renewal fee patent year 03 | 23.12.2019 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XAYI]JP2006324274 (RENESAS TECH CORP); | [A]US2011006355 (SHEN MING-HUI [TW], et al); | [Y]US2014319594 (MATSUDA YUYA [JP]); | [A]US2015270273 (MA HUILIN [CN], et al) |