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Extract from the Register of European Patents

EP About this file: EP3268987

EP3268987 - APPARATUS AND METHOD FOR CHUCKING WARPED WAFERS [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  16.09.2022
Database last updated on 24.08.2024
FormerThe patent has been granted
Status updated on  08.10.2021
FormerGrant of patent is intended
Status updated on  07.06.2021
FormerRequest for examination was made
Status updated on  15.12.2017
FormerThe international publication has been made
Status updated on  03.10.2017
Most recent event   Tooltip14.06.2024Lapse of the patent in a contracting state
New state(s): TR
published on 17.07.2024  [2024/29]
Applicant(s)For all designated states
Kla-Tencor Corporation
Legal Department
One Technology Drive
Milpitas, California 95035 / US
[2018/03]
Inventor(s)01 / SUBRAHMANYAN, Pradeep
22117 Wallace Drive
Cupertino, California 95014 / US
02 / HUANG, Luping
5586 N. Dublin Ranch Drive
Dublin, California 94568 / US
03 / POHLHAMMER, Christopher
616 Sunflower Court
San Ramon, California 94582 / US
 [2018/03]
Representative(s)FRKelly
Waterways House
Grand Canal Quay
Dublin D02 PD39 / IE
[N/P]
Former [2018/03]FRKelly
27 Clyde Road
Dublin D04 F838 / IE
Application number, filing date16762672.011.03.2016
[2018/03]
WO2016US22188
Priority number, dateUS201562132473P12.03.2015         Original published format: US 201562132473 P
US20161506543009.03.2016         Original published format: US201615065430
[2018/03]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2016145404
Date:15.09.2016
Language:EN
[2016/37]
Type: A1 Application with search report 
No.:EP3268987
Date:17.01.2018
Language:EN
The application published by WIPO in one of the EPO official languages on 15.09.2016 takes the place of the publication of the European patent application.
[2018/03]
Type: B1 Patent specification 
No.:EP3268987
Date:10.11.2021
Language:EN
[2021/45]
Search report(s)International search report - published on:KR15.09.2016
(Supplementary) European search report - dispatched on:EP20.09.2018
ClassificationIPC:H01L21/683, H01L21/687, H01L21/67
[2018/43]
CPC:
H01L21/6838 (EP,CN,KR,US); H01L21/67288 (EP,US); H01L21/68742 (KR)
Former IPC [2018/03]H01L21/683, H01L21/687
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2018/03]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TitleGerman:VORRICHTUNG UND VERFAHREN ZUM EINSPANNEN VERFORMTER WAFER[2018/03]
English:APPARATUS AND METHOD FOR CHUCKING WARPED WAFERS[2018/03]
French:APPAREIL ET PROCÉDÉ PERMETTANT DE SERRER DES PLAQUETTES GAUCHIES[2018/03]
Entry into regional phase03.10.2017National basic fee paid 
03.10.2017Search fee paid 
03.10.2017Designation fee(s) paid 
03.10.2017Examination fee paid 
Examination procedure03.10.2017Examination requested  [2018/03]
03.10.2017Date on which the examining division has become responsible
17.04.2019Amendment by applicant (claims and/or description)
08.06.2021Communication of intention to grant the patent
30.09.2021Fee for grant paid
30.09.2021Fee for publishing/printing paid
30.09.2021Receipt of the translation of the claim(s)
Opposition(s)11.08.2022No opposition filed within time limit [2022/42]
Fees paidRenewal fee
27.03.2018Renewal fee patent year 03
27.03.2019Renewal fee patent year 04
27.03.2020Renewal fee patent year 05
29.03.2021Renewal fee patent year 06
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See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU11.03.2016
AL10.11.2021
AT10.11.2021
CY10.11.2021
CZ10.11.2021
DK10.11.2021
EE10.11.2021
ES10.11.2021
FI10.11.2021
HR10.11.2021
IT10.11.2021
LT10.11.2021
LV10.11.2021
MC10.11.2021
MK10.11.2021
PL10.11.2021
RO10.11.2021
RS10.11.2021
SE10.11.2021
SI10.11.2021
SK10.11.2021
SM10.11.2021
TR10.11.2021
BG10.02.2022
NO10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
GB11.03.2022
IE11.03.2022
LU11.03.2022
BE31.03.2022
CH31.03.2022
FR31.03.2022
LI31.03.2022
[2024/29]
Former [2024/22]HU11.03.2016
AL10.11.2021
AT10.11.2021
CY10.11.2021
CZ10.11.2021
DK10.11.2021
EE10.11.2021
ES10.11.2021
FI10.11.2021
HR10.11.2021
IT10.11.2021
LT10.11.2021
LV10.11.2021
MC10.11.2021
MK10.11.2021
PL10.11.2021
RO10.11.2021
RS10.11.2021
SE10.11.2021
SI10.11.2021
SK10.11.2021
SM10.11.2021
BG10.02.2022
NO10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
GB11.03.2022
IE11.03.2022
LU11.03.2022
BE31.03.2022
CH31.03.2022
FR31.03.2022
LI31.03.2022
Former [2024/20]HU11.03.2016
AL10.11.2021
AT10.11.2021
CY10.11.2021
CZ10.11.2021
DK10.11.2021
EE10.11.2021
ES10.11.2021
FI10.11.2021
HR10.11.2021
IT10.11.2021
LT10.11.2021
LV10.11.2021
MC10.11.2021
PL10.11.2021
RO10.11.2021
RS10.11.2021
SE10.11.2021
SI10.11.2021
SK10.11.2021
SM10.11.2021
BG10.02.2022
NO10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
GB11.03.2022
IE11.03.2022
LU11.03.2022
BE31.03.2022
CH31.03.2022
FR31.03.2022
LI31.03.2022
Former [2024/18]HU11.03.2016
AL10.11.2021
AT10.11.2021
CZ10.11.2021
DK10.11.2021
EE10.11.2021
ES10.11.2021
FI10.11.2021
HR10.11.2021
IT10.11.2021
LT10.11.2021
LV10.11.2021
MC10.11.2021
PL10.11.2021
RO10.11.2021
RS10.11.2021
SE10.11.2021
SI10.11.2021
SK10.11.2021
SM10.11.2021
BG10.02.2022
NO10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
GB11.03.2022
IE11.03.2022
LU11.03.2022
BE31.03.2022
CH31.03.2022
FR31.03.2022
LI31.03.2022
Former [2023/27]AL10.11.2021
AT10.11.2021
CZ10.11.2021
DK10.11.2021
EE10.11.2021
ES10.11.2021
FI10.11.2021
HR10.11.2021
IT10.11.2021
LT10.11.2021
LV10.11.2021
MC10.11.2021
PL10.11.2021
RO10.11.2021
RS10.11.2021
SE10.11.2021
SI10.11.2021
SK10.11.2021
SM10.11.2021
BG10.02.2022
NO10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
GB11.03.2022
IE11.03.2022
LU11.03.2022
BE31.03.2022
CH31.03.2022
FR31.03.2022
LI31.03.2022
Former [2023/10]AL10.11.2021
AT10.11.2021
CZ10.11.2021
DK10.11.2021
EE10.11.2021
ES10.11.2021
FI10.11.2021
HR10.11.2021
LT10.11.2021
LV10.11.2021
MC10.11.2021
PL10.11.2021
RO10.11.2021
RS10.11.2021
SE10.11.2021
SI10.11.2021
SK10.11.2021
SM10.11.2021
BG10.02.2022
NO10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
GB11.03.2022
IE11.03.2022
LU11.03.2022
BE31.03.2022
CH31.03.2022
FR31.03.2022
LI31.03.2022
Former [2023/09]AL10.11.2021
AT10.11.2021
CZ10.11.2021
DK10.11.2021
EE10.11.2021
ES10.11.2021
FI10.11.2021
HR10.11.2021
LT10.11.2021
LV10.11.2021
MC10.11.2021
PL10.11.2021
RO10.11.2021
RS10.11.2021
SE10.11.2021
SI10.11.2021
SK10.11.2021
SM10.11.2021
BG10.02.2022
NO10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
GB11.03.2022
IE11.03.2022
LU11.03.2022
CH31.03.2022
FR31.03.2022
LI31.03.2022
Former [2023/08]AL10.11.2021
AT10.11.2021
CZ10.11.2021
DK10.11.2021
EE10.11.2021
ES10.11.2021
FI10.11.2021
HR10.11.2021
LT10.11.2021
LV10.11.2021
MC10.11.2021
PL10.11.2021
RO10.11.2021
RS10.11.2021
SE10.11.2021
SI10.11.2021
SK10.11.2021
SM10.11.2021
BG10.02.2022
NO10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
GB11.03.2022
IE11.03.2022
LU11.03.2022
FR31.03.2022
Former [2023/06]AL10.11.2021
AT10.11.2021
CZ10.11.2021
DK10.11.2021
EE10.11.2021
ES10.11.2021
FI10.11.2021
HR10.11.2021
LT10.11.2021
LV10.11.2021
MC10.11.2021
PL10.11.2021
RO10.11.2021
RS10.11.2021
SE10.11.2021
SI10.11.2021
SK10.11.2021
SM10.11.2021
BG10.02.2022
NO10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
FR31.03.2022
Former [2023/01]AL10.11.2021
AT10.11.2021
CZ10.11.2021
DK10.11.2021
EE10.11.2021
ES10.11.2021
FI10.11.2021
HR10.11.2021
LT10.11.2021
LV10.11.2021
MC10.11.2021
PL10.11.2021
RO10.11.2021
RS10.11.2021
SE10.11.2021
SI10.11.2021
SK10.11.2021
SM10.11.2021
BG10.02.2022
NO10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
Former [2022/49]AL10.11.2021
AT10.11.2021
CZ10.11.2021
DK10.11.2021
EE10.11.2021
ES10.11.2021
FI10.11.2021
HR10.11.2021
LT10.11.2021
LV10.11.2021
MC10.11.2021
PL10.11.2021
RO10.11.2021
RS10.11.2021
SE10.11.2021
SK10.11.2021
SM10.11.2021
BG10.02.2022
NO10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
Former [2022/47]AT10.11.2021
CZ10.11.2021
DK10.11.2021
EE10.11.2021
ES10.11.2021
FI10.11.2021
HR10.11.2021
LT10.11.2021
LV10.11.2021
MC10.11.2021
PL10.11.2021
RO10.11.2021
RS10.11.2021
SE10.11.2021
SK10.11.2021
SM10.11.2021
BG10.02.2022
NO10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
Former [2022/35]AT10.11.2021
CZ10.11.2021
DK10.11.2021
EE10.11.2021
ES10.11.2021
FI10.11.2021
HR10.11.2021
LT10.11.2021
LV10.11.2021
PL10.11.2021
RO10.11.2021
RS10.11.2021
SE10.11.2021
SK10.11.2021
SM10.11.2021
BG10.02.2022
NO10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
Former [2022/34]AT10.11.2021
EE10.11.2021
ES10.11.2021
FI10.11.2021
HR10.11.2021
LT10.11.2021
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PL10.11.2021
RO10.11.2021
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SE10.11.2021
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BG10.02.2022
NO10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
Former [2022/33]AT10.11.2021
ES10.11.2021
FI10.11.2021
HR10.11.2021
LT10.11.2021
LV10.11.2021
PL10.11.2021
RS10.11.2021
SE10.11.2021
SM10.11.2021
BG10.02.2022
NO10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
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FI10.11.2021
HR10.11.2021
LT10.11.2021
LV10.11.2021
PL10.11.2021
RS10.11.2021
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BG10.02.2022
NO10.02.2022
GR11.02.2022
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PT10.03.2022
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LV10.11.2021
PL10.11.2021
RS10.11.2021
SE10.11.2021
BG10.02.2022
GR11.02.2022
IS10.03.2022
PT10.03.2022
Former [2022/23]AT10.11.2021
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FI10.11.2021
HR10.11.2021
LT10.11.2021
LV10.11.2021
PL10.11.2021
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BG10.02.2022
PT10.03.2022
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FI10.11.2021
LT10.11.2021
RS10.11.2021
BG10.02.2022
Former [2022/21]AT10.11.2021
RS10.11.2021
BG10.02.2022
Former [2022/19]BG10.02.2022
Documents cited:Search[XA]US2005011460  (TANIGUCHI YOSHIHISA [JP]) [X] 1-3,9 * abstract * * paragraph [0098] * [A] 10;
 [XY]EP1685930  (MITSUBOSHI DIAMOND IND CO LTD [JP]) [X] 1,2,7-14 * paragraphs [0068] , [0077] , [0079]; figure 14 * [Y] 4-6;
 [XA]US7292427  (MURDOCH STEVEN [US], et al) [X] 1,2,9 * abstract * [A] 10;
 [XAY]DE102011001879  (JENOPTIK AUTOMATISIERUNGSTECH [DE]) [X] 1-3,9 * abstract * [A] 10 [Y] 4-6;
 [XA]JP2013243203  (LINTEC CORP) [X] 1-3,9 * abstract * [A] 10;
 [XA]WO2014101795  (SHANGHAI MICROELECTRONICS EQUI [CN]) [X] 1,2,9 * abstract *[A] 10
International search[A]JPH056931  (HITACHI LTD, et al) [A] 1-15 * See abstract; paragraphs [0013]-[0014], [0016]-[0017]; and figures 1-2C. *;
 [Y]KR101018909B  (TOKYO ELECTRON LTD.) [Y] 1-15 * See abstract; paragraphs [0080]-[0085], [0087]-[0089]; and figures 3-7. *;
 [A]WO2012004002  (CENTROTHERM THERMAL SOLUTIONS GMBH & CO KG [DE], et al) [A] 1-15* See abstract; page 12, line 17 - page 13, line 31; and figures 3-9. *;
 [Y]US2012311848  (PARK YONMOOK [KR]) [Y] 6 * See abstract; paragraphs [0032]-[0035]; and figures 1-2. *;
 [Y]CN103904011  (SHANGHAI MICROELECTRONICS EQUI) [Y] 1-15 * See abstract; paragraphs [0031]-[0033]; claim 10; and figures 1-7. *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.